Radio frequency interconnect circuits and techniques

US20100033262A1Active Publication Date: 2010-02-11RAYTHEON CO
23 Cites 11 Cited by

Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
RAYTHEON CO
Publication Date
2010-02-11

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Abstract

A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.
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Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a Divisional of co-pending application Ser. No. 11 / 533,848 filed on Sep. 21, 2006.FIELD OF THE INVENTION

[0002] This invention relates generally to phased array antennas adapted for volume production at a relatively low cost and having a relatively low profile and more particularly to radio frequency (RF) circuits and techniques utilized in phased array antennas.BACKGROUND OF THE INVENTION

[0003] As is known in the art, a phased array antenna includes a plurality of antenna elements spaced apart from each other by known distances coupled through a plurality of phase shifter circuits to either or both of a transmitter or receiver. In some cases, the phase shifter circuits are considered to be part of the transmitter and / or receiver.

[0004] As is also known, phased array antenna systems are adapted to produce a beam of radio frequency energy (RF) and direct such beam along a selected direction by controlling the phase (via the...

Claims

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