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Sealable packaging structures and applications related thereto

Inactive Publication Date: 2008-03-20
JINDAL INNOVATION CENT SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0012]The present invention primarily relates to a composite packaging film structure comprising an outer web substrate, such as paper, adhered to a multi-layer film. The inventive structure may provide improved or comparable barrier properties, seal temperature, and seal strength, as compared to some incumbent prior art composite packaging films, and that further may provide a more simplified packaging film than many of the films that are used in the prior art. In one embodiment, the first substrate is adhered to the second substrate by lamination. Among other advantages, this invention may facilitate replacing the inner “foil / poly” layer of the prior art “paper / poly / foil / poly” structure, with a poly layer that comprises a multilayer polymer film. The term “poly” as used herein is short for “polymer” and may be defined broadly to include polymer-based materials and substrates that are primarily composed of a thermoplastic material but which may also contain non-polymeric components, such as cavitating agents, anti-blocks, hydrocarbon resins, pigments, inks, coating materials, etc., and may refer to a mono-layer film substrate or to a multi-layer film substrate.
[0013]The inventive composite packaging film structure, methods, and related applications are disclosed and claimed, providing improved performance and cost effectiveness as compared to some prior art packaging structures and applications. The inventive packaging structure may comprise as one component thereof, a multi-layer flexible film. The multi-layer film substrate may include an arrangement of co-extruded polymeric layers that contribute individually and collectively to one or more of improved seal strength, impact strength, resilience, hermeticity, and reduced-temperature sealability of the film. More particularly, the inventive packaging film structure may replace the inner, “foil / poly” plies of the incumbent tandem extrusion laminations that are required to produce the traditional “paper / poly / foil / poly” laminations wherein the poly is typically PE. The two outer layers, e.g., the “paper / poly” layers, may still provide the benefits described previously.
[0014]As one advantage, the inventive replacement structure may provide foil-like barrier performance, without the flex cracking, pinhole, and related issues of foil and metallized polymers. As another advantage, the multi-layer film structure may also provide seal performance properties similar to the seal provided by polyethylene or other poly sealant layer that the inventive structure may replace. Also, the multi-layer film may provide the advantage of reducing the cost and time required to prepare the prior art structures, through the elimination of the step of applying the sealant poly layer to the foil. In addition to cost and time savings, the subject packaging structure may create opportunities for film converters that do not have tandem extrusion capability. Further, the inventive film structure may be more microwave heating tolerant than the incumbent structures. These and other objects, features, and advantages of the inventive composite packaging film structure are discussed in more detail in the following discussion, examples, and claims.

Problems solved by technology

However, in practice the foil layer is subject to flex cracking, pin-holing, crazing, and scratching in the packaging structure, and additionally to further deterioration and damage in the seal area due to the sealing function.
The foil is also not very elastic and is subject to damage during film stretching or deformation.
These defects may result in severely impaired performance as compared to flat foil substrate performance, leading to decreased shelf life and product spoilage.
The failure of the foil layer can occur during the packaging process and during the distribution cycle for storage and retailing.
However, these metallized, coated films are not without their own limitations, such as sensitivity to high temperature at high speed, lack of bond strength of the metallized layer, seal strength concerns, hermeticity concerns, package stiffness concerns, and requiring the separate step of applying a sealant layer to the metal layer.
Further, the metallized layer may still suffer the other deficiencies of foil and may be especially sensitive to scratching and related defects as compared to foil.
Though each of the above films represented a variety of improvements related to packaging films, none of the above films combine desired improvements in processability, seal strength, impact strength, hermeticity, durability, and sufficiently reduced seal temperatures for some of today's challenging packaging operations.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

Control

[0109]An opaque, oriented, five-layer film having an A / B / C / D / E structure is prepared as a control film. The A layer is an outer skin layer (4 ga.) comprising an EVOH polymer (Eval G176B from Kuraray Company Ltd. of Japan). The B layer is a tie layer (12 ga.) comprising 50 wt % of an adhesive resin (Admer AT1179A) and 50 wt % of Total 3371 isotactic polypropylene homopolymer resin (Total 3371). The C layer is a core layer comprising 90 wt % of an isotactic polypropylene homopolymer (Total 3371) and 10 wt % PBT cavitating agent. The D layer is a tie layer (12 ga.) comprising 100 wt % Total 3371. The E layer is a sealant layer (5 ga.) comprising an EPB terpolymer (JPC XPM7794 from JPC Company). This film has a target polygauge thickness of 0.9 mil and a 1.1 mil target optical gauge.

