Periclase-silicon carbide-carbon composite materials and method for preparing same
A technology of carbon composite materials and silicon carbide, which is applied in the field of refractory materials, can solve problems affecting the cleanliness of molten steel, steel quality, and carbon content increase, and achieve excellent slag resistance, thermal shock stability, and high thermal conductivity , The effect of low carbon increase behavior
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment Construction
[0012] [Example] 1 A periclase-silicon carbide-carbon composite material and its preparation method. According to the percentage by weight, 70-80% of fused magnesia particles and fine powder, 5-20% of silicon carbide particles and fine powder, 2-10% of graphite, 1-4% of carbon black, 2-3% Metal aluminum powder, plus 3-6% phenolic resin binder for stirring and mixing.
[0013] Among them: the particle size of fused magnesia is between 3-11mm, the particle size of fine powder is 3-95μm, the weight ratio of fused magnesia particles to fine powder is 40-60:40-60; the particle size of silicon carbide The diameter is 1-7mm, the particle size of fine powder is 50-100μm, the weight ratio of particles to fine powder is 40-60:40-60; the particle size of graphite is 50-500μm, the particle size of carbon black is 10-100μm, metal Aluminum powder particle size ≤ 1mm.
[0014] After mixing and stirring evenly, press on a press to form, and bake at 200-300° C. for 16-24 hours. The periclas...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com