Magnetoresistive element and method of manufacturing the same
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example 1
[0146]The magnetoresistive element shown in FIG. 1B was prepared in this example. The structure of the magnetoresistive element in Example 1 is as follows:
Lower electrode 11
Underlayer 12: Ta [1 nm] / Ru [2 nm]
Pinning layer 13: Ir22Mn78 [7 nm]
Pinned layer 14: Co90Fe10 [4 nm] / Ru [0.85 nm] / Co90Fe10 [4 nm]
Spacer layer (all metal) 16: Cu [3 nm]
Lower free layer 181: Co90Fe10 [2 nm]
SF layer 21: (nitride of Fe80Co20 [0.4 nm])×5 layers prepared by the method in FIGS. 4A to 4E
Upper free layer 182: Co90Fe10 [2 nm]
Cap layer 19
Upper electrode 20.
[0147]Now, a method of forming the free layer including the SF layer after the layers to the spacer layer 16 are deposited will be described. When the free layer including the SF layer is formed as in this example, a magnetic layer having half the thickness of the usual free layer is deposited and then the SF layer 21 is formed thereon. In this example, Co90Fe10 of 2 nm in thickness was deposited as the lower free layer 181.
[0148]Then, in the step of FIG. ...
example 2
[0150]A magnetoresistive element was prepared in the same manner as in Example 1 except that (nitride of Co64Fe16B20 [0.4 nm])×5 layers prepared by the method in FIGS. 4A to 4E was used as the SF layer 21.
example 3
[0151]A magnetoresistive element was prepared in the same manner as in Example 1 except that (nitride layer of Fe50Co50 [0.4 nm])×5 layers prepared by the method in FIGS. 4A to 4E was used as SF layer 21.
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