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Copper alloy materials with high-strength and conducting performances and production thereof

A copper alloy, high conductivity technology, applied in the field of copper alloy materials and their preparation processes, can solve the problems of low strength and conductivity comprehensive indicators of high strength and high conductivity copper alloys, poor heat resistance of alloys, and low conductivity, etc. High temperature performance and wear resistance, excellent wear performance, the effect of improving product quality and productivity

Inactive Publication Date: 2006-08-16
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] At present, the high-strength and high-conductivity copper alloys produced and used by conventional alloying methods still have the problem of low comprehensive indicators of strength and conductivity, such as the strength is generally lower than 550MPa, or the conductivity is lower than 80% IACS
For example, the commonly used Cu-Ag alloy has a conductivity of 96% IACS, but its strength is below 400MPa, and the strength decreases a lot at high temperature, and the heat resistance of the alloy is poor; the strength of Cu-Cr alloy can reach 500MPa, but its conductivity is generally lower than 80%IACS

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] The copper alloy material of this embodiment mainly contains Cu, Cr, Zr and trace mixed rare earth elements (Ce+Y) elements, wherein the content of each component is: Cr 0.05wt%, Zr 0.05wt%, (Ce+Y)≤0.20 wt%, the rest is Cu.

[0046] The process for preparing the above-mentioned copper alloy material includes:

[0047] ①Smelting of alloy ②Forging of alloy ③Solid solution of alloy ④Deformation after solid solution ⑤Aging treatment.

[0048] Wherein: the smelting and forging of the alloy are traditional processes, that is, the smelting of the alloy is smelted in a ZG-0.01 type 10kg vacuum intermediate frequency induction melting furnace (with a graphite crucible). After melting high-purity cathode copper (purity 99.95%), the temperature is raised and refined for 8 minutes, and Cr is added to heat up and smelted. Under the protection of Ar gas, add Zr and (Ce+Y), stir well, cast, cool for about 5 minutes, and then take out the furnace. The casting temperature is about 13...

Embodiment 2

[0053] The copper alloy material of this embodiment mainly contains Cu, Cr, Zr and trace mixed rare earth elements (Ce+Y) elements, wherein the content of each component is: Cr 0.15wt%, Zr 0.10wt%, (Ce+Y)≤0.20 wt%, the rest is Cu.

[0054] The process for preparing the above-mentioned copper alloy material includes:

[0055] ① Alloy smelting ② Alloy forging ③ Alloy solid solution ④ Deformation after surrounding solution ⑤ Aging treatment.

[0056] Wherein: the smelting and forging of the alloy are the same as in Example 1.

[0057] The solid solution treatment of the alloy is carried out in a box-type resistance furnace at a temperature of 930° C., the holding time is 1 h, and water quenching is carried out after the solid solution treatment. The deformation after solid solution refers to cold drawing deformation, and the drawing is carried out in separate passes, and the cold drawing deformation is 40%. Then carry out aging treatment in a box-type resistance furnace at a t...

Embodiment 3

[0060] The copper alloy material of this embodiment mainly contains Cu, Cr, Zr and trace mixed rare earth elements (Ce+Y) elements, wherein the content of each component is: Cr0.40wt%, Zr0.20wt%, (Ce+Y)≤0.20 wt%, the rest is Cu.

[0061] The process for preparing the above-mentioned copper alloy material includes:

[0062] ①Smelting of alloy ②Forging of alloy ③Solid solution of alloy ④Deformation after solid solution ⑤Aging treatment.

[0063] Wherein: the smelting and forging of the alloy are the same as in Example 1.

[0064] The solid solution treatment of the alloy is carried out in a box-type resistance furnace at a temperature of 960° C., the holding time is 1 h, and water quenching is carried out after the solid solution treatment. The deformation after solid solution refers to cold drawing deformation, and the drawing is carried out in separate passes, and the cold drawing deformation is 45%. Then carry out aging treatment in a box-type resistance furnace at a tempe...

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Abstract

The invention opened a high strength and conductance aldary material which includes: Cr 0.05%-0.10wt%; Zr 0.05%-0.50%; Mg 0.05-0.20wt%; (Ce+Y)<=0.20%; The residue is Cu. The process is : water quench for 1h in 900-960DEG C->30%-45% of cold-drawing deformation->aging treatment for 0.5-4h in 440-520 ->formed by cold-drawing. The strength can reach above 550-600MPa and the specific conductivity can keep above 80% IACS, and the life is improved to 3-5 times, the sintering can reach 550DEG C; the slip is less than 10% in the 300DEG C, the elongation percentage is above 5%, also the alloy has the performance of resistance to elevated temperatures and stand wear and tear.

Description

Technical field [0001] The invention belongs to the technical field of alloy materials, and mainly relates to a copper alloy material with high strength and high conductivity and a preparation process thereof. It can be used for contact wires of trams and electric locomotives, integrated circuit lead frame materials, conductor materials of high pulse magnetic field, heat exchange materials and corrosion-resistant parts of coastal power plants, electrodes and contact materials of various spot welding and seam welding machines, Commutators for armatures and electric tools, rotor guide bars for large high-speed turbine generators, linings for high-thrust rocket engines, etc. Background technique [0002] High strength and high electrical conductivity are a pair of contradictory properties, and copper alloy materials are no exception. At present, in the research field of copper alloy materials, the contradiction between high strength and high conductivity is mainly solved by al...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C1/02C22F1/08
Inventor 刘平刘勇田保红任凤章
Owner HENAN UNIV OF SCI & TECH
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