Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Polishing composition and polishing method

a technology of composition and polishing method, applied in the field of polishing composition, can solve problems such as polishing composition

Inactive Publication Date: 2007-01-04
OHASHI KEIGO +1
View PDF27 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a polishing composition for use in polishing glass substrates. The composition contains silicon dioxide, an alkaline compound, and water. The invention also provides a method for polishing glass substrates using the prepared polishing composition. The technical effect of the invention is to provide a polishing composition that can effectively polish glass substrates without causing damage or defects.

Problems solved by technology

The first and second prior art polishing compositions, however, do not satisfy the above requirements, and are thus susceptible to improvement.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] One embodiment of the present invention will now be described.

[0014] A glass substrate for an information-recording medium, such as a magnetic disc, is formed of, for example, aluminosilicate glass, soda lime glass, soda aluminosilicate glass, almino borosilicate glass, borosilicate glass, quartz glass, or crystallized glass. The main crystal phase of the crystallized glass may be spodumene, mullite, aluminum borate crystal, β-quartz solid solution, α-quartz, cordierite, enstatite, celsian, wollastonite, anorthite, forsterite, lithium metasilicate, or lithium disilicate. A glass substrate is usually provided to a chemical machine polishing (CMP) process so as to have the surface thereof mirror-finished.

[0015] Typically, the process of polishing a glass substrate is divided into a plurality of polishing steps to be conducted, for the purpose of improving the stock removal rate, as well as the quality of the surface of the polished glass substrate. The plurality of polishing ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
mean particle diameter DSAaaaaaaaaaa
mean particle diameter DSAaaaaaaaaaa
mean particle diameter DN4aaaaaaaaaa
Login to View More

Abstract

A polishing composition contains silicon dioxide, an alkaline compound, and water. Silicon dioxide is, for example, colloidal silica, fumed silica, or precipitated silica. The alkaline compound is, for example, ammonium carbonate, potassium carbonate, sodium carbonate, ammonium hydrogen carbonate, potassium hydrogen carbonate, sodium hydrogen carbonate, ammonium phosphate, potassium phosphate, sodium phosphate, ammonium hydrogen phosphate, potassium hydrogen phosphate, or sodium hydrogen phosphate. The polishing composition can be suitably used in applications for polishing a glass substrate.

Description

BACKGROUND OF THE INVENTION [0001] The present invention relates to a polishing composition for use in polishing of a glass substrate for an information-recording medium, which is used for a hard disk and the like. The present invention also relates to a polishing method using such a polishing composition. [0002] Conventionally, there is a known polishing composition for use in applications for polishing a glass substrate for an information-recording medium. Japanese Laid-Open Patent Publication No. 2001-89748 discloses a polishing composition (hereinafter referred to as the first prior art polishing composition) containing an abrasive mainly composed of a rare earth oxide such as cerium oxide, and water. Japanese Laid-Open Patent Publication No. 2000-144112 discloses a polishing composition (hereinafter referred to as the second prior art polishing composition) containing an abrasive that comprises at least one selected from the group consisting of an iron-containing oxide and an i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B24D3/02B24B7/30B24B1/00B24B37/00C03C19/00C09G1/02C09K3/14G11B5/84
CPCB24B37/044G11B5/8404C09G1/02
Inventor OHASHI, KEIGOOWAKI, TOSHIKI
Owner OHASHI KEIGO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com