Epoxy resin composition and semiconductor device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SUMITOMO BAKELITE CO LTD
- Publication Date
- 2007-09-19
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Abstract
Description
technical field
[0001] The present invention relates to an epoxy resin composition for semiconductor sealing, and a semiconductor device using the epoxy resin composition. Background technique
[0002] Conventionally, electronic components such as diodes, transistors, and ICs (integrated circuits) have been mainly sealed with epoxy resin compositions. In particular, integrated circuits have adopted epoxy resins, phenolic resins, and epoxy resin compositions containing inorganic fillers such as fused silica and crystalline silica, which are excellent in heat resistance and moisture resistance. However, in recent years, in the market trend of miniaturization, light weight, and high performance of electronic equipment, the high integration of semiconductor elements has been continuously developed, and the surface mounting of semiconductor devices has also been continuously promoted. The requirements for epoxy resin compositions for sealing are becoming increasingly stringent. ...