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Epoxy bleedout-preventing agent and method, wiring substrate and semiconductor package

A technology for epoxy resin and wiring substrate, which is applied in the fields of semiconductor devices, chemical instruments and methods, semiconductor/solid-state device manufacturing, etc. The effect of bleed-out of epoxy resin

Active Publication Date: 2009-09-30
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, with the recent increase in the size of semiconductor chips and thinning of semiconductor packages, in order to improve the problem of warpage, etc., low-stress, low-elasticity, low-viscosity die-bonding resins (hereinafter referred to as low-stress type die-bonding resins) ) are used more and more, because these resins often contain ingredients that are prone to bleed, and as a result, epoxy resin bleeds easily
The technology of the above-mentioned Patent Document 1 cannot cope with the use of low-stress type die-bonding resin, and bleeding of epoxy resin will occur.

Method used

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  • Epoxy bleedout-preventing agent and method, wiring substrate and semiconductor package
  • Epoxy bleedout-preventing agent and method, wiring substrate and semiconductor package
  • Epoxy bleedout-preventing agent and method, wiring substrate and semiconductor package

Examples

Experimental program
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Effect test

Embodiment 1～10

[0047] On a lead frame substrate made of a copper alloy (Cu: 97.7%-Sn: 2.0%-Ni: 0.2%-P: 0.03%), copper strike plating is performed as a base to improve adhesion, and then on the lead frame Any of gold plating, silver plating, and copper plating is performed on the entire surface. Then, the epoxy resin bleed prevention treatment as described in Table 1 was performed by dipping.

[0048] In addition, the polar group-N 2 C 3 h 3 , -N 3 C 2 h 2 , -N 4 CH is 1-imidazolyl, 1,2,3-triazol-1-yl, 1-tetrazolyl, respectively.

[0049] Die bonding was performed on these substrates, and epoxy resin bleeding resistance (EBO resistance), wire bonding performance (W / B property), molding performance, and discoloration resistance were evaluated. The results are shown in Table 1. In Table 1, [-] in the bath composition means not added, and [-] in the evaluation means not to be evaluated.

[0050] Evaluation of epoxy resin bleed resistance was carried out in accordance with the following...

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Abstract

Disclosed is an epoxy bleedout-preventing agent which has no adverse effect on die bonding strength and assembly characteristics and does not deteriorate effects of coloration preventing treatment and sealing even when a low-stress die bonding resin is used. Specifically disclosed is an epoxy bleedout-preventing agent for die bonding processes, which is characterized by containing a fluorine-containing organic compound having a fluorohydrocarbon group CxHyFz-(wherein x = 3-24, y = 0-48, z = 1-49, and y + z = 2x + 1) having 3-24 carbon atoms and a polar group R-.

Description

technical field [0001] The present invention relates to an agent for preventing epoxy resin from seeping out and an epoxy Method of resin bleed. Background technique [0002] In the chip bonding process of bonding and fixing semiconductor wiring substrates such as lead frames and printed wiring boards and IC chips with epoxy resin, if the bonding surface (usually plated with gold, silver, copper, palladium, etc.) If the surface roughness is too large, or if the surface is contaminated with organic substances such as anti-tarnish agents and sealing agents, the resin or additives may bleed out when epoxy resin is applied (bleeding out of epoxy resin). The bleeding of the epoxy resin lowers the die-bonding strength, and causes a defect in the subsequent wire bonding (wirebonding) process. Currently, in order to prevent such epoxy bleeding, the surface roughness of the bonding surface is reduced to suppress capillarity, or the surface is washed to remove contaminants. However...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/12C23C26/00H01L21/52C07D233/56C07D249/04C07D257/04
CPCH01L2924/01074C07D257/04H01L2924/01047H01L24/83C07D249/04H01L2924/0105H01L2924/01029H01L23/49513H01L2224/2919C07D233/56H01L2924/01016H01L2224/45144H01L24/31C23C26/00H01L2924/01005H01L2924/01082H01L2224/8385H01L2924/01033H01L2924/01046H01L2924/01079H01L2924/01004H01L2924/01015H01L2924/0665H01L2924/01006H01L2924/01078H01L2924/14H01L2924/07802H01L2924/01012H01L24/85H01L2224/85H01L2924/00014H01L2924/12044H01L2924/181H01L2924/00H01L2224/48C09K3/12H01L21/52H01L23/12
Inventor 相场玲宏中村久三村智晴土田克之
Owner JX NIPPON MINING & METALS CORP
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