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Filler-Filled Highly Thermally Conductive Dispersion Composition Having Excellent Segregation Stability, Method for Producing Said Dispersion Composition, Filler-Filled Highly Thermally Conductive Material Using Said Dispersion Composition, Method for Producing Said Material, and Molded Article Obtained using Said Material

a high-temperature conductive and liquid composition technology, applied in the field of high-temperature conductive dispersion liquid composition having excellent segregation, can solve the problems of large amount of heat generated in accordance therewith, extreme decrease in efficiency, peeling at the interface between different kinds of materials, etc., to achieve easy injection, improve segregation stability and storage stability, and low viscosity

Pending Publication Date: 2020-02-27
TAKAGI CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to a filler-loaded high thermal conductive dispersion liquid composition that improves thermal conductivity and workability for various applications such as injection molding and potting. The composition is obtained by dispersing and stabilizing organic polymer particles and high thermal conductive filler particles in a liquid reactive dispersing medium or a thermoplastic polymer. The composition exhibits high thermal conductivity and stable product quality and high performance, and can be used for two-color molding and gradient materials. The composition is stable and easy to use, and can improve thermal conductivity and mechanical strength at the interface between high thermal conductive filler particles. The dispersing medium can be a thermosetting resin or a thermoplastic resin, and can cope with various requirements for electric / electronic devices.

Problems solved by technology

Along with advancement in a remarkable decrease in size and a remarkable increase in output of electric / electronic devices by the performance enhancement, efficiency enhancement, and the like of semiconductor elements, a large amount of heat generated in accordance therewith has been a problem.
In particular, due to an increase in temperature by heat generated from coil portions in reactors for inverters and converters and stators for drive motors for next-generation vehicles and an increase in temperature by heat generated from semiconductor element portions in power devices and high-luminance LED lights, various troubles such as an extreme decrease in efficiency, peeling-off at an interface between different kinds of materials, and generation of cracks have been problems.
Development of heat dissipating members and components in the vicinity of semiconductor elements for coping with those troubles has been an urgent problem, and particularly, various cast molding resins and potting materials in which fluidity is imparted to materials have been developed.

Method used

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  • Filler-Filled Highly Thermally Conductive Dispersion Composition Having Excellent Segregation Stability, Method for Producing Said Dispersion Composition, Filler-Filled Highly Thermally Conductive Material Using Said Dispersion Composition, Method for Producing Said Material, and Molded Article Obtained using Said Material
  • Filler-Filled Highly Thermally Conductive Dispersion Composition Having Excellent Segregation Stability, Method for Producing Said Dispersion Composition, Filler-Filled Highly Thermally Conductive Material Using Said Dispersion Composition, Method for Producing Said Material, and Molded Article Obtained using Said Material

Examples

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examples

[0182]Hereinafter, the present invention will be described in detail by means of Examples, Comparative Examples, Reference Examples, and Comparative Reference Examples, but the scope of the present invention is not intended to be limited to these. Incidentally, production and evaluation of raw materials, dispersion liquid compositions, and molded articles were carried out as follows.

[0183](1) Raw Materials

[0184][Thermoplastic Polymer][0185]Polyphenylene sulfide (PPS) particles: W203A NATURAL manufactured by KUREHA CORPORATION, white powder, linear form, particle size 100 to 500 μm, specific gravity 1.35, melting point 294° C. (DSC measurement), surface free energy (contact angle measurement): dispersion component (γd)=45.2 mJ / m2 and polar component (r)=0.1 mJ / m2 [0186]Polyamide (nylon 6) particles: manufactured by Ube Industries, Ltd., white powder, average particle size 150 μm, melting point 223° C. (DSC measurement), surface free energy (contact angle measurement): dispersion comp...

reference examples 1 to 8

and Comparative Reference Examples 1 and 2: Preparation Examples of Powder Compositions

[0230]Filler particles having a graphite-like structure, other high thermal conductive filler particles, and organic polymer particles were accurately weighed in amounts presented in the following Table 1, were introduced into a magnetic pot of a desk type ball mill BM-10 (manufactured by Seiwa Giken Co., Ltd.), and the contents were pulverized and mixed for 4 hours at room temperature by using magnetic balls to thereby obtain a uniform powder composition. A part of the obtained powder composition was taken out and subjected to DSC measurement, and the melting point of the organic polymer particles was obtained from an endothermic peak temperature. The obtained results are presented in the following Table 1. Incidentally, among preparation examples presented in Table 1, examples containing the organic polymer particles were regarded as Reference Examples 1 to 8. In addition, regarding examples not...

examples 1 to 9

mples of Dispersion Liquid Compositions Using Reactive Dispersing Medium as Dispersing Medium

[0231]The dispersing media (the compositions thereof are presented in the table) were accurately weighed in amounts presented in the following Table 2 and defoamed and mixed at 100° C. using a vacuum stirrer to produce a uniform dispersing medium, and the viscosity in the rotational viscometer was obtained. In addition, a catalyst was uniformly added so as to be wt % presented in the following Table 2 in terms of outer weight % with respect to the dispersing medium and DSC measurement was performed, and a curing calorific value and a curing exothermic peak temperature were obtained. Then, the powder composition (Reference Example 1) presented in Table 2 was defoamed and mixed with the dispersing medium before adding a catalyst at 100° C. using the above-described vacuum stirrer until the concentration of the high thermal conductive filler particles was 40 wt % and using a kneader from the co...

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Abstract

A filler-loaded thermal conductive liquid compositions formed by dispersing a powder composition, which contains polymer particles containing thermoplastic polymer particles, and thermal conductive filler particles containing particles having a graphite-like structure, obtained by pulverizing 5-70 parts by weight of the polymer particles and 30-95 parts by weight of the thermal conductive filler particles, the filler particles being covered with micronized polymer particles and the covered particles being uniformly dispersed, using 25-250 parts by weight of a liquid reactive dispersing medium and / or a dispersing medium containing a thermoplastic polymer having a deflection temperature under load or a melting point lower than the thermoplastic polymer used in the powder composition, and the liquid composition having conditions that a thermal conductive infinite cluster exhibiting a thermal conductivity of 1-35 w / mk is formed and a concentration of thermal conductive filler particles is equal to or more than a percolation threshold.

Description

TECHNICAL FIELD[0001]The present invention relates to a filler-loaded high thermal conductive dispersion liquid composition having excellent segregation stability and having fluidity at the time of cast molding or potting, a method for producing the dispersion liquid composition, a filler-loaded high thermal conductive material using the dispersion liquid composition, a method for producing the material, and a molded article obtained using the material. More specifically, the present invention relates to a filler-loaded high thermal conductive material dispersion liquid composition which has favorable segregation stability by control of morphology (polymer microstructure) and can form an advanced thermal conduction path.BACKGROUND ART[0002]Along with advancement in a remarkable decrease in size and a remarkable increase in output of electric / electronic devices by the performance enhancement, efficiency enhancement, and the like of semiconductor elements, a large amount of heat gener...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08J3/205C08J5/10C08K3/04C08K3/22C08L63/00C08L79/04C08K3/38
CPCC08J5/10C08J3/205C08K3/22C08L63/00C08K2003/222C08L79/04C08K3/04C08K3/38C08K2201/001C08K2003/385C08L101/00C08J3/203C08J2481/04C08J2477/02C08J2323/12C08J2363/00C08K2003/282
Inventor TAKAGI, NORIAKITAKAGI, MASAKUNINAGATANI, YUUSUKETERAO, YUUTAWATANABE, DAISUKEMATSUYAMA, KAZUO
Owner TAKAGI CHEM
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