Technique for synthesizing air-dry type oxirene ester resin
A technology of epoxy vinyl ester and resin synthesis process, which is applied in the field of formula and synthesis process of air-drying epoxy vinyl ester resin, and can solve the problems of unsuitable for industrialized mass production, reduced adhesion, clarity, gloss, and resin Complicated production and other problems, to achieve the effect of good chemical resistance, good wear resistance and high fullness
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Embodiment 1
[0027] In the reactor, 170g of low epoxy equivalent bisphenol A epoxy resin (epoxy equivalent is 179~192g / mol) and high epoxy equivalent bisphenol A epoxy resin (epoxy equivalent is 455~500g / mol) mol) 170 g, 110 g of methacrylic acid, 0.8 g of benzyldimethylamine, and 0.15 g of tert-butylhydroquinone. In the case of nitrogen gas, gradually raise the temperature to 120°C, and keep the temperature until the measured acid value is less than 30mgKOH / g; cool down to below 110°C, add 260g of styrene, 20g of methyl methacrylate, stir well, when the temperature drops to 60°C Next, add 0.1 g of N-cyclohexyl-N'-phenyl-p-phenylenediamine, stir thoroughly, and finally cool to room temperature, and filter to obtain a light yellow viscous liquid.
Embodiment 2
[0029] 150g of bisphenol A type epoxy resin (epoxy equivalent is 185~196g / mol) of low epoxy equivalent, 200g of bisphenol A type epoxy resin of high epoxy equivalent (epoxy equivalent is 455~556g / mol) , 85g of acrylic acid, 0.38g of benzyltrimethylammonium chloride, and 0.08g of tert-butylcatechol are put into the device shown in Example 1, and the temperature is gradually raised to 130°C under the condition of feeding nitrogen gas, and the temperature is maintained until the acid is detected. The value is less than 30 mgKOH / g. Cool down to below 110°C, add 300g of styrene, stir well, when the temperature drops below 60°C, add 0.30g of N-isopropyl N'-phenyl-p-phenylenediamine, stir well, finally cool to room temperature, filter to get light yellow Viscous liquid.
Embodiment 3
[0031] 175g of bisphenol A type epoxy resin (epoxy equivalent is 185~208g / mol) of low epoxy equivalent, 230g of bisphenol A type epoxy resin of high epoxy equivalent (epoxy equivalent is 714~833g / mol) , 85g of acrylic acid, 1.6g of benzyltriethylammonium chloride, and 0.20g of p-benzoquinone are dropped into the device shown in Example 1, and the temperature is gradually raised to 140°C under nitrogen gas conditions, and the temperature is maintained until the acid value is less than 30mgKOH / g. Cool down to below 110°C, add 320g of styrene and 50g of divinylbenzene, stir well, add 0.25g of N-(1,3-dimethyl)butyl N'-phenyl-p-phenylenediamine when the temperature drops below 60°C , fully stirred, finally cooled to room temperature, and filtered to obtain a light yellow turbid viscous liquid.
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