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Graphite-metal composite heat radiation material and method for making same

A technology of metal composite and heat-dissipating materials, which is applied in the field of material preparation and radiator material preparation, and achieves the effects of high strength, easy molding and improvement of anisotropy.

Inactive Publication Date: 2009-12-16
HARBIN ENG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Obviously, the materials obtained by these methods cannot be directly used in dense graphite-based heat dissipation materials.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Mix expanded graphite (expansion volume: 200mL / g) with carbon nanotubes evenly, wherein the content of carbon nanotubes is 1%, and copper is plated on the surface of expanded graphite and carbon nanotubes by electroless plating, and in the composite powder after plating, the expansion The content of graphite and carbon nanotubes is 50%, and the content of copper is 50%. The composite powder was cold-pressed at 130MPa and held for 5 minutes; then sintered at 800°C under a hydrogen atmosphere and kept for 4 hours. The density of the prepared material is 3.5g / cm 3 , The thermal conductivity is 300W / m.K.

Embodiment 2

[0030] Mix expanded graphite (expansion volume: 300mL / g) with carbon fiber evenly, wherein the content of carbon fiber is 10%, silver-plated on the surface of expanded graphite and carbon fiber by electroless plating, in the composite powder after plating, the content of expanded graphite and carbon nanotubes 70% and 30% silver. The composite powder was cold-pressed at 160 MPa and held for 20 minutes; then sintered at 850° C. under an argon atmosphere and kept for 1 hour. The density of the prepared material is 3.0g / cm 3 , The thermal conductivity is 310W / m.K.

Embodiment 3

[0032] Mix expanded graphite (expansion volume: 400mL / g) with silicon carbide fiber evenly, wherein the carbon fiber content is 2%, and nickel-plate the surface of expanded graphite and silicon carbide by electroless plating. In the composite powder after plating, expanded graphite and carbonized The silicon content is 80%, and the nickel content is 20%. The composite powder was cold-pressed at 160MPa and held for 10 minutes; then sintered at 850°C under a nitrogen atmosphere and kept for 10 minutes. The density of the prepared material is 1.8g / cm 3 , The thermal conductivity is 325W / m.K.

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PUM

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Abstract

The invention provides a graphite-metal compound radiation material and the preparation method thereof. The product consists of the followings by weight: 1-10 percent of reinforced filler material, 5-50 percent of metal and the remaining proportion of inflation graphite. The inflation graphite and the reinforced filler material are blended evenly; the chemical metallization is carried on the surface of the admixture of the inflation graphite and the reinforced filler material to obtain the graphite-metal compound material which then is sintered and shaped. The invention has the advantages that the compounding of the inflation graphite and metal reduces the density of the material on the one hand, and significantly decreases the thermal-expansion coefficient of the material on the other hand. The metal in the graphite substrate can not only improve the aeolotropy of graphite radiation, but also facilitate the overall radiation of the material. The material provided by the invention can be easily produced and shaped.

Description

(1) Technical field [0001] The invention relates to a graphite material, in particular to a graphite-based material used to prepare radiators. The invention also relates to methods for the preparation of such materials. (2) Background technology [0002] With the high integration and high speed of semiconductor components, the calorific value of components continues to increase, and the rise in component temperature becomes the main cause of misoperation or failure. Therefore, the research and development of device heat dissipation has become a hot spot in the development of the semiconductor industry. In terms of thermal conductivity materials, in recent years, as the requirements for heat dissipation have become higher and higher, new materials with high thermal conductivity higher than 250W / mK are urgently needed. In addition, the heat dissipation material is not only required to have high thermal conductivity, but also must have the same thermal expansion coefficient as...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/536C04B35/628C22C1/05B22F1/02
Inventor 魏彤范壮军
Owner HARBIN ENG UNIV