Method for preparing super fine light conductive fibre

Abstract

The process of preparing super fine light conductive fiber includes the following steps: electrically spinning polymer to form super fine light polymer fiber; and 2. chemically plating the super fine light polymer fiber. The prepared super fine light conductive fiber has the features diameter smaller than 1 micron, length smaller than 50 microns, density smaller than 2 g / cu cm and high conductivity. It may be used as the conductive filler for conducting adhesive in circuit board and electrode in the electronic industry, and the conducting adhesive has excellent conductivity and high stability.

Description

technical field

[0001] The invention relates to a method for preparing ultrafine lightweight conductive fibers. Background technique

[0002] Currently, conductive adhesives widely used in the electronics industry are usually made of conductive materials such as metal powder, metal fiber or metal sheet mixed with a polymer matrix. In order to achieve good electrical conductivity, a large amount of metal filler is usually required. Since the density of the metal is usually 3-18 times that of the polymer, not only the consumption of the metal filler is large, but also the metal is easy to settle in the polymer to make the glue Liquid is unstable. Among the commonly used conductive fillers, gold and silver have excellent electrical conductivity and corrosion resistance, but are expensive. Copper has excellent electrical conductivity but is easily oxidized. At present, there is a patented technology [CN1826665] for silver plating on copper powder, which can ensure electrical c...

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