Electroplated copper
a technology of electroplated copper and copper plate, which is applied in the direction of basic electric elements, semiconductor devices, etc., can solve the problems of copper becoming brittle, unsuitable approach, and unable to solve cracking issues, etc., and achieves improved tensile strength, good elongation, and low thermal stress.
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example 1
[0057]Glycerol diglycidyl ether (60 mmols) and 1H-imidazole (100 mmols) were added at room temperature to a round-bottom reaction flask set in a heating bath. Then 40 mL of DI water were added to the flask. The temperature of the heating bath was set to 98° C. The reaction mixture was heated for 5 hours and left stirring at room temperature for another 8 hours. The reaction product (reaction product 1) was used without purification. The molar ratio of the moieties from the 1H-imidazole to the molar ratio of the ether moieties was 100:63.
example 2
[0058]Glycerol diglycidyl ether (30 mmols) and an imidazole compound mixture (30 mmols) of 1H-imidazole (25% by mole)+4-phenylimidazole (75% by mole) were added at room temperature to a round-bottom reaction flask set in a heating bath. Then 40 mL of DI water were added to the flask. The temperature of the heating bath was set to 98° C. The reaction mixture was heated for 5 hours and left stirring at room temperature for another 8 hours. The reaction product (reaction product 2) was used without purification. The molar ratio of the moieties from the imidazole mixture to the molar ratio of the ether moieties was 1:1.
example 3
[0059]2-(2-aminoethyl)pyridine (100 mmols) was added at room temperature to a round-bottom reaction flask set in a heating bath. Then 40 mL of DI water were added to the flask. The temperature of the heating bath was heated to a jacket temperature set at 90° C. Once the bath reached an internal temperature of 76-78° C., glycerol diglycidyl ether (100 mmols) was slowly fed into the round-bottom reaction flask to moderate any exotherm. The reaction mixture was heated with the jacket temperature set at 90° C. for 4 hours with stirring. The reaction mixture was then cooled down to 50-55° C. and a sulfuric acid solution was added to dilute the mixture to 40 wt %. The final reaction product (reaction product 3) was cooled to 25° C. then gravity drained. Reaction product 3 was used without purification. The molar ratio of the moieties from the imidazole mixture to the molar ratio of the ether moieties was 1:1.
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