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33results about How to "Ease bending" patented technology

Graded buffering high-shock-resistance bending-resistance pipe-in-pipe type guide pipe and fuel assembly

The invention belongs to the technical field of nuclear fuel assemblies of nuclear power stations, and particularly relates to a graded buffering high-shock-resistance bending-resistance pipe-in-pipe type guide pipe and a fuel assembly. The guide pipe is composed of an outer pipe, an inner pipe and an end plug, the inner pipe is sleeved with the outer pipe, the bottom end of the inner pipe and the bottom end of the outer pipe are fixedly connected with the end plug, overflow holes are formed in the outer pipe and located at the upward position of the upper end of the inner pipe, and a plurality of bypass flow holes are formed in the position, close to the bottom, of the outer pipe in the radial direction. A plurality of buffer holes are formed in the inner pipe in the radial direction; the inner pipe is connected with the outer pipe through a plurality of connecting parts in the length direction. The overflow hole is formed in the outer pipe and located at the upward position of the upper end of the inner pipe, so that water in the guide pipe rapidly overflows when rod falling begins, and rapid rod falling is achieved; a plurality of drain holes formed in the inner pipe in the radial direction are matched with drain holes in the bottom of the end plug to achieve hydraulic buffering; crevice corrosion is relieved through an outer pipe bypass flow hole; the equivalent stiffness and the bearing capacity are improved through the multiple connecting parts, and the shock resistance and the bending resistance under high fuel consumption of the fuel assembly are improved.
Owner:NUCLEAR POWER INSTITUTE OF CHINA

A high-voltage fast soft recovery diode and its preparation method

The invention relates to a high-voltage rapid-soft-recovery diode. The high-voltage rapid-soft-recovery diode comprises an active area and a terminal area. A p buffering layer, a p+ anode layer and an anode aluminum electrode are upwards arranged on the upper surface of an n-substrate layer of the active area in sequence. An active n buffering layer and a cathode aluminum electrode layer are downwards arranged in sequence with the lower surface of the n-substrate layer as the base. The high-voltage rapid-soft-recovery diode further comprises an active p+ adjusting area and two n+ cathode areas, wherein the active p+ adjusting area and the two n+ cathode areas are arranged between the active n buffering layer and the cathode aluminum electrode layer, two n+ cathode areas are equal in width, and the active p+ adjusting area is arranged between the two n+ cathode areas. According to the high-voltage rapid-soft-recovery diode, trenches are adopted by the upper surface of the terminal portion, a high-concentration area on the surface of a p-type field limiting ring is eliminated selectively, bending of a pn junction can be relieved, the surface electrical field can be reduced, the terminal breakdown voltage can be increased easily, and the terminal size is small; current concentration at the junction position of the active area and the terminal area in a breakover period can be easily relieved through the p+ adjusting area located on the lower surface of the terminal portion, and reverse recovery softness factors can be increased easily.
Owner:RUNAU ELECTRONICS YANGZHOU MFG

Quantum well combined LED epitaxial structure with high luminous efficiency and its preparation method

A quantum well combination LED epitaxial structure with high luminous efficiency and a preparation method thereof, the epitaxial structure is a substrate, a buffer layer, a non-doped GaN layer, an n-type AlGaN layer, an n-type GaN layer, an active Layer, P-type AlGaN layer, P-type GaN layer and P-type InGaN contact layer, the active layer includes the lower multi-quantum well structure, constant temperature multi-quantum well structure and upper multi-quantum well structure, the lower multi-quantum well structure is InGaN potential well layer The constant temperature multi-quantum well structure is composed of the periodic superposition of the constant temperature InGaN potential well layer and the constant temperature GaN potential well layer, and the upper multi-quantum well structure is the periodic superposition of the InGaN potential well layer and the GaN barrier layer Composition; the preparation method is to prepare each layer sequentially from bottom to top in the reaction chamber of metal organic chemical vapor deposition equipment. The invention can effectively reduce the stress between the well-barrier interface, ease the bending of the energy band, and improve the injection efficiency of holes and electrons into the active region and the radiation recombination efficiency.
Owner:SHANDONG INSPUR HUAGUANG OPTOELECTRONICS

A light-emitting diode epitaxial wafer

The invention discloses a light-emitting diode epitaxial wafer and belongs to the technical field of semiconductors. The epitaxial wafer comprises a substrate, and a buffer layer, a non-impurity-doped GaN layer, an N-type layer, a multi-quantum well layer and a P-type layer which successively cover the substrate. The multi-quantum well layer is of a multi-period structure, and each period structure comprises a quantum well layer and a quantum barrier layer covering the quantum well layer. The quantum barrier layer closest to the P-type layer is of a superlattice structure. The superlattice structure comprises a plurality of AlxGal-xN sub-layers and GaN sub-layers which grow in an alternating manner, wherein x is larger than zero and less than 1, and the components of Al in the AlxGal-xN sub-layers gradually changes with the growth sequence. According to the invention, the quantum barrier layer, closest to the P-type layer, in the multi-quantum well layer of the epitaxial wafer is set as the superlattice structure, electronic overflow is effectively prevented on one hand, and on the other hand, the cavity injection rate is increased, so that the internal quantum efficiency of the epitaxial wafer is further increased, and the light-emitting efficiency of the light-emitting diode is improved.
Owner:HC SEMITEK SUZHOU

Bionic air spring system

The invention discloses a bionic air spring system which comprises a passive vibration reduction component, a variable-rigidity variable-damping component, an anti-torsion vibration component, an aperture regulating mechanism and a bearing platform. The passive vibration reduction component is mounted on an environmental foundation; the variable-rigidity variable-damping component is arranged on the upper portion of the passive vibration reduction component; the anti-torsion vibration component is disposed on the periphery of the variable-rigidity variable-damping component; the lower end of the anti-torsion vibration component is fixed into the passive vibration reduction component, the bearing platform is sleeved at the upper end of the anti-torsion vibration component, and the upper end of the variable-rigidity variable-damping component is in contact with the lower surface of the bearing platform. By regulating a lead-screw transmission mechanism, aperture openness of damping holes is regulated, flow rate and velocity of fluid between a main air chamber and an auxiliary chamber are changed, and the rigidity value and the damping value of the air spring system are quantitative and adjustable. Meanwhile, three aerostatic bearings are uniformly distributed along the axis of the bionic air spring system to form the anti-torsion vibration component to simulate the three-point support attitude of both claws and the tail of a woodpecker, so that engineering adaptability and vibration reduction efficiency of bionic air springs are improved.
Owner:SHANDONG UNIV
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