Anisotropic conductive film and method for producing same

An anisotropic, conductive film technology, applied in conductive connection, printed circuit manufacturing, conductive adhesive connection, etc., can solve the problems of IC chips, substrate bending, etc., and achieve the effect of alleviating bending

Active Publication Date: 2016-10-26
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to solve the above problems of the prior art, so that the problem of warping in the IC chip and the substrate that occurs during anisotropic conductive connection can be solved without changing the existing IC chip and the substrate.

Method used

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  • Anisotropic conductive film and method for producing same
  • Anisotropic conductive film and method for producing same
  • Anisotropic conductive film and method for producing same

Examples

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preparation example Construction

[0087] >

[0088] Next, an example of the production method of the anisotropic conductive film of the present invention will be described.

[0089] The anisotropic conductive film of the present invention can be produced by performing a low-adhesion region forming process on a part of one surface of the insulating adhesive layer. Examples of the low-adhesive region forming process include pouring a low-adhesive region-forming material and performing smoothing by a known method; raster processing with a laser; or micro-concave-convex processing by photolithography.

[0090] A preferred example of the production method of the anisotropic conductive film of the present invention is a production method having the following steps (A) to (C). Each process is described below.

[0091] Process (A)

[0092] First, a composition for forming an insulating adhesive layer containing conductive particles is applied on a mold having convex portions corresponding to low-adhesive regions, a...

Embodiment 1~5

[0103] With toluene, 60 parts by mass of phenoxy resin (YP-50, Nippon Steel Sumikin Chemical Co., Ltd.), 40 parts by mass of acrylate (EP600, Daicel-Allnex Ltd. (Daicel-Allnex Ltd. (Daycel Aurnex))), 2 parts by mass of photoradical polymerization initiator (IRGACURE 369, Mitsubishi Chemical Co., Ltd.) and 10 parts by mass of conductive particles (Ni / Au plated resin particles, AUL704, Sekisui Chemical Industry Co., Ltd.) with an average particle diameter of 4 μm ) to prepare a mixed solution so that the resin solid content is 50% by mass.

[0104] Using this mixed solution and forming the predetermined protrusions (in the case of Examples 1 to 4, the same Figure 4 The mode of corresponding continuous extending setting, under the situation of embodiment 5 is and Figure 5 Corresponding to the sheet-shaped mold in a discontinuous stepping stone shape), an insulating adhesive layer having a width of 2 mm was prepared after cutting. The insulating adhesive layer was removed from...

Embodiment 6

[0108] (Preparation of Insulating Adhesive Layer Arranged with Conductive Particles)

[0109] With toluene, 60 parts by mass of phenoxy resin (YP-50, Nippon Steel & Sumikin Chemical Co., Ltd.), 40 parts by mass of acrylate (EP600, Daicel-Allnex Ltd. (Daicel-Allnex Ltd. (Daycel Allnex Co., Ltd.)) and 2 parts by mass of a photoradical polymerization initiator (IRGACURE 369, Mitsubishi Chemical Co., Ltd.) prepared a mixed liquid so that the solid content would be 50% by mass. The mixed solution was coated on a polyethylene terephthalate film having a thickness of 50 μm so that the dry thickness would be 8 μm, and dried in an oven at 80° C. for 5 minutes to form a photoradically polymerizable resin layer.

[0110] Next, in the obtained photoradically polymerizable resin layer, conductive particles (Ni / Au plated resin particles, AUL704, Sekisui Chemical Co., Ltd.) having an average particle diameter of 4 μm were arranged in a single layer at a distance of 4 μm. Furthermore, from t...

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Abstract

This anisotropic conductive film (100) has a structure wherein conductive particles (2) are dispersed or arranged in a regular pattern in an insulating binder layer (1). One surface of this anisotropic conductive film (100) is partially provided with a low-adhesion region (3) that has a lower adhesion strength than the insulating binder layer (1). The low-adhesion region (3) is a region where a recess (10), which is formed in the insulating binder layer (1), is filled with a low-adhesion resin.

Description

technical field [0001] The invention relates to an anisotropic conductive film and a preparation method thereof. Background technique [0002] Anisotropic conductive films are widely used when IC chips are flip-chip mounted on substrates. In the above-mentioned flip chip mounting, since bumps with a height of 10 to 20 μm are formed on the edge region of the IC chip’s bonding surface, the IC chip is pushed onto the substrate during anisotropic conductive connection, and each chip is kept in this state. The anisotropic conductive film is cured. Therefore, the central region of the IC chip where no bumps are formed is cured in a bent state toward the substrate, and there is a problem that the bent state, which is likely to cause problems such as a decrease in dimensional accuracy and separation of the bonding surface, cannot be relieved. In order to solve this problem, it has been proposed to provide a support member as a reinforcing material against bending on the back surfa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R11/01H01R43/00
CPCH01R13/2414B32B7/14B32B9/045B32B27/16B32B27/20B32B27/32B32B27/34B32B27/36B32B27/38B32B27/40B32B3/30B32B2255/10B32B2255/26B32B2264/02B32B2264/105B32B2274/00B32B2307/206B32B2307/706H05K3/323H05K2201/0221H05K1/0271H05K2201/0187B32B5/16B32B2307/202B32B2457/00H01R11/01H01R4/04H01R43/00B32B7/12B32B37/10B32B37/12H05K1/181H05K3/305
Inventor 服部正明塚尾怜司
Owner DEXERIALS CORP
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