Cooled electronics package with stacked power electronics components

Abstract

An electronics package includes an electrically conducting support layer; at least one electrically conducting outer layer; at least two power electronics components arranged on different sides of the support layer and electrically interconnected with the support layer and with the at least one outer layer; and isolation material, in which the support layer and the at least two power electronics components are embedded, the support layer and the at least one outer layer are laminated together with the isolation material; and a cooling channel for conducting a cooling fluid through the electronics package, the cooling channel runs between the at least two power electronics components through the support layer.

Description

FIELD OF THE INVENTION[0001]The invention relates to the field of packaging and cooling of power electronics components. In particular, the invention relates to an electronics package.BACKGROUND OF THE INVENTION[0002]The switching speed of power semiconductors is limited by parasitic inductances and capacitances of the electronics package carrying the power semiconductors. One solution for circuit boards to reduce the parasitics is to embed the power semiconductors and their connections within the substrate of the circuit board. This permits to create short, metallic interconnections, which may minimise distortions due to parasitics.[0003]An embedded technology also may provide the opportunity to embed EMI shield(s) with a high level of isolation from inductively and capacitively coupled noise into the circuit board, which may eliminate the need for an additional surface-mounted shield. With higher power and higher switching frequencies, for example achievable with wide bandgap semi...

AI Technical Summary

Benefits of technology

The invention provides an electronics package with power electronics components stacked together without degrading their electrical performance. This allows for a high density of components in a compact package. The integrated cooling channel eliminates the need for a separate heat sink, reducing the weight of the package. The cooling channel runs through the support layer, providing even temperature distribution. The package also includes two outer layers for easy stacking and interconnection. The invention provides a solution for high-density power electronics in a compact package.

Problems solved by technology

The switching speed of power semiconductors is limited by parasitic inductances and capacitances of the electronics package carrying the power semiconductors.

With higher power and higher switching frequencies, for example achievable with wide bandgap semiconductors, the parasitic inductance problems may become worse.

However, packaging the power semiconductor chips very dense together may be challenging in the view of cooling the power semiconductors and a thermal management of the electronics package.

Placing chips closer together may reduce the parasitic problem but the semiconductor chips as heat sources are more proximate to one another which may result in poor thermal spreading and hot spots.

While the global temperature may not be excessive, the local hot spot temperature at a semiconductor chip may prohibit an efficient operation and may reduce the lifetime of the semiconductor chip.

However, this only allows a one-sided cooling and may prevent chip stacking within the electronics package.

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