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Epoxy resin composition

A technology for epoxy resin and epoxy resin, applied in the field of materials for printed wiring boards, can solve the problem of insufficient wettability of resin composition and copper foil surface, insufficient wettability of resin composition and metal hydrate particles, insufficient wettability of resin composition and metal hydrate particles, etc. Small anchor problems

Inactive Publication Date: 2009-10-14
NEC CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In view of this, for the epoxy resin composition disclosed in Reference 1, due to the structure of the resin component (especially the number of repeating units (n) or molecular weight in the structural formula) and the metal hydrate Particle selection is not optimal, so in addition to insufficient wettability of resin composition and copper foil surface, insufficient wettability of resin composition and metal hydrate particles
[0013] Therefore, the adhesion of the semi-cured impregnating material using the epoxy resin composition of Reference 1 to the blackened surface of copper foil is particularly low compared with the conventional FR-4 material, and the blackened surface The depth of the anchor is 1-2 μm, and the anchor is smaller than the matte surface with a depth of 5-10 μm, which is generally called an anchor, and a sufficient fixing effect cannot be expected

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
  • Epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0243] Hereinafter, the present invention will be described in more detail with reference to specific examples.

[0244] First, raw materials used in Examples of the present invention and Comparative Examples will be described.

[0245] The epoxy resins and curing agents for epoxy resins shown in Table 1 below were used.

[0246] The structures of epoxy G1 and epoxy resin H1 are represented by the following general formula (45). In addition, the structures of epoxides G2, G3 and G4 are represented by the following general formula (46). In addition, the polystyrene-equivalent weight average molecular weight (Mw) and epoxy equivalent are described at the same time.

[0247] Table 1

[0248]

[0249]

[0250] The other phenolic resins used are shown in Table 2 below, and the structures of the phenolic resins F1, F2, F'1, and F'2 are represented by the following general formula (47). In addition, the structures of the phenolic resins F'3, F'4, and F'5 are represented by ...

example 1

[0271] In the epoxy resin composition containing 34.58 mass % of epoxy G1 as epoxy resin (A), 30.42 mass % of phenolic resin F1 as epoxy resin curing agent (B), and 35 mass % of aluminum hydroxide 1 0.045% by mass of imidazoles as a curing accelerating catalyst was added to the epoxy resin composition (100% by mass of the total amount of the epoxy resin (A), the curing agent for epoxy resin (B) and aluminum hydroxide), and 0.045% by mass relative to the To the epoxy resin composition, 0.10% by mass of aminosilane was added to form a mixture, and the mixture was dissolved or dispersed in methyl ethyl ketone (MEK) to prepare a varnish solution with a nonvolatile content of 65% by mass.

[0272] The obtained varnish solution was continuously applied and impregnated on a glass cloth to produce a B-stage semi-cured impregnated material. Various samples for evaluation were produced by press molding using this semi-hardened impregnated material. The evaluation results are shown in T...

example 2-16

[0273] (Example 2-16), (Comparative Example 1-10), (Reference Example 1)

[0274] Various samples for evaluation were produced in the same manner as in Example 1, except that the epoxy resin compositions of the ratios shown in Tables 4-7 were used. The evaluation results are shown in Tables 4-7.

[0275] Table 4

[0276]

[0277] table 5

[0278] mw

Example 6

Example 7

Example 8

Example 9

Example 10

Comparative Example 5

Comparative Example 6

Epoxide H1

15000

37.53

36.55

39.91

40.00

40.53

34.93

35.76

Phenolic resin F'1

Phenolic resin F'2

Phenolic resin F'3

Phenolic resin F'4

Phenolic resin F'5

850

1400

1870

1460

1100

27.47

-

-

-

-

-

28.45

-

-

-

-

-

25.09

-

-

-

-

-

25.00

-

-

-

-

-

24.47

-

...

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PUM

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Abstract

An epoxy resin composition, wherein containing epoxy resin (A) and curing agent (B) for epoxy resin, described curing agent (B) for epoxy resin contains phenolic resin (F), described phenolic resin ( F) contains a structural unit X represented by a predetermined general formula obtained by reacting biphenyl isomers or their mixtures with a phenolic compound, or obtained by reacting benzene isomers or their mixtures with a phenolic compound At least one of the structural units Y represented by the prescribed general formula, and the sum (n or m+m') of the repeating number of the structural unit X and the repeating number of the structural unit Y is greater than 10 and less than 75.

Description

technical field [0001] The present invention relates to a material for printed wiring boards which is excellent in both heat resistance and adhesiveness. In the present invention, the term "material for printed wiring boards" means an epoxy resin composition, an epoxy resin composition impregnated into a base material represented by glass cloth, glass nonwoven fabric, etc., and semi-cured. A resin sheet (hereinafter referred to as a pre-preg), a laminated board using an epoxy resin composition, a glass epoxy resin copper-clad laminated board, and a printed wiring board. Background technique [0002] Conventionally, when flame-retardant properties are required for glass-epoxy copper-clad laminates, halogen-based flame retardants are generally used as flame retardants from the viewpoint of fire prevention and safety assurance. [0003] However, when electronic components or semiconductor devices are mounted on glass epoxy resin copper-clad laminates containing the above-menti...

Claims

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Application Information

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IPC IPC(8): C08G59/62
Inventor 木内幸浩位地正年长岛宏明塚田真守
Owner NEC CORP