example 2

Control

[0110]An opaque, oriented, five-layer film having an A / B / C / D / E structure is prepared. The A layer is an outer skin layer (4 ga.) comprising an EVOH polymer (Eval G176B from Kuraray Company Ltd. of Japan). The B layer is a tie layer (9 ga.) comprising 50 wt % of an adhesive resin (Admer AT1179A) and 50 wt % of 3371 isotactic polypropylene homopolymer resin (Total 3371). The C layer is a core layer comprised of about 83 wt % Total 3371, 10 percent first polymer (Adflex T100F “Cataloy™, ” an EP copolymer having a relatively high elastomer content, from Basell Company), and 10 wt % calcium carbonate. The D layer is a tie layer (15 ga.) comprising 100 percent Total 3371. The E layer is a sealant layer (10 ga.) comprising an EPB terpolymer (JPC XPM7800 from JPC Company) and 1.2 wt % silicone oil (migratory slip agent) and 2300 ppmw of an anti-blocking agent (Sylobloc 44 from Grace Davison Products) processing additive. This film has a 0.9 mil polygauge target and a 1.1 mil optical ...

example 3

[0111]An opaque, oriented, five-layer film having an A / B / C / D / E structure is prepared according to an embodiment of the present invention. The A layer is an outer skin layer (4 ga.) comprising Eval G176B (EVOH). The B layer is a tie layer (12 ga.) comprising 50 wt % of an adhesive resin (Admer AT1179A, from Mitsui Polymers) and 50 wt % of Total 3371. The C layer is a core layer comprised of about 84 wt % Exxon 4612 PP, about 10 wt % Adflex T100F Catalloy™ EP copolymer as a first polymer, and about 6 wt % calcium carbonate as a cavitating agent. The D layer is a tie layer (15 ga.) comprising 25 wt % Exxon 4612 and 75 wt % Basell Adflex T100F as a first polymer. The E layer is a sealant layer (10 ga.) comprising JPC XPM7800 EPB terpolymer from JPC Company, 1.2 wt % silicone oil, and 2300 ppm Sylobloc 44. This film has a 0.9 mil polygauge target and a 1.1 mil optical gauge target. Thus, the C layer (core layer) and D layer (tie layer) differ from that in Control Examples 1 and 2 in that...

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Abstract

Heat-sealable, multi-layer composite packaging structures that are suitable for packaging and having improved sealing properties and simplified construction as compared to prior art composite film constructions are disclosed. The inventive film structure includes a first substrate, such as paper, bonded such as by extrusion lamination, to a sealable, high-barrier film. This inventive “paper-adhesive-polymer” lamination may replace prior art “paper-adhesive-foil-adhesive” foil-based tandem laminations. An improved or comparable polymer film substrate may replace the “foil-adhesive” layer components of the popular incumbent prior art structure.

Description

TECHNICAL FIELD[0001]This invention relates generally to composite heat-sealable packaging films structures including a multi-layer polymer film web substrate and another substrate therein. At least one of the substrates is at least in part, polymer-film based. More specifically, this invention relates to a composite packaging film structure that includes a multi-layer polymer film that contains first polymer components in a core layer and in a tie layer of the multi-layer film. The first polymer components have a particular range of properties that may impart improved seal properties to the composite film structure. The composite structure also facilitates replacement of a traditional incumbent prior art sealable high barrier packaging structure with an improved or alternative packaging structure.BACKGROUND OF THE INVENTION[0002]Multi-layer polymer films are widely used in packaging applications, such as bags and pouches for granular, particulate, individual, powder and liquid type...

Claims

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Application Information

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IPC IPC(8): B32B15/04B32B27/10B32B27/32C23C16/00B05D1/36B32B23/08
CPCB32B27/32B65D65/42Y10T428/1352Y10T428/1355Y10T428/1307Y10T428/1334Y10T428/1362Y10T428/31899Y10T428/31678Y10T428/31938
Inventor REHKUGLER, RICHARD ALANPELLINGRA, SALVATORE JAMESCRETEKOS, GEORGE FORMANAMBROISE, BENOIT
Owner JINDAL INNOVATION CENT SRL
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