Vertically delicate adjusting and gravity force compensating mechanism and photo-etching machine

Abstract

The invention discloses a vertical trimming and gravity compensating device and photo-etching machine through the vertical trimming and gravity compensating device, wherein the vertical trimming and gravity compensating device contains gravity compensator of static weight of support, driving device on the gravity compensator to do vertical trimming and gravity compensation for the support. The inveniton reaches precise position control, which realizes trimming and location toward three free degree directions simultaneously.

Description

technical field [0001] The invention relates to a vertical fine-tuning and gravity compensation device and a photolithography machine using the vertical fine-tuning and gravity compensation device, in particular to a photolithography machine using a balance mass and a fine-adjustment positioning method. Background technique [0002] In the semiconductor manufacturing process, photolithography is a very important process. It is a complex process of sequentially transferring chip patterns on a series of reticles to corresponding layers of silicon wafers through an exposure system. The entire photolithography process consumes about 60% of the chip front-end manufacturing time, and accounts for nearly 40% of the cost of the entire chip manufacturing. This series of complex, expensive, and time-consuming lithography processes is concentrated on a group of lithography machines corresponding to the chip front-end production line. Therefore, the lithography accuracy and yield of the...

AI Technical Summary

Problems solved by technology

However, as silicon wafers with a diameter of 300mm have become the mainstream technology in the field of photolithography, the frame system and local vibration reduction layout of traditional silicon wafers with a diameter of 200mm can no longer meet the requirements of improving system productivity and exposure quality. The main reason is that : First, even if the motion reaction force generated when the workpiece table and mask table start and stop at high acceleration is drawn to the external frame, if it is not dealt with, it will have a great impact on the lithography system; second, the workpiece table and mask table are in the Frequent changes in the center of gravity of the system caused by high-speed movement lead to disordered vibration of the lithography system

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