Manufacturing method of semiconductor device and semiconductor device

Abstract

In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.

Description

CROSS-REFERENCE TO RELATED APPLICATION [0001] The present application claims priority from Japanese patent application No. 2003-367435 filed on Oct. 28, 2003, the content of which is hereby incorporated by reference into this application. BACKGROUND OF THE INVENTION [0002] The present invention relates to a method of manufacturing a semiconductor device such as a hybrid integrated circuit device (hybrid IC) and a semiconductor manufacturing apparatus, and to, for example, a technique effective if applied to the manufacture of a semiconductor device built in a cellular phone. [0003] As one manufacturing method of a semiconductor device such as a hybrid integrated circuit device, there is known, for example, a technique for mounting a bare chip and other parts over unit sections of a package base substrate, which can be taken or picked up in multi form, thereafter sealing the bare chip and other parts with an insulating resin to form a sealing resin and then cutting the package base s...

AI Technical Summary

Benefits of technology

[0032] Advantageous effects obtained by representative ones of the inventions disclosed in the present application will be explained in brief as follows:

[0033] (1) A resin layer formed by printing of a silicone resin is subjected to defoaming processing and curing processing (bake processing) after its printing. A heavy substance such as a filler contained in a resin at the defoaming processing long in processing time sinks from the upper surface side to the wiring board side at its lower surface. As a result, the surface of the resin layer is brought to a layer of a resin component hard to tear off. Thus, a compression force merely acts on the layer of the resin component in the surface layer of the resin layer even if the wiring board is divided, in the case of such a division that the wiring board is folded back to the resin layer side. Therefore, the resin portion remains without the division of the wiring board (non-divided resin portion remains). In the dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by means of a lower clamp claw of a clamper, and some of a protruded wiring board portion that protrudes from a conveying chute is pressed against a support body to carry out a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is manufactured.

[0034] (2) A pickup mechanism, which conveys products brought to semiconductor devices by being fractionized, vacuum-adsorbs and holds a semiconductor device at a final stage by a tool but measures the degree of vacuum in its held state. Then, the pickup mechanism is controlled based on information about the degree of vacuum. When the measured degree of vacuum is greater than or equal to the reference degree of vacuum, the pickup mechanism conveys the semiconductor devices to the corresponding non-defective product storage unit. When the degree of vacuum is less than the reference degree of vacuum, the pickup mechanism conveys the semiconductor devices to the corresponding defective product storage unit. Thus, only products in each of which the flatness of the surface of an encapsulating body is satisfactory, can be shipmented. As a result, the pickup of each semiconductor device is done reliably upon the work of mounting of the semiconductor device by a user, thus making it possible to carry out satisfactory mounting.

Problems solved by technology

The patent document 1 has pointed out that a problem arises in that when the sealing resin is formed by a potting method, the surface of the sealing resin is hard to be flattened, and when a semiconductor device manufactured as a result thereof is surface-mounted to a circuit substrate, sorbability based on a vacuum adsorption nozzle is degraded.

Images