Method for treating organic light emitting device metal anode

Abstract

This invention relates to a process method for metal anode of organic light emission devices characterizing in carrying out metal surface process to the base board of a metal anode in plasma with oxygen component, namely, putting the base board in plasma process cavity charged with mixed gas containing oxygen and with radio field to generate a thin oxide layer on the surface of the metal anode to increase the power function of the metal surface and cavity injection ability, and said metal may be Ag or Ni.

Description

technical field [0001] The invention relates to the technical field of electronic display devices, in particular to a processing technology for a metal anode of an organic light-emitting device. Background technique [0002] At present, the anode of organic light-emitting devices usually uses indium tin oxide material, which is because indium tin oxide has a higher work function, which is helpful for hole injection, and indium tin oxide is a transparent conductive material, so that the light emission of the device can be Release through it. However, for top-emitting devices, the luminescence of the device can be released through a transparent cathode, which does not require the anode to have transparent characteristics, which increases the selection range of the anode. Because the conductivity of indium tin oxide is not particularly ideal, and the price is relatively expensive, and it lacks light reflection characteristics, it is not suitable for the anode of the top-emitti...

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Problems solved by technology

Because the conductivity of indium tin oxide is not particularly ideal, and the price is relatively expensive, and it lacks light reflection characteristics, it is not suitable for the anode of the top-emitting device. Usually, a metal with a high work function is used as the anode of the top-emitting device. The commonly used metals are nickel, Gold, etc., and the conductivity of nickel is poor, and more complicated electron beam film forming equipment is usually used, and the internal tension of the nickel film is very large, which is not conducive to its adhesion on the substrate and is easy to fall off from the substrate, while gold is Golden yellow will affect the normal color of the display device, and the price of gold is more expensive, and the adhesion of the substrate is also poor, so it is not an ideal material

Silver is a better material, which can be formed by simple thermal evaporation film-forming equipment. It has good conductivity and better adhesion on the substrate, but its work function is relatively low, only 4.3 electron volts, while that of general anode materials The work function is above 5 electron volts, purely using silver as the anode, the hole injection characteristics are not good, resulting in low brightness and high driving voltage