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Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods

a technology of aqueous aqueous silverbismuth alloy and composition, applied in the field ofacidic aqueous binary silverbismuth alloy electroplating composition, can solve the problems of poor mechanical wear resistance, limited electrical connectors, poor use of contact finishes, etc., and achieve low electrical contact resistance, good mechanical wear resistance, good electrical properties of silver deposits

Pending Publication Date: 2021-06-10
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a method of electroplating a combination of silver and bismuth onto a substrate to create a stable and uniform coating with good electrical properties and wear resistance. The process involves using specific chemicals and adding them to an electroplating solution. The resulting coating has a matte to semi-bright appearance. The technical effect of this method is the ability to create a high-quality coating with properties that meet the requirements of various applications.

Problems solved by technology

However, its use as a contact finish for, example, electrical connectors are limited because of their poor resistance to mechanical wear and high silver-on-silver coefficient of friction.
The poor resistance to mechanical wear results in the connector becoming physically damaged after a relatively low number of insertion-deinsertion cycles of the connector.
A high coefficient of friction contributes to this wear problem.
When connectors have a high coefficient of friction, the force required to insert and deinsert the connector is very high and this can damage the connector or limit the connector design options.
Silver alloy deposits, such as silver-antimony and silver-tin, result in improved wear properties but have unacceptably poor contact resistance, especially after exposure to high temperatures for prolonged periods of time.
Since many silver salts are substantially water-insoluble and silver salts which are water-soluble often form insoluble salts with various compounds commonly present in plating baths, the plating industry is faced with numerous challenges to formulate a silver or silver alloy plating bath which is stable long enough for practical plating applications and addresses at least the foregoing problems.
However, cyanide compounds are extremely poisonous.
This results in a rise in treatment costs.
Further, since these baths can only be used in the alkaline range, the types of alloying metals are limited because most metals are not soluble in alkaline environments.
Further, exposure of substrates to alkaline baths can cause passivation of the surfaces of the substrates, thus making the surfaces difficult to plate.

Method used

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  • Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods
  • Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods
  • Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods

Examples

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example 1 (

Invention)

[0060]An aqueous acid binary silver-bismuth electroplating bath of the following composition was prepared:

[0061]silver methanesulfonate to supply 20 g / L silver ions

[0062]3,6-dithia-1,8-octanediol: 102 g / L

[0063]bismuth methanesulfonate to supply 0.8 g / L of bismuth ions

[0064]cysteine: 1.4 g / L

[0065]3-mercapto-1,2,4-triazole: 1.5 g / L

[0066]pH adjusted to 1.6

[0067]After plating, the electrodeposited coating appeared semi-bright, with a composition of 98.9% silver and 1.1% bismuth.

example 2 (

Invention)

[0068]An aqueous acid binary silver-bismuth alloy electroplating bath of the following composition was prepared:

[0069]silver methanesulfonate to supply 20 g / L silver ions

[0070]3,6-dithia-1,8-octanediol: 102 g / L

[0071]bismuth methanesulfonate to supply 5 g / L of bismuth ions

[0072]cysteine: 9 g / L

[0073]2-mercapto-1,2,4-triazole: 400 ppm

[0074]pH adjusted to 2

[0075]After plating, the electrodeposited coating appeared metallic and semi-bright, with a composition of 95% silver and 5% bismuth. FIG. 1 is a scanning electron microscope image at 10,000× magnification of the binary silver-bismuth alloy showing discrete zones of bismuth, indicated by the bright spots, in a silver matrix.

example 3 (

Invention)

[0076]An aqueous acid binary silver-bismuth alloy electroplating bath of the following composition was prepared:

[0077]silver methanesulfonate to supply 20 g / L silver ions

[0078]3,6-dithia-1,8-octanediol: 102 g / L

[0079]bismuth methanesulfonate to supply 5 g / L of bismuth ions

[0080]3-mercapto-1-propanesulfonate, sodium salt: 13.2 g / L

[0081]3-mercapto-1,2,4-triazole: 400 ppm

[0082]pH adjusted to 2

[0083]After plating, the electrodeposited coating appeared metallic and semi-bright, with a composition of 96% silver and 4% bismuth.

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Abstract

Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.

Description

FIELD OF THE INVENTION[0001]The present invention is directed to acidic aqueous binary silver-bismuth alloy electroplating compositions and methods. More specifically, the present invention is directed to acidic aqueous binary silver-bismuth alloy electroplating compositions and methods, wherein the acidic aqueous binary silver-bismuth alloy electroplating compositions include 5-membered aromatic heterocyclic nitrogen compounds having a thiol functionality which enable electrodeposition of silver rich binary silver-bismuth alloys having low electrical contact resistance and good wear resistance.BACKGROUND OF THE INVENTION[0002]Silver and silver alloy plating baths are highly desirable for depositing silver and silver alloys on substrates in applications directed to the manufacture of electronic components and jewelry. Substantially pure silver is used as a contact finish because of its excellent electrical properties, specifically, low electrical contact resistance. However, its use...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C25D3/46C22C5/06
CPCC25D3/46C22C5/06C25D3/64C25D3/52
Inventor RODRIGUEZ, MIGUEL A.LIPSCHUTZ, MICHAELCHEN, JAMIE Y.C.YOON, YOUNGMIN
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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