Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

A composition and adhesive technology, applied in the direction of non-polymer adhesive additives, adhesive types, adhesive additives, etc., can solve the problem of reduced migration resistance, high-purity acrylonitrile/butadiene rubber is expensive, It is impossible to use this material on a large scale to achieve the effect of excellent flame retardancy

Inactive Publication Date: 2006-10-18
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Examples of known materials meeting the above requirements include adhesive compositions comprising epoxy resins, aromatic phosphate esters, curing agents, and high-purity acrylonitrile/butadiene rubber, and flexible coverings using such adhesive compositions. Copper laminates and laminated films (see patent reference 1), but high-purity acrylonitrile/butadiene rubber is very expensive, which means that except for some special applications, it is impossible

Method used

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  • Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
  • Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
  • Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0136] Combine the components of the adhesive composition according to the ratio shown in the column of Example 1 in Table 1, and then add a mixed solvent of methyl ethyl ketone and dioxolane to the resulting mixture to obtain an organic solid component and an inorganic solid The combined concentration of the components is 35% by mass of the dispersion.

[0137] The above-mentioned dispersion is then applied to the surface of a polyimide film A (trade name: Kapton H, manufactured by DuPont Toray Co., Ltd., thickness: 25 μm) with an applicator in an amount sufficient to produce a dry film with a thickness of 10 μm. The coating was then baked in a circulating air oven at 120°C for 10 minutes to convert the composition to a semi-cured state. Then use a roll laminator to bond the surface coated with the dispersion on the polyimide film A with a rolled copper foil (trade name: BHY22BT, Japan) with a thermocompression bonding method at 120° C. and a linear pressure of 2 kg / cm. Ener...

Embodiment 2

[0139] A flexible copper-clad laminate was manufactured in the same manner as in Example 1, except that the components of the adhesive composition were combined in the ratios shown in the column of Example 2 in Table 1. The properties of the flexible copper-clad laminate were also measured by the following measurement method 1. The results are shown in Table 1.

Embodiment 3～6

[0152] A dispersion was produced in the same manner as in Example 1, except that the components of the adhesive composition were combined in the ratios shown in the columns of Examples 3 to 6 in Table 2, respectively. Simultaneously, one side of a polyimide film B (trade name: Apical NPI, manufactured by Kanegafuchi Chemical Industry Co., Ltd., thickness: 25 μm) was placed under predetermined conditions (pressure: 13.3 Pa, argon flow rate: 1.0 L / min, Applied voltage: 2kV, frequency: 110kHz, power: 30kW, processing speed: 10m / min) were subjected to low-temperature plasma treatment. Each dispersion was then applied to the low-temperature plasma-treated surface of a polyimide film with an applicator in an amount sufficient to produce a dry coating thickness of 25 μm, which was then allowed to dry in circulating air. Bake in an oven at 90°C for 10 minutes, so that the composition is transformed into a semi-cured state and a laminated film is formed. Then, the characteristics of e...

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Abstract

Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate.

Description

technical field [0001] The present invention relates to an adhesive composition which is halogen-free and produces a cured product having excellent flame retardancy when cured, and an adhesive sheet, a laminate film, and a flexible copper-clad laminate using the composition. Background technique [0002] Adhesives traditionally used for electronic materials such as semiconductor sealing materials and glass-epoxy copper-clad laminates include bromine-containing epoxy resins or phenoxy resins to ensure excellent flame retardancy. However, since compounds containing halogen such as bromine release toxic gases such as dioxin compounds when burned, the use of halogen-free materials in adhesives has been carefully studied in recent years. [0003] On the other hand, flexible copper-clad laminates, which are thinner and more flexible than the glass-epoxy-based copper-clad laminates mentioned above, are currently being widely used, and the market is expanding because electronic mate...

Claims

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Application Information

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IPC IPC(8): C09J163/00B32B15/08B32B27/18C09J11/06C09J109/02C09J133/00C09J167/00
Inventor 中西畅近藤和纪星田繁宏天野正
Owner SHIN ETSU CHEM IND CO LTD
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