Cooled electronics package with stacked power electronics components

a technology of power electronics and electronics components, applied in the field of electronics packages, can solve the problems of difficult packaging of power semiconductor chips very dense together, limited switching speed of power semiconductors, and parasitic inductance problems
US20190131211A1Active Publication Date: 2019-05-02ABB (SCHWEIZ) AG
0 Cites 2 Cited by

Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
ABB (SCHWEIZ) AG
Publication Date
2019-05-02

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
Patent Text Reader

Abstract

An electronics package includes an electrically conducting support layer; at least one electrically conducting outer layer; at least two power electronics components arranged on different sides of the support layer and electrically interconnected with the support layer and with the at least one outer layer; and isolation material, in which the support layer and the at least two power electronics components are embedded, the support layer and the at least one outer layer are laminated together with the isolation material; and a cooling channel for conducting a cooling fluid through the electronics package, the cooling channel runs between the at least two power electronics components through the support layer.
Need to check novelty before this filing date? Find Prior Art

Description

FIELD OF THE INVENTION

[0001] The invention relates to the field of packaging and cooling of power electronics components. In particular, the invention relates to an electronics package.BACKGROUND OF THE INVENTION

[0002] The switching speed of power semiconductors is limited by parasitic inductances and capacitances of the electronics package carrying the power semiconductors. One solution for circuit boards to reduce the parasitics is to embed the power semiconductors and their connections within the substrate of the circuit board. This permits to create short, metallic interconnections, which may minimise distortions due to parasitics.

[0003] An embedded technology also may provide the opportunity to embed EMI shield(s) with a high level of isolation from inductively and capacitively coupled noise into the circuit board, which may eliminate the need for an additional surface-mounted shield. With higher power and higher switching frequencies, for example achievable with wide bandgap semi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More