Silver powder and method for producing same

Inactive Publication Date: 2005-09-01
DOWA ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010] It is therefore an object of the present invention to eliminate the aforementioned problems and to provide a silver powder capable of decreasing the viscosity of a photosensitive paste using the silver powder and improving the film state, sensitivity and linearity of the paste even if the particle diameter of the silver powder is small, and a method for producing the same.
[0019] According to the present invention, a surface smoothing process for mechanically causing particles of a silver powder, which is produced by a wet reducing method, to collide with each other is carried out. Thus, it is possible to smooth irregularities and angular portions on the surface of the silver powder without substantially changing the particle diameter and particle size distribution of the silver powder, so that it is possible to produce a silver powder capable of reducing the viscosity of a photosensitive paste and improving the sensitivity thereof when the photosensitive paste uses the silver powder even if the particle diameter of the silver powder is small. Moreover, if silver agglomerates are removed by a classification, it is possible to produce a silver powder capable of improving the film state and linearity of a photosensitive paste using the silver powder. Thus, it is possible to greatly improve the film state and linearity of a photosensitive paste using a silver powder according to the present invention, so that it is possible to provide an electronic part having a pattern which has a high density and fine lines.

Problems solved by technology

However, if a silver powder having small particle sizes is produced by a conventional silver powder producing method, the viscosity of a conductive paste using the silver powder increases as the particle diameter of the silver powder decreases.
That is, there is a problem in that it is not possible to produce a silver powder capable of decreasing the viscosity of a conductive paste using the silver powder even if the particle diameter of the silver powder is small.
However, in recent years, electronic parts, such as electrodes of substrates for plasma display panels, are required to have a pattern having a higher density and finer lines, so that there are some cases where the film state and linearity of a photosensitive paste are not good even if the photosensitive paste uses a silver powder produced by the method disclosed in Japanese Patent Laid-Open No. 2002-80901.
Thus, there are some cases where it is not possible to obtain a good burned film, so that it is not possible to provide a pattern having a higher density and finer lines.

Method used

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  • Silver powder and method for producing same
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  • Silver powder and method for producing same

Examples

Experimental program
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Effect test

example 1

[0030] To 3600 ml of an aqueous solution containing 12 g / l silver nitrate as silver ions, 375 ml of industrial aqueous ammonia was added to form an aqueous silver ammine complex solution. To the aqueous silver ammine complex solution thus formed, 75 g of sodium hydroxide was added to control the pH of the solution. Then, 96 ml of industrial formalin serving as a reducing agent was added to the solution. Immediately thereafter, 1.5 g of oleic acid was added to the solution to obtain a silver slurry. Then, the silver slurry thus obtained was filtered, washed with water, dried to obtain a silver powder. Then, the surface of the silver powder thus obtained was smoothed by a surface smoothing process using a high-speed mixer, and the silver powder thus smoothed was classified to remove silver agglomerates having a greater diameter than 8 μl m.

[0031] The particle diameters of the silver powder thus obtained were measured by Microtrack. As a result, D10 was 0.8 μm, and the mean particle d...

example 2

[0037] To 3600 ml of an aqueous solution containing 12 g / l silver nitrate as silver ions, 180 ml of industrial aqueous ammonia was added to form an aqueous silver ammine complex solution. To the aqueous silver ammine complex solution thus formed, 1 g of sodium hydroxide was added to control the pH of the solution. Then, 192 ml of industrial formalin serving as a reducing agent was added to the solution. Immediately thereafter, 0.1 g of stearic acid was added to the solution to obtain a silver slurry. Then, the silver slurry thus obtained was filtered, washed with water, dried to obtain a silver powder. Then, the surface of the silver powder thus obtained was smoothed by a surface smoothing process using a high-speed mixer, and the silver powder thus smoothed was classified to remove silver agglomerates having a greater diameter than 11 μm.

[0038] The particle diameters of the silver powder thus obtained were measured by Microtrack. As a result, D10 was 1.7 μm, and D50 was 3.1 μm. In...

example 3

[0047] To 3600 ml of an aqueous solution containing 12 g / l silver nitrate as silver ions, 180 ml of industrial aqueous ammonia was added to form an aqueous silver ammine complex solution. To the aqueous silver ammine complex solution thus formed, 7.5 g of sodium hydroxide was added to control the pH of the solution. Then, 192 ml of industrial formalin serving as a reducing agent was added to the solution. Immediately thereafter, 1.5 g of oleic acid was added to the solution to obtain a silver slurry. Then, the silver slurry thus obtained was filtered, washed with water, dried to obtain a silver powder. Then, the surface of the silver powder thus obtained was smoothed by a surface smoothing process using a high-speed mixer, and the silver powder thus smoothed was classified to remove silver agglomerates having a greater diameter than 8 μm.

[0048] The particle diameters of the silver powder thus obtained were measured by Microtrack. As a result, D10 was 1.0 μm, and D50 was 1.8 μm. In ...

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Abstract

There is provided a method for a silver powder capable of decreasing the viscosity of a photosensitive paste using the silver powder and improving the film state, sensitivity and linearity of the paste even if the particle diameter of the silver powder is small. The surface of a silver powder produced by a wet reducing method is smoothed by a surface smoothing process for mechanically causing particles of the silver powder to collide with each other, and thereafter, silver agglomerates are removed by classification. The surface smoothing process is carried out by putting a dried silver powder into an apparatus, which is capable of mechanically fluidizing particles, e.g., a mixer or mill such as a cylindrical high-speed mixer, for mechanically causing the particles to collide with each other.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention generally relates to a silver powder and a method for producing the same. More specifically, the invention relates to a silver powder for a conductive paste for use in electronic parts, such as internal electrodes of multilayer capacitors, conductive patterns of circuit boards, and electrodes of substrates for plasma display panels, and a method for producing the same. [0003] 2. Description of the Prior Art [0004] As a conventional conductive paste for use in electronic parts, such as internal electrodes of multilayer capacitors, conductive patterns of circuit boards, and electrodes of substrates for plasma display panels (PDPs), there is used a silver paste produced by mixing a silver powder and a glass frit in an organic vehicle and kneading them so as to the silver powder in the vehicle. In order to decrease the size of these electronic parts and / or to form a conductive pattern having a high...

Claims

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Application Information

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IPC IPC(8): B22F9/04B22F9/24B22F1/00C22C5/06H01B1/02H01B1/22H01B5/00H01B13/00H01G4/008H01L23/498
CPCB22F9/04B22F9/24H01L2924/0002H01L23/49883H01G4/0085H01B1/02B22F2009/045B22F2998/10C22B11/04C22C5/06H01L2924/00A45D29/02A45D2029/026
InventorOGI, KOZOHASEGAWA, YOSHIO
OwnerDOWA ELECTRONICS MATERIALS CO LTD