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Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film using said method

A technology of copper nanoparticles and particles, which is applied in the formation of conductive patterns, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as high unit cost, broken wires, and narrowed wire intervals

Active Publication Date: 2006-06-21
HARIMA CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if gold nanoparticles are used, since the gold material itself is expensive, the unit cost for producing dispersions for ultrafine printing also becomes expensive, which becomes an economical bottleneck for widely used general-purpose products
On the other hand, if silver nanoparticles are used instead, the unit cost of producing the dispersion can be reduced a lot, but since the wiring width and the space between the wires are narrowed, another such serious problem arises, namely Electromigration onto the surface causing wire breaks

Method used

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  • Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film using said method
  • Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film using said method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-1～1-4 and comparative example 1-1～1-3

[0119] (reduction / roasting treatment in vapor of organic compounds)

[0120] A dispersion of copper ultrafine particles purchased commercially (trade name: independently dispersed ultrafine particles, perfect copper (perfect copper) produced by Ulvac Materials, Inc.), which specifically has an average particle diameter of 5 nm and has The dispersion of the copper nanoparticle of surface oxide film layer, it comprises 100 mass parts copper particles with oxide film layer on the surface, 15 mass parts as the dodecylamine of alkylamine (molecular weight is 185.36, and boiling point is 248 ℃ ), and 75 parts by mass of mineral essential oil as an organic solvent.

[0121] To 100 parts by mass of the copper ultrafine particle dispersion, 5 parts by mass of toluene and then 100 parts by mass of methanol were added to precipitate the contained copper fine particles. With respect to 80 mass parts of copper microparticles, 16 mass parts of bis(2-ethylhexyl)amine was added as an amine c...

Embodiment 1-5 to 1-11 and comparative example 1-4

[0129] (reduction / baking in the presence of organic compounds contained in the coating)

[0130] First, an aqueous dispersion containing copper ultrafine particles was prepared by a wet reduction reaction. After 30 g of copper sulfate was dissolved in 100 ml of distilled water, 100 g of diethanolamine as a reducing agent was added to the aqueous solution which had been heated to 80°C. Subsequently, while continuing to stir, a wet reduction reaction was performed for 8 hours to obtain a brown aqueous dispersion containing the formed copper microparticles. Acetone was added to the dispersion to remove the diethanolamine and to precipitate copper particles. The cleaning operation with acetone was repeated three times to remove residual raw materials, reaction-induced by-products and impurities. The obtained copper fine particles partially had a surface oxide film layer (oxidized copper) on the surface, and had an average particle diameter of 9 nm.

[0131] 10 parts by mass of ...

Embodiment 1-12

[0139] (reduction / roasting treatment in organic compound vapor)

[0140] A dispersion of commercially purchased copper ultrafine particles (trade name: independently dispersed ultrafine particle refined copper, manufactured by Ulvac Materials, Inc.), which specifically has an average particle diameter of 5 nm and partially has oxidation on the surface, is used. The dispersion of copper nanoparticles in the material film layer, specifically, it contains 100 parts by mass of copper particles, 15 parts by mass of dodecylamine (molecular weight is 185.36, boiling point is 248 °C) for alkylamine, and 75 parts by mass as Mineral essential oils in organic solvents.

[0141] To 100 parts by mass of the copper ultrafine particle dispersion, 5 parts by mass of toluene and then 100 parts by mass of methanol were added to precipitate the contained copper fine particles. 16 parts by mass of bis(2-ethylhexyl)amine as an amine compound, and 4 parts by mass of liquid paraffin as a resin comp...

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Abstract

A method of forming a fine-shaped electrical conductor of the sintered product of fine copper particles, wherein a fine pattern is drawn by using a dispersion of copper particles having an oxide film on its surface, and then, at a relatively low temperature, on the surface of the resulting pattern The fine copper particles or the fine copper oxide particles having an oxide film layer are subjected to reduction treatment, and the resulting copper particles are then sintered. In one embodiment, a dispersion of fine copper particles or fine copper oxide particles having an oxide film layer on its surface (the particles have an average particle diameter of 10 μm or less) is coated on a substrate, and the resulting coating The fine particles in the layer are heated to a temperature of 350° C. or lower in an atmosphere containing a compound having reducing ability or gas, whereby the oxide film is reduced by reduction using the compound having reducing ability as a reducing agent, and then , performing a series of heating steps including repeated short-time oxidation treatment and re-reduction treatment combined with heating treatment, thereby forming a sintered product from the resulting copper particles. The finely formed electrical conductor of the sintered product of fine copper particles formed by the above method exhibits excellent electrical conductivity.

Description

technical field [0001] The present invention relates to a method for forming a copper-based wiring pattern or a copper thin film layer having an extremely thin film thickness, and more particularly, to a method for forming a wiring pattern of a copper sintered product, or a method for forming a copper thin film layer having an extremely thin film thickness , the copper sintered product has low resistance and a very fine shape suitable for digital high-density wiring. The method comprises the steps of drawing ultrafine particles using a dispersion of copper particles or copper oxide particles having a surface oxide film layer, especially a dispersion of copper nanoparticles or copper oxide nanoparticles having a surface oxide film layer. Patterning or forming a thin film coating; for copper particles or copper oxide particles having a surface oxide film layer, especially copper nanoparticles or copper particles having a surface oxide film layer contained in a pattern or film co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10H01L21/288
Inventor 伊东大辅泉谷晃人畑宪明松叶赖重
Owner HARIMA CHEM INC
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