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High heat conduction organosilicon filling and sealing gum

A technology of silicone potting compound with high thermal conductivity, which is applied in the field of potting compound to achieve excellent radiation resistance, lower crystallization temperature and glass transition temperature, and high bond strength

Inactive Publication Date: 2007-10-17
NANJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Through the search, it is also found that there is no silicone rubber product with excellent high and low temperature resistance and radiation resistance.

Method used

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  • High heat conduction organosilicon filling and sealing gum
  • High heat conduction organosilicon filling and sealing gum
  • High heat conduction organosilicon filling and sealing gum

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Weigh 120 parts of 30 μm silicon carbide, soak for 20 minutes in an alcoholic aqueous solution of 1% vinyltriethoxysilane, filter out the silicon carbide and dry it.

[0038] Get 3000 centipoise, 1.2% vinyl content, 100 parts of methyl phenyl vinyl silicone oil with 10% phenyl content, 55 parts of the above-mentioned processed silicon carbide, 15 parts of linear MQ resin with 2% vinyl content Parts, 11 parts of 270 centipoise terminal vinyl silicone oils, 5 parts of platinum catalysts are mixed uniformly at room temperature to obtain component A; get 3000 centipoise, vinyl content of 1.2%, and phenyl content of 10% methylbenzene 100 parts of base vinyl silicone oil, 65 parts of the above-mentioned treated silicon carbide, 10 parts of hydrogen-containing silicone oil curing agent, and 11 parts of 270 centipoise end vinyl silicone oil were mixed uniformly at room temperature to prepare component B. Mix component A and component B uniformly in a weight ratio of 1:1, cure a...

Embodiment 2

[0040] 120 parts of 30 μm alumina were weighed, soaked in an alcoholic aqueous solution of 1% vinyltriethoxysilane for 20 minutes, the alumina was filtered out and dried.

[0041]Get 3000 centipoise, 1.2% vinyl content, 100 parts of methyl phenyl vinyl silicone oil with 10% phenyl content, 55 parts of the above-mentioned treated alumina, 15 parts of linear MQ resin with 2% vinyl content Parts, 11 parts of 270 centipoise terminal vinyl silicone oils, 5 parts of platinum catalysts were mixed uniformly at room temperature to obtain component A; get 3000 centipoise, vinyl content of 1.2%, and phenyl content of 10% methylbenzene 100 parts of base vinyl silicone oil, 65 parts of the above-mentioned treated alumina, 10 parts of hydrogen-containing silicone oil curing agent, and 11 parts of 270 centipoise end vinyl silicone oil were uniformly mixed at room temperature to prepare component B. Mix component A and component B uniformly in a weight ratio of 1:1, cure at 25°C for 20 hours,...

Embodiment 3

[0043] Weigh 45 parts of 20 μm aluminum nitride and 45 parts of 30 μm aluminum oxide, soak them with 1% vinyltriethoxysilane alcohol aqueous solution for 20 minutes, filter out the aluminum nitride and aluminum oxide and dry them.

[0044] Get 5000 centipoise, 0.8% vinyl content, 100 parts of methyl phenyl vinyl silicone oil with 10% phenyl content, 20 parts each of the above-mentioned treated aluminum nitride and aluminum oxide, 2% vinyl content straight 15 parts of chain-type MQ resin, 11 parts of 270 centipoise terminal vinyl silicone oil, and 5 parts of platinum catalyst were mixed uniformly at room temperature to obtain component A; 100 parts of methyl phenyl vinyl silicone oil, 25 parts of each of the above-mentioned treated aluminum nitride and aluminum oxide, 10 parts of hydrogen-containing silicone oil curing agent, and 11 parts of 270 centipoise end vinyl silicone oil are mixed uniformly at room temperature to prepare Component B is obtained. Mix component A and com...

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Abstract

The invention discloses an organic silicon potting adhesive with a high heat conduction capacity. The curing time of the additive type organic silicon potting adhesive with a high heat conduction capacity can be controlled by the temperature and the amount of the catalyst. The condensate has good mechanical and electrical properties, especially outstanding cohesive strength, high and low temperature resistance and radiation resistance. The inventive heat-conducting organic silicon potting adhesive includes component A and B: said component A is mixed by following parts by weight: 100 shares of organic silica-base adhesive, 10-80 shares of heat-conducting filling, 3-20 shares of reinforced-filling, 1-10 shares of catalyst; said component A is mixed by following parts by weight: 100 shares of organic silica-base adhesive, 10-80 shares of heat-conducting filling, and 1-10 shares curing agent.

Description

technical field [0001] The invention relates to a potting glue, more specifically to a high thermal conductivity silicone potting glue. Background technique [0002] Addition room temperature vulcanizing silicone rubber refers to an elastomer with a three-dimensional network structure formed by a hydrosilylation reaction at room temperature under the action of a catalyst and a vinyl-containing polysiloxane (abbreviated as base rubber) and a crosslinking agent. Addition room temperature vulcanized silicone rubber does not produce by-products during the vulcanization process, has minimal shrinkage, is non-toxic, has excellent hydrolytic stability, good low compression set, low flammability, can be deeply vulcanized, and the vulcanization speed can be used at temperatures Control and other advantages, it is the material of choice for potting printed board assemblies. The primary problem of materials used in electronic potting is heat dissipation, which is extremely important f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/10C09J183/00
Inventor 王庭慰纪乐周玲娟
Owner NANJING UNIV OF TECH
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