Preparation method of tunnelling diode of quantum logical device

A tunneling diode and quantum logic technology, applied in the field of tunneling diode preparation, can solve problems such as silicon quantum dot resonant tunneling diodes that have not been reported, and achieve the effect of mature processing technology and improved noise tolerance

Inactive Publication Date: 2007-07-18
SHANGHAI JIAO TONG UNIV
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the fabrication of silicon quantum dot resonant tunneling diodes that can

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] Embodiments of the present invention are provided below: this embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and processes are provided, but the protection scope of the present invention is not limited to the following embodiments.

[0020] (1) Determine that the tunneling diode of the high noise capacity logic device to be grown is a single crystal silicon (p) / silicon quantum dot (n) heterojunction resonant tunneling diode. The optimal doping concentration of silicon quantum dot resonant tunneling diode is obtained by using semiconductor quantum transport theory.

[0021] According to the coupled Schrödinger equation and Poisson equation of the heterojunction structure of silicon quantum dots, the self-consistent calculation method is used to obtain the spatial distribution of the effective potential of the heterojunction from the distribution of impurity concentrations on both sides of th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A method for preparing a tunneling diode of quantum logic component includes applying gas phase epitaxial process to grow single crystal silicon (SCS) film and gas phase deposition process to grow silicon quantum dot film, using semiconductor quantum conveying means to simulate tunneling current character of tunneling diode component for making further regulation on folding character of tunneling current, growing p type of SCS film on heavy doped p type of single crystal silicon substrate first then growing n type of silicon quantum dot film on formed p type of film by gas phase epitaxial unit.

Description

technical field [0001] The invention relates to a method in the technical field of semiconductor materials, in particular to a method for preparing a tunneling diode of a quantum logic device. Background technique [0002] Resonant tunneling diode devices can be used to prepare various multifunctional analog / digital integrated circuits, such as signal processors, analog-to-digital converters, communication equipment and memory devices, and are one of the most promising devices in the field of solid-state electronics. Silicon materials are the backbone of the current semiconductor electronics industry. Silicon-based devices are easy to integrate with mainstream silicon-based circuits. Therefore, the research on silicon-based resonant tunneling diodes has very important practical significance for the preparation and performance improvement of logic devices. Logic devices with unique performance can be obtained by utilizing the characteristics of silicon quantum dot heterojunct...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/329
Inventor 沈文忠潘葳
Owner SHANGHAI JIAO TONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products