Plasma Deposition of Amorphous Semiconductors at Microwave Frequencies
a technology of amorphous semiconductors and microwave frequencies, applied in the field of plasma chemistry and physics, to achieve the effects of preventing or slowing down relaxation or decay, maximizing fluorine concentration, and increasing the porosity of the product film
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example 1
[0085]In this example, selected compositional and optical absorption characteristics of representative thin film materials comprising amorphous silicon in accordance with the instant invention are described. The materials are denominated Sample 547 and Sample 548 and were prepared in a deposition system similar to that shown in FIG. 4 that included a single microwave applicator with a single conduit passing therethrough and a single supplemental inlet for delivering a non-energized supplemental material stream. The conduit was made from sapphire and the substrate was positioned about 4 inches from the interface of the conduit with the deposition chamber. A mixture of 1 standard liter per minute of SiF4 and 2 standard liters per minute of argon was introduced to the conduit of the microwave applicator and activated with microwave radiation at a frequency of 2.45 GHz and a power of 600 W. SiH4 was introduced at a rate of 1 standard liter per minute to the deposition chamber through th...
example 2
[0100]In this example, the effect of process gas ratio on the deposition rate and photoconductivity of representative materials comprising amorphous silicon in accordance with the instant invention is described. The samples were prepared using the deposition system described in Example 1 hereinabove. A mixture of 1 standard liter per minute of SiF4 and 2 standard liters per minute of argon was introduced to the conduit of the microwave applicator and activated with microwave radiation at a frequency of 2.45 GHz and a power of 600 W. Instead of SiH4, however, disilane (Si2H6) was introduced to the deposition chamber through the supplemental delivery port and delivered as an electrically-neutral material stream. The flow rate of disilane was systematically adjusted to provide a series of samples for which the ratio of the flow rate of disilane to the ratio of the flow rate of SiF4 ranged from 0.3 to 2.0. The energized stream of SiF4 and argon exiting the conduit of the microwave appli...
example 3
[0105]In this example, the effect of substrate temperature on the deposition rate and photoconductivity of representative materials comprising amorphous silicon in accordance with the instant invention is described. The samples were prepared using the deposition system described in Example 1 hereinabove. A mixture of 1 standard liter per minute of SiF4 and 2 standard liters per minute of argon was introduced to the conduit of the microwave applicator and activated with microwave radiation at a frequency of 2.45 GHz and a power of 600 W. Instead of SiH4, however, disilane (Si2H6) was introduced at a rate of 1 standard liter per minute to the deposition chamber through the supplemental delivery port. The disilane was delivered in an electrically-neutral state. The Si2H6 / SiF4 flow rate ratio was fixed at 1.0 in these experiments. The energized stream of SiF4 and argon exiting the conduit of the microwave applicator and the non-energized stream of disilane supplied by the supplemental d...
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