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Method and device for correcting defect of image substrate, and manufacturing method of image substrates

A defect and substrate technology, applied in measurement devices, manufacturing tools, optical testing flaws/defects, etc., can solve the problems of large thickness deviation of correction parts, low productivity, and inability to stably correct defects

Inactive Publication Date: 2008-01-09
LASERTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the productivity is low, and at the same time, due to the repetition of the coating process and the drying process, the thickness deviation of the corrected part is large.
In the existing defect correction method, there is a problem that the defect cannot be corrected stably

Method used

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  • Method and device for correcting defect of image substrate, and manufacturing method of image substrates
  • Method and device for correcting defect of image substrate, and manufacturing method of image substrates
  • Method and device for correcting defect of image substrate, and manufacturing method of image substrates

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Embodiment 2

[0121] The defect correction device of this embodiment is a device in which the film 5 is changed from the defect correction device described in the first embodiment. The configuration contents described in Embodiment 1 are the same configuration, so the description thereof will be omitted. The film used in the defect correction device in this embodiment will be described with reference to FIG. 6 . FIG. 6 is a plan view showing the structure of the film 5 . In FIG. 6, 51 is an R colored layer, 52 is a G colored layer, 53 is a B colored layer, 54 is a light shielding layer, and 55 is a transparent layer. In this embodiment, R, G, B colored layers, a light shielding layer, and a transparent layer are provided on one film, and defects in R, G, B pixels and BM portions of the color filter substrate can be corrected with one film. In addition, the R colored layer 51 , the G colored layer 52 , the B colored layer 53 , the light shielding layer 54 , and the transparent layer 55 are...

Embodiment 3

[0127] The defect correction device and correction method of this embodiment will be described with reference to FIG. 7 and FIGS. 8A to 8B. In addition, description of the same content as that described in Embodiment 1 and Embodiment 2 is omitted. Fig. 7 is a diagram showing the structure of a defect correction device. 8A to 8B are enlarged cross-sectional views showing structures of a substrate and a film. FIG. 8A shows the structure when the film is irradiated with short pulse light for defect correction, and FIG. 8B shows the structure of the defect-corrected substrate. In this embodiment, a transparent glass substrate for a photomask is used as the substrate 6 . First, the manufacturing process of a photomask is demonstrated. On the substrate 6, a chromium film 68 is formed by vapor deposition, sputtering, or the like. The chromium film 68 functions as a light-shielding film in the exposure process. In addition, a resist 67 for patterning the chromium film 68 is provi...

Embodiment 4

[0135] The defect correction method of the pattern substrate according to this embodiment will be described with reference to FIGS. 9A to 9C and FIGS. 10D to 10F. FIGS. 9A to 9C and FIGS. 10D to 10F are enlarged cross-sectional views showing the structure of a defect portion in the defect correction step. The structure of the defect correcting device of this embodiment is the same as that of the first embodiment. Then, foreign objects or defects on the color filter substrate were detected in the same manner as in Example 1, and short pulse light was irradiated to the portion through the film. Accordingly, a part of the film 5a and foreign matter are removed substantially simultaneously by laser ablation. Thereby, the structure shown in FIG. 9A is obtained, and openings are provided in the film 5a.

[0136] A colored resin solution 17 was dripped onto the defective portion from above using a liquid dispenser. The dripped resin solution 17 adheres to the substrate 6 from the ...

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Abstract

A pattern substrate defect correction method and an apparatus capable of stably correcting defects and a pattern substrate manufacturing method are provided. The pattern defect correction apparatus of this invention is one for correcting defects on a patterned substrate, comprising a stage (7) for loading a substrate (6), a short pulse laser light source (1), a beam forming mechanism (2) for forming the short pulse laser light from the short pulse laser light source (1), and an air jet means (13) for making a film (5) to approach the substrate (6). The film (5) and the defect are removed at the same time by irradiating the film (5) with the laser light. A film reel (8) is then moved to make a film (5) having a colored layer (51) to approach the substrate (6) so as to transfer a pattern to the substrate.

Description

technical field [0001] The present invention relates to a defect correction method for correcting defects of a pattern substrate, a defect correction device, and a method for manufacturing a pattern substrate. Background technique [0002] In the manufacturing process of color filters for liquid crystal displays, defects in color filter substrates are corrected in order to improve yield. Regarding this defect correction method, there is a method of correcting by dipping a resist at the tip of a needle and dropping it on a defective portion. However, in this method, since the dropping amount changes with the viscosity of the resist, it is difficult to control the dropping amount and correction accuracy, and it is difficult to perform stable correction. In addition, since a drying process is required, correction time is long and productivity is low. [0003] In addition, as another defect correction method, there is a film transfer method. In this method, a film having a co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01M11/00G01N21/88B23K26/00G02F1/13B23K26/38
Inventor 楠濑治彦田岛敦粟村直树畑濑晃石川拓自小川洁
Owner LASERTEC CORP
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