Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
a technology of patterning conductive material and micrometric direct-write, applied in the direction of nanotechnology, liquid/solution decomposition chemical coating, application, etc., can solve the problems of many methods limited to micron level manufacturing, difficult metal processing, and many other problems, to achieve the effect of excellent control, excellent registration and versatility, and avoiding clogging of nozzles or pipettes
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embodiment 1
Cantilever Microdeposition
[0207]In a first embodiment, the invention provides a method for fabricating micrometer-scale and submicrometer-scale patterns using a cantilever or microbrush, the method comprising (1) providing a cantilever or microbrush; (2) providing an ink, meaning a chemical compound or a mixture thereof, disposed on said cantilever or microbrush; (3) providing a substrate surface; and (4) contacting the microbrush and the substrate surface so that ink is delivered from the cantilever or microbrush to the substrate surface. FIG. 36 illustrates the principle of this method.
[0208]Preferably, the smallest lateral dimension of the resulting pattern (measured parallel to the substrate surface, e.g. the width of a line) ranges from 0.5 micron to 15 microns. Its largest lateral dimension (e.g. the length of a line) exceeds 100 microns and preferably 200 microns, and its height (e.g. measured substantially orthogonally to said local plane) ranges from 1 nm to 2 microns.
[0209...
embodiment 2
Cantilever Microdeposition and Curing for Producing Conductive Metallic and Other Patterns
[0238]In a preferred embodiment, for example, the invention provides a method for writing conductive metal comprising: (1) providing a cantilever having a cantilever end, wherein the cantilever can comprise a tip at the end or can be a tipless cantilever; (2) providing an inkdisposed at the cantilever end; (3) providing a substrate surface; and (4) contacting the cantilever end and the substrate surface so that ink is delivered from the cantilever end to the substrate surface. The deposition is preferably followed by localized heat curing step e.g. by use of a medium-power laser or an infrared gun.
[0239]In another preferred embodiment, stamp tips are used to deposit material which are described further below. Stamp tips are described in, for example, U.S. provisional patent application 60 / 544,260 entitled “Direct-Write Nanolithography with Stamp Tip: Fabrication and Applications” to H. Zhang et...
working example 1
[0262]Nanoscale features of platinum using a precursor ink consisting of 10 mg / 100 μL hydrogen hexachloroplatinate (IV) hydrate dissolved in 20% Millipore water and 80% ethylene glycol have been written. This ink can be written onto clean glass or silicon oxide substrates using the DPN printing technique. For micron sized patterns a tipless cantilever gives the optimal control over pattern size and thickness, whereas for nanoscale patterns a cantilever with an ultrasharp tip (e.g. silicon nitride) on the end of a flexible cantilever offers the optimal resolution. After deposition the precursor patterns are converted to metal features by heating with a hot plate or a hot air gun. This curing or conversion reaction occurs rapidly (several seconds) at temperatures around 250° C. The thickness of the patterns can be increased by adding layers of ink in between curing steps. FIG. 10 shows layered nanoscale patterns generated on silicon oxide using this ink. A similar method was used to d...
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Abstract
Description
Claims
Application Information
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