Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor device, adhesive, and adhesive film

An adhesive, semiconductor technology, applied in the direction of adhesive types, semiconductor devices, film/sheet adhesives, etc., can solve the problem of unusable, cracked, large thermal expansion coefficient difference between semiconductor chips and printed wiring boards And other issues

Inactive Publication Date: 2007-03-07
RESONAC CORPORATION
View PDF11 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] In the case of mounting a semiconductor chip on a printed wiring board using these adhesives, which are printed wiring board related materials, the difference in thermal expansion coefficient between the semiconductor chip and the printed wiring board is large, and cracks will be generated during reflow , so you cannot use
In addition, it cannot be used because of the large deterioration in the humidity resistance test under severe conditions such as a temperature cycle test or PCT treatment.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device, adhesive, and adhesive film
  • Semiconductor device, adhesive, and adhesive film
  • Semiconductor device, adhesive, and adhesive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0144] FIG. 1(a) is a cross-sectional view of a single-layer thermosetting adhesive film, which is composed of a thermosetting adhesive 1. As shown in FIG. The elastic modulus of the cured product measured with a dynamic viscoelasticity measuring device at 25°C is specified as 10-2000MPa, and the elastic modulus at 260°C is specified as 3-50MPa, which is in the range of exothermic heat. A semi-cured state at the level of 10 to 40% of the total curing calorific value when measured by DSC (differential calorimeter). An epoxy group-containing acrylic copolymer film in which the amount of solvent remaining in the thermosetting adhesive film is dried to 2% or less is used.

[0145] FIG. 1(b) shows a cross-sectional view of a three-layer adhesive film in which a thermosetting adhesive 1 is applied to both sides of a polyimide film 2. As shown in FIG. In this example, as the polyimide film, Ube Industries, Ltd. UPILEX (trade name) with a thickness of 50 micrometers was used.

[014...

Embodiment 2

[0157] FIG. 7 shows a manufacturing process of a semiconductor mounting substrate and a semiconductor device.

[0158] The thermosetting adhesive tape (adhesive member) 3 made of the thermosetting adhesive 1 is cut into a predetermined size by a die cutter (FIG. 7(a)). The cured product of thermosetting adhesive 1 has an elastic modulus of 10-2000 MPa at 25°C measured with a dynamic viscoelasticity measuring device, and an elastic modulus of 3-50 MPa at 260°C. The semi-cured state is about 10 to 40% of the total curing heat generation.

[0159] On the surface of the polyimide film substrate 5 on which one layer of Cu wiring is applied and the same inner lead portion and through-holes for external solder terminals as the TAB tape are formed, the cut thermosetting adhesive tape 3 is precisely aligned. , and hot-pressed with a hot press to obtain a semiconductor mounting substrate ( FIG. 7( b )).

[0160] In this example, a set of frame substrates for semiconductor mounting was...

Embodiment 3

[0180] As epoxy resin, use 45 parts by weight of bisphenol A type epoxy resin (epoxy equivalent 200, EPIKOTE 828 produced by YukaShell Epoxy Co., Ltd.); cresol novolak type epoxy resin (epoxy equivalent 220, Sumitomo Chemical Industry Co., Ltd. produces ESCN001) 15 weight parts; As epoxy curing agent, use 40 weight parts of novolac type epoxy resin (PLYOPHENLF2882 produced by Dainippon Ink Chemical Industry Co., Ltd.); Solubility and the high molecular weight resin of weight-average molecular weight more than 30,000, use 15 parts by weight of phenoxy resin (molecular weight 50,000, PHENOTOHTO YP-50 produced by Dongdu Chemical Co., Ltd.); as epoxy-containing acrylic rubber, use Epoxy acrylic rubber (molecular weight 1,000,000, the HTR-860-P3 that Imperial Chemical Industry Co., Ltd. produces) 150 weight parts; As curing accelerator, use curing accelerator 1-cyanoethyl-2-phenylimidazole (CUREZOLE 2PZ -CN) 0.5 parts by weight; as a silane coupling agent, use 0.7 parts by weight o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
elastic modulusaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
Login to View More

Abstract

The invention aims at improving the temperature resisting cycle characteristics after mounting and moisture absorption resiting reflow characteristics of a chip-mounted semiconductor, and provides an adhesive which functions as a bonding member (3) to be used when a semiconductor chip (6) is mounted on an organic supporting substrate (4) and which has storage moduli at 25 DEG C and at 260 DEG C as measured with a dynamic visco-elasticity measuring instrument of 10-2000 MPa and 3-50 MPa, respectively, a double-coated adhesive film produced therewith, a semiconductor device, an semiconductor chip mounting substrate, and methods of manufacturing these products.

Description

[0001] This application is a divisional application of the invention patent application filed by Hitachi Chemical Industry Co., Ltd. on October 8, 1997, with the application number 200410062123.4 and the title of the invention "Semiconductor Device, Adhesive and Adhesive Film". technical field [0002] The present invention relates to a semiconductor device and an adhesive and an adhesive film suitable for use in the manufacture of the above semiconductor device. Background technique [0003] In recent years, with the miniaturization of electronic equipment and the high frequency of work, the semiconductor packages that load them are required to be mounted on the substrate at high density. With the progress of miniaturization and light weight, people have developed an array of external terminal areas. Small packages called micro BGA (Ball Grid Array) and CSP (Chip Scale Package) that are arranged in the lower part of the package...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J7/00H01L21/58H01L23/12
CPCH01L2224/92247H01L2224/45124H01L24/45H01L24/50H01L2224/83101H01L2224/48227H01L24/83H01L24/29H01L2924/15311H01L2924/01029H01L2224/83192H01L2924/01012H01L2224/73265H01L2224/32225H01L24/73H01L2224/2612H01L2224/45H01L2224/45144H01L2224/50H01L2924/15183H01L2924/181H01L2924/351H01L2924/00H01L2924/00012H01L2924/00014H01L2924/3512H01L23/12
Inventor 山本和德岛田靖神代恭稻田祯一栗谷弘之金田爱三富山健男野村好弘细川羊一桐原博景山晃
Owner RESONAC CORPORATION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com