Epoxy resin composition and semiconductor device

A technology of epoxy resin and semiconductor, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., and can solve problems such as reduced adhesion, excessive compounding amount, and poor reliability of packages

A technology of epoxy resin and semiconductor, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., and can solve problems such as reduced adhesion, excessive compounding amount, and poor reliability of packages

CN101039984AActive Publication Date: 2007-09-19SUMITOMO BAKELITE CO LTD
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  • Epoxy resin composition and semiconductor device
  • Epoxy resin composition and semiconductor device
  • Epoxy resin composition and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0149] Examples of the present invention are shown below, but the present invention is not limited by these Examples. The compounding ratio is expressed in parts by weight.

[0150] Next, the embodiment series (1) relates to the first aspect, the embodiment series (2) relates to the second aspect, and the embodiment series (3) relates to the third aspect.

[0151] Example series (1)

Embodiment (1

[0153] After mixing each component shown below with a mixer, it kneaded with the twin roll whose surface temperature was 95 degreeC and 25 degreeC, after cooling, it grind|pulverized, and the epoxy resin composition was obtained. The properties of the obtained epoxy resin composition were evaluated by the following methods. The results are shown in Table 1.

[0154] Epoxy resin 1: Epoxy resin represented by formula (1a) (softening point is 44° C., epoxy equivalent is 234, hereinafter referred to as E-1) 6.21 parts by weight

[0155]

[0156] Phenolic resin 1: phenolic resin represented by formula (2a) (softening point: 107°C, hydroxyl equivalent: 203, hereinafter referred to as H-1) 4.89 parts by weight

[0157]

[0158] 1. 8-diazabicyclo(5,4,0)undecene-7 (hereinafter referred to as DBU)

[0159] 0.20 parts by weight

[0160] Fused spherical silica (average particle size: 25 μm) 88.00 parts by weight

[0161] 1,2,4-triazole-5-...

Embodiment (2

[0194] After mixing each component shown below with a mixer, it kneaded with the twin-roller whose surface temperature was 95 degreeC and 25 degreeC, after cooling, it grind|pulverized, and the epoxy resin composition was obtained. The properties of the obtained epoxy resin composition were evaluated in the following manner. The results are shown in Table 4.

[0195] Epoxy resin 1: Epoxy resin represented by formula (1a) (softening point 44° C., epoxy equivalent 234, hereinafter referred to as E-1) 6.09 parts by weight

[0196]

[0197]Phenolic resin 1: phenolic resin represented by formula (2a) (softening point 107°C, hydroxyl equivalent 203, hereinafter referred to as H-1) 4.41 parts by weight

[0198]

[0199] Organopolysiloxane represented by formula (4a) (hereinafter referred to as organopolysiloxane 1)

[0200] 0.20 parts by weight

[0201]

[0202] Oxidized polyethylene wax 1 (oxidized high-density polyethylene with a dr...

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Abstract

Disclosed is an epoxy resin composition for semiconductor encapsulation which exhibits high flame retardance without using a flame retardance-imparting agent, while having excellent solder reflow resistance. Also disclosed is a semiconductor device obtained by sealing a semiconductor element using such an epoxy resin composition. The epoxy resin compositions for semiconductor encapsulation of first, second and third aspects are characterized by containing (A) a phenolaralkyl-type epoxy resin having a phenylene skeleton, (B) a phenolaralkyl-type phenol resin having a biphenylene skeleton, and (D) an inorganic filler as the common essential components. The epoxy resin compositions are further characterized in that the inorganic filler (D) is contained in an amount of 84-92% by weight of the total epoxy resin composition.

Description

technical field [0001] The present invention relates to an epoxy resin composition for semiconductor sealing, and a semiconductor device using the epoxy resin composition. Background technique [0002] Conventionally, electronic components such as diodes, transistors, and ICs (integrated circuits) have been mainly sealed with epoxy resin compositions. In particular, integrated circuits have adopted epoxy resins, phenolic resins, and epoxy resin compositions containing inorganic fillers such as fused silica and crystalline silica, which are excellent in heat resistance and moisture resistance. However, in recent years, in the market trend of miniaturization, light weight, and high performance of electronic equipment, the high integration of semiconductor elements has been continuously developed, and the surface mounting of semiconductor devices has also been continuously promoted. The requirements for epoxy resin compositions for sealing are becoming increasingly stringent. ...

Claims

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Application Information

Patent Timeline
19 Sep 2007
Publication
CN101039984A
IPC
C08G59/62; C08L63/00; H01L23/29; H01L23/31
Inventors
室谷和良; 鹈川健