Laminate, method of manufacturing the same, and method of manufacturing electronic component

Abstract

Provided is a laminate having, on a substrate, a gel layer which is excellent in heat resistance, has low elastic modulus, low stress and is excellent in stress buffering properties and flexibility, is soft and excellent in holding property of electronic components before curing, and after curing, the gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing, and a method for manufacturing the same. Also provided is a method for manufacturing an electronic component in which use of the laminate makes it difficult to cause problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and makes it difficult to cause problems of defects or defective products of the electronic component. The laminate includes a curing reactive silicone gel layer on at least one type of substrate.

Description

TECHNICAL FIELD[0001]The present invention relates to a laminate including a substrate and a curing reactive silicone gel layer which changes in physical properties from a gel layer which is soft and excellent in holding property of electronic components and the like to a hard cured product layer, and a manufacturing method thereof. The present invention also provides a method of manufacturing an electronic component using the same.BACKGROUND ART[0002]Silicone gels can be obtained by curing reacting organopolysiloxanes having reactive functional groups so as to have low crosslink density, and are excellent in heat resistance, weather resistance, oil resistance, cold resistance, electrical insulation, and the like, and exhibit low elastic modulus, low stress, and excellent stress buffering properties because of being a gel form, unlike ordinary elastomer products, and are widely used for protecting damping materials for optical applications, in-vehicle electronic components, and cons...

AI Technical Summary

Benefits of technology

[0046]According to the laminate of the present invention, there is provided, on a substrate, a silicone gel layer which is excellent in heat resistance and the like, has low elastic modulus, low stress, and excellent in stress buffering properties and flexibility, and which is soft and excellent in holding property of electronic components and the like before curing, and after curing, the silicone gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing. Further, by using the laminate of the present invention, it is possible to provide a method for manufacturing an electronic component which hardly causes problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and hardly causes problems of defects or defective products of the electronic component.

Problems solved by technology

However, since such a silicone gel is a “gel-form”, it is weak against deformation due to external stress such as vibration or internal stress due to expansion or contraction caused by temperature change, and in the case where the gel is destroyed or it is necessary to separate or cut (dice operation or the like) from an electronic member or the like requiring protection, adhesion or stress buffering, sticky deposits may remain on the object, or the gel may generate cohesive failure on the substrate, so that the gel cannot be easily removed from the substrate, the electronic component, or the like.

Such gel deposits are not preferable because they may cause defects in electronic components and the like, and also cause troubles and defective products during mounting of semiconductors and the like.

On the other hand, if the crosslink density of the organopolysiloxane is increased and completely cured, it is impossible to realize the properties of low elastic modulus, low stress, and excellent stress buffering properties which are the superiority of the silicone gel, and the followingness of the gel layer with respect to the uneven substrate is deteriorated, which may cause a gap and a separation from the substrate.

For this reason, conventional cured products such as silicone gel materials and silicone elastomers have not been able to solve the above-mentioned problems at all.

However, in the heretofore known curable compositions assuming multi-stage curing, there is no description or suggestion of the technical benefits of forming a silicone gel or changing from a soft gel to a hard completely cured product.

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