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Copper alloy material for electric/electronic parts and method of producing the same

a technology of copper alloy and electric/electronic parts, applied in the direction of conductive materials, conductive materials, conductors, etc., can solve the problems of complex and severe bending of connectors or terminals, low mechanical strength of beryllium copper, and high achieve excellent solder adhesive strength and bending properties, and excellent mechanical strength and electrical conductivity. good

Inactive Publication Date: 2011-08-04
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0068]The first embodiment of the present invention can provide a copper alloy material favorable for the use in electric / electronic equipments, which is excellent in mechanical strength, conductivity, and stress relaxation resistance.
[0069]The second embodiment of the present invention can provide a copper alloy material favorable for the use in electric / electronic equipments, which is high in mechanical strength and electrical conductivity, and is excellent in solder wettability, solder adhesive strength and bending property.
[0070]The third embodiment of the present invention can provide a copper alloy material favorable for the use in electric / electronic equipments, which is excellent in mechanical strength, electrical conductivity, and bending property.
[0071]Other and further features and advantages of the invention will appear more fully from the following description, appropriately referring to the accompanying drawings.

Problems solved by technology

Further, it is also well known that beryllium copper is expensive.
On the other hand, pure copper (C11000), tin bearing copper (C14410), and the like, which have a high electrical conductivity, have a drawback that their mechanical strength is low.
Particularly, among the parts for electronic equipments of recent years, there are many connectors or terminals that have been subjected to complicated and severe bending, concomitantly with the size reduction of electronic equipments.
On the other hand, the material of connectors and terminals to be used is becoming thinner concomitantly with the size reduction.
In order to enhance the mechanical strength, it is considered effective to increase the final cold rolling ratio; however, if the cold rolling ratio is increased, there is a tendency that the bending property is noticeably deteriorated.
However, beryllium copper is such that beryllium, which is an additive element, is regarded as an environmental burden material, and there is a demand for a substitute material.
Furthermore, Corson copper or titanium copper generally does not have an electrical conductivity of 50% IACS or higher.

Method used

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  • Copper alloy material for electric/electronic parts and method of producing the same

Examples

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example 1

[0163]Alloys (1a to 36a and 1b to 24b) containing the components shown in Tables 1 and 2, with the balance composed of Cu and inevitable impurities, were melted with a high-frequency melting furnace, followed by casting at a cooling speed from 10 to 30 K / sec, to obtain ingots with thickness 30 mm, width 100 mm, and length 150 mm, respectively.

[0164]The thus-obtained ingots were kept at a temperature from 930 to 970° C. for 0.5 to 1.0 hour, followed by hot rolling to produce hot rolled sheets with a sheet thickness t=12 mm. After the hot rolling, both surfaces of the sheets were face-milled to reduce a thickness of 1 mm, respectively, to be a sheet thickness t=10 mm, and then the sheets were finished to have a sheet thickness t=0.3 mm by cold rolling. After the cold rolling, the sheets were subjected to a recrystallization heat treatment at a temperature from 700° C. to 1,025° C. The thus-prepared materials were subjected to any one of the following two processes, to produce final pr...

example 2

[0179]Copper alloy base material containing the components shown in Tables 3 and 4, with the balance composed of Cu and inevitable impurities, were melted with the high-frequency melting furnace, followed by cooling at a cooling speed from 10 to 30 K / sec, to obtain ingots with thickness 30 mm, width 100 mm, and length 150 mm, respectively.

[0180]In Cu alloy to which Si is added, there are many known literatures, in which O (oxygen) content in a raw material or a material is restricted. However, when an element having higher oxidation property than Cu is added, if O is present, such the element oxidizes earlier than Cu, and therefore, the yield ratio of Si, which is an additive element, is not stabilized. Therefore, restricting the O concentration in the raw material or the material is a technique well-known to the person ordinary skilled in the art, in the case of adding an element having stronger oxidation property than Cu. Similarly, there are many known literatures, in which H (hy...

example 3

[0199]Alloys containing the components shown in Table 5, with the balance composed of Cu and inevitable impurities, were melted with the high-frequency melting furnace, followed by casting at a cooling speed from 10 to 30 K / sec, to obtain ingots with width 160 mm, thickness 30 mm, and length 180 mm, respectively. Cooling was carried out under the conditions of temperature, in which any crack or the like was generated in the ingots.

[0200]The thus-obtained ingots were kept at a temperature of 1,000° C. for 30 minutes, followed by hot rolling to produce hot rolled sheets with a sheet thickness t=12 mm. After the hot rolling, both surfaces of the sheets were face-milled to reduce a thickness of 1 mm, respectively, to be a sheet thickness t=10 mm, and then the sheets were finished to have a sheet thickness t=0.3 mm by cold rolling. After the cold rolling, the sheets were subjected to a recrystallization heat treatment at a temperature from 800° C. to 1,025° C. The temperature of the recr...

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Abstract

A copper alloy material for an electric / electronic part, having a composition comprising Co 0.5 to 2.0 mass % and Si 0.1 to 0.5 mass %, with the balance of Cu and inevitable impurities, in which a copper alloy of a matrix has a grain size of 3 to 35 μm, a precipitate composed of Co and Si has a particle size of 5 to 50 nm, the precipitate has a density of 1×108 to 1×1010 number / mm2, and the copper alloy material has a tensile strength of 550 MPa and an electrical conductivity of 50% IACS or more.

Description

TECHNICAL FIELD[0001]The present invention relates to a part for an electric / electronic equipment, for example, a connector, a terminal material, and the like. Especially, the present invention relates to a copper alloy material applicable to electric / electronic parts, such as a high-frequency relay and a switch, which are desired to be high in electrical conductivity, or to a connector, a terminal material, which are, for example, mounted in vehicles, and a lead frame.BACKGROUND ART[0002]Hitherto, copper alloys, such as brass (C26000), phosphor bronze (C51910, C52120, C52100), beryllium copper (C17200, C17530), and Corson-series copper alloy (hereinafter, also simply referred to as Corson copper, for example, C70250), and the like, have been used for parts for electric / electronic equipments, such as connectors, terminals, relays, switches, and the like. Herein, the term “Cxxxxx” denotes types of copper alloys specified in CDA (Copper Development Association).[0003]In recent years, ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C22F1/08C22C9/10C22C9/02C22C9/04C22C9/06
CPCC22C9/06C22C9/10H01B1/023C22F1/08C22F1/00
Inventor MIHARA, KUNITERUMATSUO, RYOSUKEEGUCHI, TATSUHIKO
Owner FURUKAWA ELECTRIC CO LTD
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