Unlock instant, AI-driven research and patent intelligence for your innovation.

Contact and test socket device for testing semiconductor device

a technology of contact and socket, which is applied in the direction of measurement devices, measurement instrument housings, instruments, etc., can solve the problems of increasing contact resistance, mechanical breakage of the socket, and reducing the life of the test socket, so as to achieve excellent electrical characteristics and extend the service li

Active Publication Date: 2021-03-02
HWANG DONG WEON +2
View PDF14 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The hybrid contact and test socket device achieves superior electrical characteristics and extended service life, suitable for fine pitch devices, by reducing signal loss and mechanical instability while maintaining stable connections and reducing production costs.

Problems solved by technology

There are two main reasons for the lifetime of the test socket being reduced: first, there is a problem that the socket is mechanically broken due to an unstable contact; and second, there is a problem that contamination of a contact portion raises the contact resistance due to continuous contact whereby electrical characteristics become unstable.
However, because the contact pin 12 has a spiral structure or a curved structure to have elasticity, the pin-type test socket has a long current path which leads to a problem of signal loss.
Thus, the test socket is unfavorable structure in an ultrahigh frequency band.
Further, in a fine pitch test socket, there are problems that procedures of producing the housing structure in which the contact pin 12 is buried are complex and production costs are remarkably increased.
However, such rubber-type test socket 30 has a disadvantage that the elasticity is lost during the repeated test processes and the service life is remarkably decreased.
Therefore the number of times of use is short and cost increases due to frequent replacement.
Particularly, in the rubber-type test socket, it is not easy to secure a sufficient insulation distance L between adjacent conductive silicon portions 32 in the device of fine pitch, resulting in the likelihood that a circuit short occurs.
Therefore, there is a problem that the rubber-type test socket 30 has a certain damping section δ away from the defined diameter d which causes the insulting distance L between the adjacent conductive silicon portions 32 to be considerably short, which is not preferable for the test socket for use in a fine pitch device.
In addition, another problem of the rubber-type test socket resides is that a voltage is applied for considerable time in order to obtain a sufficient density of the conductive powder along a current path when applying the voltage to the silicon mixture during a manufacturing process, thus it takes a long time to manufacture the test socket.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Contact and test socket device for testing semiconductor device
  • Contact and test socket device for testing semiconductor device
  • Contact and test socket device for testing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

third embodiment

[0075]FIGS. 6A, 6B, and 7 are views showing a contact according to a third embodiment of the present invention; FIG. 6A is a left side view and a plan view of a plate-shape pattern, from left; FIG. 6B is a plan view and a front view of a contact processed through a rolling-process, from top; and FIG. 7 is a plan view and a front view of a contact of hybrid type that is filled with a filler, from top.

[0076]Referring to FIGS. 6A and 6B, a contact 300 of a plate-shaped pattern according to the present embodiment includes an upper head portion 310 having an upper indented portion 311 protruding upwards, an elastic portion 320 formed of a strip obliquely extending from the upper head portion 310 into a lateral and downward direction, and a lower head portion 330 having a lower indented portion 331 protruding downwards and formed to extend from a lower end of the elastic portion 320.

[0077]The upper head portion 310 is constructed by rolling the plate-shaped pattern into a cylindrical shap...

fourth embodiment

[0084]FIGS. 8A, 8B, 9A, and 9B are views showing a contact according to a third embodiment of the present invention; FIG. 8A is a left side view and a plan view of a plate-shape pattern, from left; FIG. 8B is a plan view and a front view of a contact processed through a rolling-process, from top; FIG. 9A is a perspective view of a contact processed through rolling-process; and FIG. 9B is a plan view and a front view of a contact of hybrid type filled with a filler, from top.

[0085]Referring to FIGS. 8A, 8B, and 9A, a contact 400 of a plate-shaped pattern according to the present embodiment includes an upper head portion 410 having an upper indented portion 411 protruding upwards, an elastic portion 420 of a strip extending from the upper head portion 410 into a zigzag shape, and a lower head portion 430 having a lower indented portion 431 protruding downwards and formed to extend from a lower end of the elastic portion 420.

[0086]The upper head portion 410 is constructed by rolling a ...

fifth embodiment

[0094]FIGS. 10A, 10B, and 11 are views showing a contact according to a fifth embodiment of the present invention; FIG. 10A is a left side view and a plan view of a plate-shape pattern, from left; FIG. 10B is a plan view and a front view of a contact processed through a rolling-process, from top; and FIG. 11 is a plan view and a front view of a contact of hybrid type that is filled with a filler, from top.

[0095]Referring to FIGS. 10A and 10B, a contact 500 of a plate-shaped pattern according to the present embodiment includes an upper head portion 510 having an upper indented portion 511 protruding upwards, an elastic portion 520 of a strip obliquely extending from the upper head portion 510 into a zigzag shape, and a lower head portion 530 having a lower indented portion 531 protruding downwards and formed to extend from a lower end of the elastic portion 520.

[0096]Particularly, the elastic portion 520 includes a junction portion 521a of which a width is different in a partial sect...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
cylindrical shapeaaaaaaaaaa
angleaaaaaaaaaa
widthaaaaaaaaaa
Login to View More

Abstract

The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]The present application claims priority to Korean Patent Application No. 10-2017-0066960, filed May 30, 2017, the entire contents of which is incorporated herein for all purposes by this reference.BACKGROUND OF THE INVENTIONField of the Invention[0002]The present invention relates generally to a contact and a socket device for testing a semiconductor device. More particularly, the present invention relates to a contact and a socket device which are buried in a test socket for testing an IC, whereby the contact and the socket device provides electrical connection between the contact points and leads, such as electrical connection between leads of an IC and pads of a PCB, or electrical connection between a PCB and leads of an IC such as a CPU inside electronic products such as a personal computer (PC), a mobile phone, and so on.Description of the Related Art[0003]The test socket is a component for inspecting defects of a semiconductor device...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(United States)
IPC IPC(8): G01R1/067G01R31/00G01R31/28G01R1/04
CPCG01R1/06722G01R1/0466G01R1/0483G01R1/06716G01R1/06727G01R31/2886B21D11/06G01R1/06738G01R1/06755
Inventor HWANG, DONG WEONHWANG, JAE SUKHWANG, JAE BAEK
Owner HWANG DONG WEON