Manufacturing method and manufacturing apparatus of magnetoresistance elements
a manufacturing apparatus and technology of magnetoresistance elements, applied in vacuum evaporation coatings, cathode sputtering applications, coatings, etc., can solve the problems that conventional sputtering apparatuses cannot cope with reproducible formation of high quality films, and achieve high characteristic gmr elements, improve film flatness, and improve production yield
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
Problems solved by technology
Method used
Image
Examples
embodiment 1
[0054]As an example of manufacturing methods of this invention, a method used for manufacturing a GMR element having a multilayered structure shown in FIG. 9A will be explained.
[0055]FIG. 1 is an apparatus suitably used for manufacturing the magnetoresistance element shown in FIG. 9A. The manufacturing apparatus is composed of a first sputtering chamber 22 for forming a buffer layer Ta and an anti-ferromagnetic layer PtMn, a second sputtering chamber 23 for forming a pinned magnetic layer (CoFe / Ru / CoFe), a low-pressure sputtering chamber 20 for forming a non-magnetic intermediate layer Cu at a low pressure of 10−3 Pa or less, a third sputtering chamber 24 for forming a free magnetic layer (CoFe / NiFe) and a passivation layer Ta, a load lock chamber 21 which stores cassettes holding a plurality of substrates, and a transfer chamber 27 in which a robot 28 is installed to transfer a substrate. The chambers 20-24 are connected through gate valves 26 to the periphery of the transfer chamb...
embodiment 2
[0077]In this embodiment, a manufacturing method of a TMR element shown in FIG. 9B will be explained by referring to a manufacturing apparatus shown in FIG. 2 which is preferably used for manufacturing the TMR element.
[0078]The manufacturing apparatus is composed of a first sputtering chamber 22 for forming a buffer layer Ta and an anti-ferromagnetic layer PtMn, a second sputtering chamber 23 for forming a pinned magnetic layer (CoFe / Ru / CoFe), a low-pressure sputtering chamber 20 for forming an aluminum film at a low pressure of 8.0×10−3 Pa or less for a tunnel barrier layer use, an oxidation chamber 25 to oxidize the aluminum film to form a tunnel barrier layer Al2O3, a third sputtering chamber 24 for forming a free magnetic layer (CoFe / NiFe) and a passivation layer Ta, a load lock chamber 21 which stores cassettes holding a plurality of substrates, and a transfer chamber 27 in which a robot 28 is installed to transfer a substrate. These chambers 20-25 are connected through gate va...
PUM
| Property | Measurement | Unit |
|---|---|---|
| pressure | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| pressure | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


