Epoxy resin composition and semiconductor device

A technology of epoxy resin and semiconductor, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., and can solve problems such as reduced adhesion, excessive compounding amount, and poor reliability of packages
CN101039984AActive Publication Date: 2007-09-19SUMITOMO BAKELITE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SUMITOMO BAKELITE CO LTD
Publication Date
2007-09-19

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Abstract

Disclosed is an epoxy resin composition for semiconductor encapsulation which exhibits high flame retardance without using a flame retardance-imparting agent, while having excellent solder reflow resistance. Also disclosed is a semiconductor device obtained by sealing a semiconductor element using such an epoxy resin composition. The epoxy resin compositions for semiconductor encapsulation of first, second and third aspects are characterized by containing (A) a phenolaralkyl-type epoxy resin having a phenylene skeleton, (B) a phenolaralkyl-type phenol resin having a biphenylene skeleton, and (D) an inorganic filler as the common essential components. The epoxy resin compositions are further characterized in that the inorganic filler (D) is contained in an amount of 84-92% by weight of the total epoxy resin composition.
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Description

technical field

[0001] The present invention relates to an epoxy resin composition for semiconductor sealing, and a semiconductor device using the epoxy resin composition. Background technique

[0002] Conventionally, electronic components such as diodes, transistors, and ICs (integrated circuits) have been mainly sealed with epoxy resin compositions. In particular, integrated circuits have adopted epoxy resins, phenolic resins, and epoxy resin compositions containing inorganic fillers such as fused silica and crystalline silica, which are excellent in heat resistance and moisture resistance. However, in recent years, in the market trend of miniaturization, light weight, and high performance of electronic equipment, the high integration of semiconductor elements has been continuously developed, and the surface mounting of semiconductor devices has also been continuously promoted. The requirements for epoxy resin compositions for sealing are becoming increasingly stringent. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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