Alkali development-type photosensitive resin composition, substrate with protrusions for liquid crystal split orientational control and color filter formed using the same, and liquid crystal display d
A technology of photosensitive resin and composition, applied in nonlinear optics, photoengraving process of pattern surface, photosensitive material used in opto-mechanical equipment, etc., can solve problems such as insufficient sensitivity, difficulty in obtaining pattern shape and fine pattern, etc. , to achieve the effect of excellent sensitivity
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[0180] Example
[0181] Hereinafter, the present invention will be described in further detail by citing examples and the like, but the present invention is not limited to these examples. Also, in the following Examples and the like, "%" means mass %.
[0182]In Production Examples 1 to 7 and Comparative Production Examples 1 to 3, an alkali developable resin composition containing a photopolymerizable unsaturated compound as a binder resin was produced. In Examples 1 to 7 and Comparative Examples 1 to 3, the alkaline developable photosensitive resin composition was produced by mixing a solvent and a photopolymerization initiator in these alkaline developable resin compositions. In Examples 8 to 14 and In Comparative Examples 4 to 6, by further mixing a colorant, a colored alkaline development type photosensitive resin composition was produced.
[0183] Commercial products used as the polyfunctional epoxy resin (A) in the following examples are as follows.
[0184] Adeka Resin EP-...
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[0189] [Production Example 1] Production of Alkaline-Developable Resin Composition No. 1
[0190] Add 154g Adeka Rejin EP-4100E (manufactured by Asahi Denka Kogyo Co., Ltd.; bisphenol A epoxy resin with epoxy equivalent of 190; hereinafter also referred to as compound a-1), 55.2g YP-90LL (manufactured by Hyshara Chemical Co., Ltd.; ring The content of terpene monophenol is 90%; the average molecular weight is 266, and the hydroxyl equivalent is 340; hereinafter also referred to as compound c) and 90.3g of propylene glycol monomethyl ether acetate, the temperature is raised to 115°C. 1.05 g of triphenylphosphine was slowly added, and the mixture was stirred at 120°C for 4 hours. Furthermore, 194g of propylene glycol monomethyl ether acetate was added, and it cooled to 50 degrees C or less. After that, 0.26 g of 2,6-di-tert-butyl-p-cresol, 2.6 g of benzyltriethylammonium chloride, and 46.8 g of acrylic acid (hereinafter, also referred to as compound b) were added, and the temperatur...
Example Embodiment
[0192] [Production Example 2] Production of alkaline developable resin composition No. 2
[0193] Add 171g of Adeka Regent EP-4100E (epoxy equivalent of 190; compound a-1), 25g of Epokoite 834 (manufactured by Japan Epoxy Co., Ltd.: epoxy equivalent of 250; hereafter also referred to as compound a-2) and 187g of YP -90LL (compound c), heated to 115°C. Slowly add 1.15 g of triphenylphosphine, and stir at 120°C for 4 hours. Further, 617 g of propylene glycol monomethyl ether acetate was added, and the mixture was cooled to below 50°C. After that, 0.415 g of 2,6-di-tert-butyl-p-cresol, 4.15 g of benzyltriethylammonium chloride, and 32.4 g of acrylic acid (compound b) were added, and the temperature was increased to 120° C. and maintained for 5 hours. After cooling to 50°C or lower, 88.2 g of diphthalic dianhydride (compound d-1) and 0.289 g of tetrabutylammonium bromide were added, and the temperature was raised to 120°C and maintained for 4 hours. Cool to 40°C and keep for 60 hours....
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