Photosensitive resin composition and photosensitive resin laminate using the same

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition and photosensitive resin laminate, and can solve the problems that the effect of hole capping is not disclosed, and achieve good hole capping, resolution and adhesion Excellent, high-sensitivity effect

Active Publication Date: 2007-04-11
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0014] In addition, in Patent Document 2, a photosensitive resin composition using a pyraz

Method used

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  • Photosensitive resin composition and photosensitive resin laminate using the same
  • Photosensitive resin composition and photosensitive resin laminate using the same
  • Photosensitive resin composition and photosensitive resin laminate using the same

Examples

Experimental program
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Embodiment

[0157] The embodiments of the present invention will be described in more detail below through examples.

[0158] First, the method of manufacturing the evaluation samples of the examples and comparative examples will be described, and then the evaluation method and evaluation results of the obtained samples will be shown.

[0159] 1. Production of samples for evaluation

[0160] The photosensitive resin laminates in Examples and Comparative Examples were produced as follows.

[0161]

[0162] Fully stir, mix the photosensitive resin composition and the solvent of composition shown in table 1, make the mixed liquid of photosensitive resin composition, in the polyethylene terephthalate film R340G16 (Mitsubishi polyester film) as support body Manufactured by the company, trade name, 16μm thick, haze 0.5%, total light projection 90%, breaking strength 225MPa(MD), 315MPa(TD), breaking elongation 155%(MD), 105%(TD), heated The above mixed solution was uniformly coated on the su...

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Abstract

The present invention relates to a photosensitive resin composition superior in sensitivity with respect to an exposure light source having the wavelength of 405+/-10 nm and resolution, having satisfactory tenting properties, and capable of being developed by an alkali aqueous solution, a photosensitive resin laminated body using the photosensitive resin composition, a method for forming a resist pattern on the substrate using the photosensitive resin stacked body, and the use of the resist pattern. The photosensitive resin composition contains: (a) a thermoplastic copolymer of 20-90% including alpha, beta-unsaturated carboxyl groups containing a monomer as a copolymerization component, and having an acid equivalent of 100-600 and weight average molecular weight of 5,000-500,000; (b) an addition polymerization monomer of 5-75% having a terminal ethylenic unsaturated group; (c) a photopolymerization initiator of 0.01-30%; and (d) a specific pyrazoline compound of 0.001-10%, and includes, (b) as the addition-polymerizable monomer containing addition-polymerizable monomer with specific structure.

Description

technical field [0001] The present invention relates to a photosensitive resin composition that can be developed with an alkaline aqueous solution, a photosensitive resin laminate of the photosensitive resin composition laminated on a support, and a photosensitive resin laminate formed on a substrate using the photosensitive resin laminate. The method of resist pattern, and the use of the resist pattern. More specifically, it relates to a photosensitive resin composition capable of imparting a suitable resist pattern, which can be used in the manufacture of printed wiring boards, the manufacture of flexible printed wiring boards, and lead frames for mounting IC chips (hereinafter referred to as lead frames). ), metal foil precision processing such as metal mask manufacturing, semiconductor package manufacturing such as BGA (Ball Grid Array Package), CSP (Chip Scale Package), TAB (Tape Automatic Bonding), COF (Chip-on-Film: Manufacturing of tape-shaped substrates represented b...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027G03F7/095G03F7/20H05K3/00H01L21/00H01L21/027
Inventor 森彻秦洋介
Owner ASAHI KASEI KK
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