Radio frequency interconnect circuits and techniques

Active Publication Date: 2010-02-11
RAYTHEON CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0012]As mentioned above, the relatively high cost of phased arrays has precluded the use of phased arrays in all but the most specialized applications. Assembly and component costs, particularly for active transmit/receive channels, are major cost drivers. Phased array costs can be reduced by utilizing batch processing and minimizing touch labor of components and assemblies. It would be advantageous to provide a tile sub-array for an Active, Electronically Scann

Problems solved by technology

As mentioned above, the relatively high cost of phased arrays has precluded the use of phased arrays in all but the most spec

Method used

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  • Radio frequency interconnect circuits and techniques
  • Radio frequency interconnect circuits and techniques
  • Radio frequency interconnect circuits and techniques

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Embodiment Construction

[0041]Before describing the various embodiments of the invention, it should be noted that reference is sometimes made herein to an array antenna having a particular array shape and / or size (e.g., a particular number of antenna elements or a particular number of tiles) or to an array antenna comprised of a particular number of “tile sub-arrays” (or more simply “tiles”). One of ordinary skill in the art will appreciate that the techniques described herein are applicable to various sizes and shapes of array antennas.

[0042]Similarly, reference is sometimes made herein to tile sub-arrays having a particular geometric shape (e.g. square, rectangular, round) and / or size (e.g., a particular number of antenna elements) or a particular lattice type or spacing of antenna elements. One of ordinary skill in the art will appreciate that the techniques described herein are applicable to various sizes and shapes of array antennas as well as to various sizes and shapes of tile sub-arrays.

[0043]Thus,...

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Abstract

A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a Divisional of co-pending application Ser. No. 11 / 533,848 filed on Sep. 21, 2006.FIELD OF THE INVENTION[0002]This invention relates generally to phased array antennas adapted for volume production at a relatively low cost and having a relatively low profile and more particularly to radio frequency (RF) circuits and techniques utilized in phased array antennas.BACKGROUND OF THE INVENTION[0003]As is known in the art, a phased array antenna includes a plurality of antenna elements spaced apart from each other by known distances coupled through a plurality of phase shifter circuits to either or both of a transmitter or receiver. In some cases, the phase shifter circuits are considered to be part of the transmitter and / or receiver.[0004]As is also known, phased array antenna systems are adapted to produce a beam of radio frequency energy (RF) and direct such beam along a selected direction by controlling the phase (via the...

Claims

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Application Information

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IPC IPC(8): H03H7/38
CPCH01Q21/0087H05K1/0251H05K1/116H05K3/429H05K3/4623H05K2201/09454Y10T29/49165H05K2201/09718H05K2201/09727H05K2203/061H05K2201/09145H05K2201/209H03H7/38H05K2201/09536
Inventor PUZELLA, ANGELO M.CROWDER, JOSEPH M.DUPUIS, PATRICIA S.FALLICA, MICHAEL C.FRANCIS, JOHN B.LICCIARDELLO, JOSEPH A.
Owner RAYTHEON CO
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