Heat treatment apparatus that performs defect repair annealing
a technology of defect repair and heat treatment apparatus, applied in the direction of electric heating, electric discharge heating, electric apparatus, etc., can solve the problems of severe heat efficiency, marked deformation of energy efficiency necessary to heating, and deformation of heat efficiency, etc., to suppress radiation loss, reduce heat capacity, and uniform heating
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first embodiment
[0028]FIG. 1A shows a basic construction of a heat treatment apparatus in accordance with the present embodiment employing plasma. To begin with, the construction of the heat treatment apparatus will be described below. A sample to be heated 1 is placed in a pair of parallel plate electrodes including an upper electrode 2 and a lower electrode 3. In the present embodiment, single-crystal silicon carbide (SiC) of 4 inch (Ø 100 mm)[0029]in diameter was adopted as the sample to be heated 1. The diameter of the upper electrode 2 and lower electrode 3 was 120 mm, and the thickness thereof was 5 mm. As each of the upper electrode 2 and lower electrode 3, a graphite substrate having silicon carbide accumulated on the surface thereof according to a chemical vapor phase deposition method was adopted.
[0030]The sample to be heated 1 was placed on the lower electrode 3, and the gap 4 between the upper electrode 2 and lower electrode 3 was 0.8 mm. The sample to be heated 1 has a thickness rangin...
second embodiment
[0062]A second embodiment will be described in conjunction with FIG. 2A and FIG. 2B. Items that have been described in relation to the first embodiment but will not be described in relation to the present embodiment will apply to the present embodiment unless the circumstances are exceptional.
[0063]FIG. 2A is a sectional view of an electrical discharge formation unit included in a heat treatment apparatus in accordance with the present embodiment employing plasma. In relation to the second embodiment, only a difference from the first embodiment will be described below. FIG. 2A and FIG. 2B are enlarged view of a portion equivalent to the upper electrode 2 and lower electrode 3 included in the first embodiment. In the second embodiment shown in FIG. 2A and FIG. 2B, unlike the embodiment shown in FIG. 1A to FIG. 1C, the upper electrode 2 is provided with a second gas introduction unit 22, a gas diffuse layer 23, and gas jet holes 24. The other components are identical to those of the f...
third embodiment
[0065]A third embodiment will be described in conjunction with FIG. 3 and FIG. 4. Items that have been described in relation to the first or second embodiment but will not be described in relation to the present embodiment can apply to the present invention unless the circumstances are exceptional.
[0066]FIG. 3 and FIG. 4 are diagrams showing a basic construction of a heat treatment apparatus in accordance with the third embodiment of the present invention employing plasma. FIG. 3 shows a state in which heating treatment is under way, and FIG. 4 shows a state in which the treatment is completed. In relation to the third embodiment, only a difference from the first embodiment will be described below. In FIG. 3 and FIG. 4, an up-and-down driving mechanism 25 for the reflection mirrors 13 is added to the construction of the first embodiment shown in FIG. 1A to FIG. 1C. As shown in FIG. 3, during heating treatment, the upper electrode 2 and lower electrode 3 are located as close to the r...
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