Method of manufacturing microstructures of metal lines
a technology of metal lines and microstructures, applied in the direction of dielectric characteristics, instruments, semiconductor/solid-state device details, etc., can solve the problems of increased manufacturing cost, slower response speed, and increased manufacturing cost, so as to reduce the cost of fabricating, improve the transmission and invisibility of metal lines, and thin metal lines
Inactive Publication Date: 2015-12-03
J TOUCH CORPORATION
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- Abstract
- Description
- Claims
- Application Information
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Benefits of technology
The present invention is about a method of making microstructures of metal lines. Using this method, the metal line is made thinner, which reduces the cost of fabrication and improves its transparency and invisibility. The method also allows for precise control over the line width, which increases yield and minimizes metal oxidation. Additionally, this method can simultaneously form the metal lines for both the touch panel's visible touch zone and non-contact wiring part, simplifying the fabrication process and reducing costs.
Problems solved by technology
For example, the electrical resistance is higher, the response speed is slower, more fabricating steps are required, and the fabricating cost is higher.
As known, it is difficult to control the precision of the metal line by the printing process.
In particular, it is difficult to produce the metal line with the width smaller than 5 μm by using the printing process.
That is, the performance, the transparency and the line invisibility are usually unsatisfied.
The procedure of fabricating the stencil and washing the stencil may increase the fabricating cost of the metal line.
Moreover, after many printing cycles, the stencil is usually subjected to deformation and thus the printing accuracy of the stencil is deteriorated.
The way of frequently replacing the stencil may increase the overall cost.
Under this circumstance, the fabricating cost is largely increased, the metal line is readily broken, and the yield is reduced.
Moreover, in case that the metal line is made of silver, aluminum or copper, the metal line is possibly oxidized.
The process of preventing oxidation also increases the fabricating complexity and the fabricating cost.
Method used
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[0019]The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for purpose of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.
[0020]FIGS. 1A˜1E are schematic cross-sectional views illustrating a method of manufacturing microstructures of metal lines according to a first embodiment of the present invention. FIG. 2 is a flowchart illustrating the method of manufacturing microstructures of metal lines according to the first embodiment of the present invention.
[0021]Firstly, as shown in FIG. 1A and the step S20 of FIG. 2, a substrate 11 is provided. The substrate 11 is a transparent substrate, a flexible substrate or a flexible transparent substrate. Preferably, the thickness of the substrate 11 is in the range between 20 μm and 800 μm. The substrate 11 is ...
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Abstract
A method of manufacturing a metal line microstructure is provided. Firstly, a substrate is provided. Then, a seed layer is formed on a surface of the substrate. Then, a photoresist layer is formed on a surface of the seed layer, and a photolithography and etching process is performed to form a trench in the photoresist layer, wherein the trench has a specified width. Then, an electroplating process is performed to fill a conductive layer into the trench. Afterwards, the photoresist layer and a portion of the seed layer uncovered by the conductive layer are removed, so that the metal line microstructure is produced.
Description
FIELD OF THE INVENTION[0001]The present invention relates to a method of manufacturing microstructures, and more particularly to a method of manufacturing microstructures of metal lines.BACKGROUND OF THE INVENTION[0002]Nowadays, touch control technologies are widely applied to the touch control devices of various electronic products in order to facilitate the users to control the operations of the electronic products. For achieving the displaying function, the transparent electrode of the conventional touch panel has the transparent property and the electrically-conductive property. For example, the transparent electrode is made of indium tin oxide (ITO). As the trend of designing the touch panel is gradually toward the large-sized touch panel, the fabricating method and the structure of the transparent electrode have many disadvantages. For example, the electrical resistance is higher, the response speed is slower, more fabricating steps are required, and the fabricating cost is hi...
Claims
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Login to View More IPC IPC(8): C25D5/02C25D5/34C25D5/48C23F1/02
CPCC25D5/02C25D5/48C25D5/34C23F1/02C25D7/123G06F3/047G06F2203/04103G06F2203/04112H05K3/108H05K3/16H05K3/244H05K3/282H05K2201/0108H05K2201/10053H05K2203/121B81C1/00G03F7/00H01B13/00H01L23/043
InventorYEH, YU-CHOUHU, CHIH-MINGTSUI, CHIU-CHENG
OwnerJ TOUCH CORPORATION