Flexible printed wiring board and manufacturing method thereof

A flexible printing and circuit board technology, which is applied in the fields of printed circuit, printed circuit, multi-layer circuit manufacturing, etc., can solve the problem of low flexibility and achieve the effect of excellent dimensional stability

Inactive Publication Date: 2007-04-11
NIPPON STEEL CHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially in the case of a double-sided through-hole structure, the structure formed by bonding the copper foil of the conductor on both sides of the insulator layer, which is the base film, with an adhesive, compared with the flexible printed wiring board of the single-sided structure , usually its softness is low

Method used

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  • Flexible printed wiring board and manufacturing method thereof
  • Flexible printed wiring board and manufacturing method thereof
  • Flexible printed wiring board and manufacturing method thereof

Examples

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Effect test

Embodiment

[0042] Hereinafter, based on an Example and a comparative example, embodiment of this invention is demonstrated concretely. In the following examples, the coefficient of thermal expansion, the curl and adhesion of single-sided copper-clad products, and the curl of the film were measured by the methods described below.

[0043] That is, the thermal expansion coefficient is calculated by using a thermomechanical analyzer (TMA100) manufactured by Seiko Electronics Co., Ltd., after heating up to 250°C, cooling at a rate of 10°C / min, and calculating the average linear expansion coefficient between 240°C and 100°C And asked for.

[0044] The curling of single-sided copper-clad products is to measure the radius of curvature of copper-clad products with a size of 100mm×100mm after heat treatment and imidization.

[0045] The adhesive strength of single-sided copper-clad products is the value (kg / cm) obtained when the copper foil is peeled off at a speed of 50 mm / min in a direction of...

Synthetic example 1

[0053] 2532 g of N,N-dimethylacetamide was put into a glass reactor while blowing nitrogen gas, then 0.5 mol of DDE and 0.5 mol of MABA were added with stirring, and then completely dissolved. The solution was cooled to 10° C., and 1 mol of PMDA was added little by little to keep the reaction solution at a temperature of 30° C. or less. After the addition was completed, stirring was continued at room temperature for 2 hours to complete the polymerization reaction. The obtained polyimide precursor solution had a polymer concentration of 15% by weight, and an apparent viscosity measured at 25° C. with a B-type viscometer was 1000 mPa·s.

Synthetic example 2

[0055] Except having used 1 mol of DDE as a diamine component, and having used 1 mol of BTDA as an acid anhydride component, it carried out similarly to the synthesis example 1, and prepared the polyimide precursor solution. The obtained polyimide precursor solution had a polymer concentration of 15% by weight, and an apparent viscosity measured at 25° C. with a B-type viscometer was 300 mPa·s.

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Abstract

A flexible printed wiring board having a stable quality, not generating curls on a film even after circuit process on a conductor side, and a method of manufacturing such flexible printed wiring board are provided. The flexible printed wiring board is provided with a base layer, which is composed of at least one type of low thermal expansion polyimide resin, between a bottom layer contacting the conductor and a top layer on the opposite side to the conductor. The bottom layer and the top layer are composed of a thermoplastic polyimide rein having a larger thermal expansion coefficient than that of the base layer, and a thickness P1 of the bottom layer and a thickness P2 of the top layer satisfy a condition of P1 H05K 1 / 03 0 10 1 2005 / 3 / 9 1947476 2007 / 4 / 11 000000000 Nippon Steel Chemical Co. Japan Higasayama Ichiro Sato Seiji wangjian 11038 The Patent Agency of the Chinese Council for the Promotion of International Trade (CCPIT) No.1 Waidajie, Fuxingmen, Beijing 100086 Japan 2004 / 3 / 9 065854 / 2004 2006 / 9 / 8 PCT / JP2005 / 004100 2005 / 3 / 9 WO2005 / 086547 2005 / 9 / 15 Japanese

Description

technical field [0001] The present invention relates to a flexible printed wiring board and a manufacturing method thereof corresponding to the miniaturization and weight reduction requirements of electronic equipment. In particular, it relates to a flexible printed wiring board with a high-quality single-sided conductor in which warpage does not occur in the polyimide film portion after wiring processing, and a method for manufacturing the same. Background technique [0002] In recent years, with the development of miniaturization and weight reduction of high-performance mobile phones, digital cameras, navigators, and other various electronic devices, flexible printed circuit boards (wiring Substrates) have increasing demands for miniaturization, high density, multilayer, precision, and low dielectric. Conventionally, this flexible printed wiring board has been produced by bonding a polyimide film and a metal foil together with a low-temperature curable adhesive. However,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03
CPCH05K2201/068H05K1/0346H05K2201/0129H05K1/036H05K2201/0154H05K3/46
Inventor 日笠山伊知郎佐藤诚治
Owner NIPPON STEEL CHEMICAL CO LTD
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