Epoxy resin composition and semiconductor device

A technology of epoxy resin and semiconductor, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., and can solve problems such as reduced adhesion, excessive compounding amount, and poor reliability of packages

Active Publication Date: 2007-09-19
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when these epoxy resin compositions are used, flame retardants must be added due to lack of flame resistance, and the adhesion to the above-mentioned pre-plated frames is also reduced, and the reliability of packages using these frames is particularly poor.
[0006] In addition, since these epoxy resin compositions have a low crosslinking density and the molded product immediately after curing is soft, there is a problem that poor moldability such as resin sticking to the mold occurs during continuous molding, which reduces productivity.
[0007] As a method of improving productivity, a method of adding oxidized polyethylene has been proposed (for example, see Patent Documents 4 and 5). However, since only oxidized polyethylene is used, a large amount of compounding is required to obtain sufficient mold release properties, and this will cause a decrease in adhesion
In addition, in order to improve the dispersibility of oxidized polyethylene, a method of using epoxy polyether siloxane having a dimethyl siloxane structure as a main chain in combination has been proposed (for example, see Patent Document 6), but although it has a polyether chain The silicone oil has very good productivity, but there is a problem that the solder reflow resistance decreases due to the increase in hygroscopicity due to the action of the polyether chain
[0008] In addition, a method of improving solder reflow resistance by using a resin having flexibility and flame retardancy in addition to low water absorption has been proposed (for example, see Patent Document 1, 2, or 3), but when In response to the situation of using lead-free solder and higher filling of inorganic fillers, there will be a problem of insufficient fluidity, and it is difficult to achieve

Method used

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  • Epoxy resin composition and semiconductor device
  • Epoxy resin composition and semiconductor device
  • Epoxy resin composition and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0149] Examples of the present invention are shown below, but the present invention is not limited by these Examples. The compounding ratio is expressed in parts by weight.

[0150] Next, the embodiment series (1) relates to the first aspect, the embodiment series (2) relates to the second aspect, and the embodiment series (3) relates to the third aspect.

[0151] Example series (1)

Embodiment (1

[0153] After mixing each component shown below with a mixer, it kneaded with the twin roll whose surface temperature was 95 degreeC and 25 degreeC, after cooling, it grind|pulverized, and the epoxy resin composition was obtained. The properties of the obtained epoxy resin composition were evaluated by the following methods. The results are shown in Table 1.

[0154] Epoxy resin 1: Epoxy resin represented by formula (1a) (softening point is 44° C., epoxy equivalent is 234, hereinafter referred to as E-1) 6.21 parts by weight

[0155]

[0156] Phenolic resin 1: phenolic resin represented by formula (2a) (softening point: 107°C, hydroxyl equivalent: 203, hereinafter referred to as H-1) 4.89 parts by weight

[0157]

[0158] 1. 8-diazabicyclo(5,4,0)undecene-7 (hereinafter referred to as DBU)

[0159] 0.20 parts by weight

[0160] Fused spherical silica (average particle size: 25 μm) 88.00 parts by weight

[0161] 1,2,4-triazole-5-...

Embodiment (2

[0194] After mixing each component shown below with a mixer, it kneaded with the twin-roller whose surface temperature was 95 degreeC and 25 degreeC, after cooling, it grind|pulverized, and the epoxy resin composition was obtained. The properties of the obtained epoxy resin composition were evaluated in the following manner. The results are shown in Table 4.

[0195] Epoxy resin 1: Epoxy resin represented by formula (1a) (softening point 44° C., epoxy equivalent 234, hereinafter referred to as E-1) 6.09 parts by weight

[0196]

[0197]Phenolic resin 1: phenolic resin represented by formula (2a) (softening point 107°C, hydroxyl equivalent 203, hereinafter referred to as H-1) 4.41 parts by weight

[0198]

[0199] Organopolysiloxane represented by formula (4a) (hereinafter referred to as organopolysiloxane 1)

[0200] 0.20 parts by weight

[0201]

[0202] Oxidized polyethylene wax 1 (oxidized high-density polyethylene with a dr...

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Abstract

Disclosed is an epoxy resin composition for semiconductor encapsulation which exhibits high flame retardance without using a flame retardance-imparting agent, while having excellent solder reflow resistance. Also disclosed is a semiconductor device obtained by sealing a semiconductor element using such an epoxy resin composition. The epoxy resin compositions for semiconductor encapsulation of first, second and third aspects are characterized by containing (A) a phenolaralkyl-type epoxy resin having a phenylene skeleton, (B) a phenolaralkyl-type phenol resin having a biphenylene skeleton, and (D) an inorganic filler as the common essential components. The epoxy resin compositions are further characterized in that the inorganic filler (D) is contained in an amount of 84-92% by weight of the total epoxy resin composition.

Description

technical field [0001] The present invention relates to an epoxy resin composition for semiconductor sealing, and a semiconductor device using the epoxy resin composition. Background technique [0002] Conventionally, electronic components such as diodes, transistors, and ICs (integrated circuits) have been mainly sealed with epoxy resin compositions. In particular, integrated circuits have adopted epoxy resins, phenolic resins, and epoxy resin compositions containing inorganic fillers such as fused silica and crystalline silica, which are excellent in heat resistance and moisture resistance. However, in recent years, in the market trend of miniaturization, light weight, and high performance of electronic equipment, the high integration of semiconductor elements has been continuously developed, and the surface mounting of semiconductor devices has also been continuously promoted. The requirements for epoxy resin compositions for sealing are becoming increasingly stringent. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08L63/00H01L23/29H01L23/31
Inventor 室谷和良鹈川健
Owner SUMITOMO BAKELITE CO LTD
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