Method for preparing super fine light conductive fibre

A conductive fiber, lightweight technology, applied in the direction of fiber type, fiber processing, melt spinning, etc., can solve problems such as thick diameter, achieve the effect of small filling amount, not easy to settle, and good stability

Inactive Publication Date: 2007-04-11
XIANGTAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal-plated fibers can have good conductivity at a small filling amount, but because of the thicker diameter (generally 1-10μm) of general-purpose polymer short fibers, when they are plated with metal and used as the conductive component of the conductive adhesive, some requirements exceed Fine occasions are still restricted

Method used

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  • Method for preparing super fine light conductive fibre

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Experimental program
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Effect test

Embodiment 1

[0019] Dissolve 15g of polyacrylonitrile (PAN) in 100g of dimethylformamide (DMF), and perform electrospinning at a high voltage of 10-30 kV to obtain ultrafine polyacrylonitrile fibers. After high-speed crushing and sieving, short fibers with a diameter of 0.01-1 μm and different lengths can be obtained. Sensitized by sensitizing solution (stannous chloride 10g / L, hydrochloric acid 50mL / L), activated by activation solution (palladium chloride 0.3g / L, hydrochloric acid 10g / L), and then in electroless copper plating solution (copper sulfate 10g / L) L, potassium sodium tartrate 40g / L, potassium hydroxide 20g / L, formaldehyde 15g / L) in copper plating for 30 minutes, after filtering and drying, the obtained density is 1.9g / cm 3 Copper-coated conductive fibers.

Embodiment 2

[0021] Dissolve 75g of polyacrylonitrile (PAN) in 500g of dimethylformamide (DMF), and perform electrospinning at a high voltage of 10-30 kV to obtain ultrafine polyacrylonitrile fibers. After high-speed crushing and sieving, short fibers with a diameter of 0.01-1 μm and different lengths can be obtained. Sensitized by sensitizing solution (stannous chloride 10g / L, hydrochloric acid 50mL / L), activated by activation solution (palladium chloride 0.3g / L, hydrochloric acid 10g / L), and then in electroless silver plating solution (silver nitrate 5g / L) L, potassium hydroxide 2g / L, invert sugar 0.7g / L) silver-plated in 5 minutes, through filtering and drying, namely obtain density is 2g / cm 3 silver-plated conductive fibers.

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Abstract

The process of preparing super fine light conductive fiber includes the following steps: electrically spinning polymer to form super fine light polymer fiber; and 2. chemically plating the super fine light polymer fiber. The prepared super fine light conductive fiber has the features diameter smaller than 1 micron, length smaller than 50 microns, density smaller than 2 g / cu cm and high conductivity. It may be used as the conductive filler for conducting adhesive in circuit board and electrode in the electronic industry, and the conducting adhesive has excellent conductivity and high stability.

Description

technical field [0001] The invention relates to a method for preparing ultrafine lightweight conductive fibers. Background technique [0002] Currently, conductive adhesives widely used in the electronics industry are usually made of conductive materials such as metal powder, metal fiber or metal sheet mixed with a polymer matrix. In order to achieve good electrical conductivity, a large amount of metal filler is usually required. Since the density of the metal is usually 3-18 times that of the polymer, not only the consumption of the metal filler is large, but also the metal is easy to settle in the polymer to make the glue Liquid is unstable. Among the commonly used conductive fillers, gold and silver have excellent electrical conductivity and corrosion resistance, but are expensive. Copper has excellent electrical conductivity but is easily oxidized. At present, there is a patented technology [CN1826665] for silver plating on copper powder, which can ensure electrical c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D06M11/83D01D5/08D06M101/20D06M101/22D06M101/24D06M101/30
Inventor 谭松庭彭俊华肖文军伍伯林
Owner XIANGTAN UNIV
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