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Multi-component electronic package with planarized embedded-components substrate

a technology of embedded components and electronic packages, applied in the direction of electrical apparatus contruction details, semiconductor/solid-state device details, manufacturing tools, etc., can solve the problems of compromising package performance, fragile final package form, and inability to use silicon substrates in single-sided applications, etc., to achieve low profile, improve electrical performance of the package, and small footprint

Inactive Publication Date: 2008-05-29
ATMEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is a method of assembling a multi-component electronic package by embedding microelectronic components into a substrate and then adding circuit features and interconnects to connect them. This results in a compact, integrated package with improved performance and a smaller footprint. The method eliminates standard die-attach, wire bond or flip-chip attach processes. The technical effects of this invention include improved performance, reduced size, and more efficient use of package footprint area.

Problems solved by technology

A silicon substrate can only be used in single-sided applications and is often fragile in the final package form.
The resultant longer interconnect lengths can also compromise package performance.

Method used

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  • Multi-component electronic package with planarized embedded-components substrate
  • Multi-component electronic package with planarized embedded-components substrate
  • Multi-component electronic package with planarized embedded-components substrate

Examples

Experimental program
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Embodiment Construction

[0010]With reference to FIGS. 1A and 1B, a wafer 10 forms a substrate 12 for one or more IC chip packages. When cut into sections, e.g., 141, 142, 143, 144, each of those sections of the wafer 10 will define a separate package. The substrate 12 is typically composed of a dielectric material, such ceramics, glass, or plastics (e.g., epoxy, polyimide, or fluoropolymers). The substrate 12 has open cavities 16 into which IC die and other discrete electronic components will be placed. The width and length dimensions of the open cavities 16 are normally slightly larger than the components that will be inserted to allow tolerance for variations in the individual component size and room for adding an adhesive compound between the components and the inner periphery of the cavities 16.

[0011]Conductive vias 18 through the substrate 12 provide electrical pathways between the designated front and back surfaces 22F and 22B of the substrate 12 upon which electrical interconnects and other circuit ...

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PUM

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Abstract

An electronic multi-component package is assembled by placing multiple electronic components within multiple openings of a package substrate, then depositing and curing adhesive filler in gaps between the components and the inner peripheries of the openings. Circuit features, including conductive interconnects, are formed by thin-film photolithography over both front and back surfaces of the package substrate. Preformed conductive vias through the package substrate provide electrical connection between circuit features on opposite substrate surfaces. Additional electronic components may be attached to conductive lands on at least one side of the package. The circuit features also include contact pads for external package connections, such as in a ball-grid-array or equivalent structure.

Description

TECHNICAL FIELD [0001]The present invention relates to integrated circuit (IC) chip packages and the mounting of one or more IC dice to a support substrate and / or frame together with associated circuit components and interconnects.BACKGROUND ART [0002]Multi-component electronic packages and system-in-package (SIP) packages that are employed in the electronics industry today all utilize substrates for device inter-connection and attachment. Typical organic substrate materials are epoxy-glass, polyimide, and fluoropolymer laminates. Typical inorganic substrate materials are ceramics, low-temperature co-fire ceramics (LTCC) and silicon. The interconnect circuitry and component attach features are fabricated onto the substrates prior to components assembly.[0003]With the exception of a silicon substrate, which employs thin-film metal deposition processes for the circuitry fabrication to yield line geometries on the order of one micrometer, all of the other substrate materials yield line...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K7/02B23P19/04H01L21/027
CPCH01L21/561Y10T29/49133H01L21/6835H01L23/5389H01L24/24H01L24/82H01L25/03H01L25/0652H01L25/16H01L2224/16227H01L2224/24011H01L2224/2518H01L2224/48091H01L2224/48227H01L2924/01013H01L2924/01027H01L2924/01058H01L2924/01078H01L2924/01082H01L2924/09701H01L2924/14H01L2924/19042H05K1/185H05K3/4602H05K2203/0165H05K2203/085H05K2203/1469H01L21/568Y10T29/53183Y10T29/49165Y10T29/4913H01L2224/97H01L2224/73267H01L24/97H01L24/96H01L24/48H01L2924/01005H01L2924/01006H01L2924/01023H01L2924/01033H01L2924/01076H01L2924/014H01L2224/16225H01L2224/0401H01L2224/04105H01L2924/00014H01L2224/81H01L2224/85H01L24/19H01L2924/181H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207
Inventor LAM, KEN M.
Owner ATMEL CORP
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