Backside illuminated image sensor with shallow backside trench for photodiode isolation

a photodiode and image sensor technology, applied in the field of backside illumination image sensors, can solve the problems of affecting the fill factor and quantum efficiency many carriers generated by the photodiodes from incident light are lost before, etc., and achieve the effect of increasing the size or cost of the image sensor, improving the performance of such a devi

Inactive Publication Date: 2010-01-14
EASTMAN KODAK CO
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0017]A backside illuminated image sensor in accordance with the invention may be advantageously implemented in a digital camera or other

Problems solved by technology

However, the presence of metallization level interconnects and various other features associated with the dielectric layers on the frontside of the image sensor can adversely impact the fill factor and quantum efficiency of the image sensor.
However, in many backside illuminated image sensors, charge storage regions associa

Method used

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  • Backside illuminated image sensor with shallow backside trench for photodiode isolation
  • Backside illuminated image sensor with shallow backside trench for photodiode isolation
  • Backside illuminated image sensor with shallow backside trench for photodiode isolation

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Embodiment Construction

[0022]The present invention will be illustrated herein in conjunction with particular embodiments of digital cameras, backside illuminated image sensors, and processing techniques for forming such image sensors. It should be understood, however, that these illustrative arrangements are presented by way of example only, and should not be viewed as limiting the scope of the invention in any way. Those skilled in the art will recognize that the disclosed arrangements can be adapted in a straightforward manner for use with a wide variety of other types of imaging devices and image sensors.

[0023]FIG. 1 shows a digital camera 10 in an illustrative embodiment of the invention. In the digital camera, light from a subject scene is input to an imaging stage 12. The imaging stage may comprise conventional elements such as a lens, a neutral density filter, an iris and a shutter. The light is focused by the imaging stage 12 to form an image on an image sensor 14, which converts the incident ligh...

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Abstract

A backside illuminated image sensor comprises a sensor layer implementing a plurality of photosensitive elements of a pixel array, an oxide layer adjacent a backside surface of the sensor layer, and at least one dielectric layer adjacent a frontside surface of the sensor layer. The sensor layer further comprises a plurality of backside trenches formed in the backside surface of the sensor layer and arranged to provide isolation between respective pairs of the photosensitive elements. The backside trenches have corresponding backside field isolation implant regions formed in the sensor layer, and the resulting structure provides reductions in carrier recombination and crosstalk between adjacent photosensitive elements. The image sensor may be implemented in a digital camera or other type of digital imaging device.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]The present invention is related to the inventions described in commonly-assigned U.S. Patent Applications Kodak Docket No. 94870, entitled “Color Filter Array Alignment Mark Formation in Backside Illuminated Image Sensors,” Kodak Docket No. 94872, entitled “Wafer Level Processing for Backside Illuminated Image Sensors,” and Kodak Docket No. 94889, entitled “Backside Illuminated Image Sensor with Reduced Dark Current,” which are concurrently filed herewith. The disclosures of these related applications are incorporated by reference herein in their entirety.FIELD OF THE INVENTION[0002]The present invention relates generally to electronic image sensors for use in digital cameras and other types of imaging devices, and more particularly to processing techniques for use in forming backside illuminated image sensors.BACKGROUND OF THE INVENTION[0003]A typical electronic image sensor comprises a number of light sensitive picture elements (“pixel...

Claims

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Application Information

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IPC IPC(8): H01L31/00H01L21/00
CPCH01L27/1463H01L27/1464H01L27/14687H01L27/14632H01L27/146
Inventor BRADY, FREDERICK T.
Owner EASTMAN KODAK CO
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