Hotspot spray cooling

Abstract

The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the chip that generate large heat fluxes, typically referred to as the core, the liquid coolant is dispensed as a continuous atomized droplet pattern. The atomized pattern creates a high heat flux evaporative cooling thin-film over the one or more core areas. Rather than optimize the atomized pattern and flow based upon complete thin-film vaporization, the present invention optimizes the atomized pattern for maximum heat removal rates. Any excess, non-vaporized, fluid flowing outward from the hotspot is used to cool the lower heat flux (non-core) areas of the component through the creation of a thick coolant film thereon.

Description

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0001] This invention was made with Government support under contract #F33615-03-M-2316 awarded by the Air Force Research Laboratory. The Government has certain rights in this invention.CROSS REFERENCE TO RELATED APPLICATIONS [0002] None BACKGROUND [0003] 1. Field of the Invention [0004] The present invention relates generally to spray cooling thermal management systems and more specifically it relates to a spray cooling system that provides high heat flux evaporative cooling of electronic component hotspots. [0005] 2. Description of the Related Art [0006] Liquid cooling is well known in the art of cooling electronics. As air cooling heat sinks continue to be pushed to new performance levels, so has their cost, complexity, and weight. For some time, liquid cooling solutions have been developed and tested, but other than specialty applications they have yet to gain widespread commercial adoption. As computer power consum...

AI Technical Summary

Benefits of technology

[0019] Other embodiments of the invention include supplemental nozzles that deposit cooling fluid into the thick-film. This embodiment provides an efficient and simple method of controlling the cooling rates over the less critical system zones and provides further flexibility in optimizing the atomization for the high heat flux areas.

[0021] Another embodiment of the present invention uses a liquid-vapor separator for separating liquid and vapor from the exit stream of a spray module prior to condensing the vapor. The result is a near pure vapor at the inlet of the condenser which is potentially more efficient and has a more repeatable performance than a condenser with substantial two-phase flow at its inlet.

[0022] Yet another embodiment of the present invention enhances the surface of the chip to be spray cooled through the use of etched open microchannels. These microchannels are formed either directly into the top surface of the chip or through the use of a secondary etched microchannel plate bonded to the top surface of the chip.

Problems solved by technology

As air cooling heat sinks continue to be pushed to new performance levels, so has their cost, complexity, and weight.

For some time, liquid cooling solutions have been developed and tested, but other than specialty applications they have yet to gain widespread commercial adoption.

This non-uniform heat flux distribution poses a significant challenge to the cooling system as it is desirable to keep the entire chip at nearly the same operating temperature.

Cooling systems that rely on heat spreading may not provide this ability as they rely on conduction spreading, resulting in significant temperature gradients across the chip.

Although this method improves the efficiency of the system, that is in attaining complete phase change of all dispensed fluid, the incremental dispensing method does not provide dispensing characteristics necessary to create high heat flux thin-film evaporative cooling and high performance cooling of hotspots.

Although this method directs and controls the single phase fluid over a chip hotspot, the disclosed method is not a phase change process and thus not capable of high heat flux thin-film evaporative cooling.

Although microchannel cooling methods may effectively lower the temperature of the core, due to large pressure drops and resulting size limitations they do not efficiently address the needs of the non-hotspot areas of the die.

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