Electrochemical copper removing solution

An electrochemical and copper-removing technology, applied in the chemical field, can solve problems such as long copper-removing time, low production efficiency, and short service life, and achieve the effects of convenient adjustment and regeneration, short copper-removing time, and high production efficiency

Active Publication Date: 2007-10-17
内蒙古第一机械集团股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Method 1) with Cr 6+ waste water, the problem that the country prohibits discharge; method 2), 3) although solve the problem of environmental protection discharge, but citric acid-NaNO 2 The service life is short, and the substrate is easy to be corroded a

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0009] Prepare 2000L of copper stripping solution, first add 1200L of water to the copper stripping tank, then add 200kg of sodium nitrite and 200kg of potassium nitrate in batches, stir while adding, add 400kg of ethylenediamine, 160kg of triethanolamine after complete dissolution, and add water Make up to 2000L and stir evenly. Copper stripping is carried out at room temperature, voltage 6V, current 3A / dm 2 . The copper stripping time is adjusted according to the thickness of the copper layer until it is completely stripped. Remove the unqualified copper plating layer and the protective copper plating layer of heat-treated parts, with high efficiency, clean removal, and no corrosion to the base metal.

Embodiment 2

[0011] To prepare 2000L of copper stripping solution, first add 1200L of water to the copper stripping tank, then add 100kg of sodium nitrite and 300kg of potassium nitrate in batches, stir while adding, add 200kg of ethylenediamine and 240kg of triethanolamine after complete dissolution, Make up to 2000L and stir evenly. Copper stripping is carried out at room temperature, voltage 4V, current 5A / dm 2 . The copper stripping time is adjusted according to the thickness of the copper layer until it is completely stripped. Remove the unqualified copper plating layer and the protective copper plating layer of heat-treated parts, with high efficiency, clean removal, and no corrosion to the base metal.

Embodiment 3

[0013] To prepare 2000L of copper stripping solution, first add 1200L of water to the copper stripping tank, then add 300kg of sodium nitrite and 100kg of potassium nitrate in batches, stir while adding, and add 600kg of ethylenediamine and 80kg of triethanolamine after they are completely dissolved. Make up to 2000L and stir evenly. Copper stripping is carried out at room temperature, voltage 10V, current 1A / dm 2 . The copper stripping time is adjusted according to the thickness of the copper layer until it is completely stripped. Remove the unqualified copper plating layer and the protective copper plating layer of heat-treated parts, with high efficiency, clean removal, and no corrosion to the base metal.

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PUM

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Abstract

The present invention relates to a solution for electrochemistry copper stripping, belongs to the chemical field, and is characterized in that said electrochemistry copper stripping solution contains a complexant of ethylene diamine of 100-300 g/L, a corrosion inhibitor of triethanolamine of 40-120 g/L and of erinitrit of 50-150 g/L, and an electrolyte of potassium nitrate of 50-150 g/L.The invention possesses the advantages that the discharging problem of Cr6+ containing waster water does not exist in the copper layer stripping by using said copper stripping solution, non-corroding on matrix metal occurs, the electrical current efficiency is high, the copper stripping time is shout, the productivity effect is high, and the adjustment and regeneration of the copper stripping solution is convenient.

Description

technical field [0001] The invention relates to a solution for electrochemical copper removal, which belongs to the field of chemistry. Background technique [0002] The removal of the copper plating layer can generally be divided into chemical methods and electrochemical methods. The chemical methods for removing the copper plating layer mainly include the following: 1) the method based on chromic anhydride; 2) sodium m-nitrobenzene sulfonate and NaCN-based and heating method; 3) concentrated HNO 3 method; 4) H 2 o 2 - Ammonium citrate method. Cr in these methods 6+ 、CN - , Harmful to human body, concentrated HNO 3 There is yellow smoke polluting the environment, and it is easy to corrode the substrate, while H 2 o 2 --The ammonium citrate method takes a long time to remove copper, the production efficiency is low, the solution stability is poor, and the cost is high. [0003] There are several electrochemical methods for removing the co...

Claims

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Application Information

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IPC IPC(8): C25F5/00
Inventor 孙宣杰石宝文
Owner 内蒙古第一机械集团股份有限公司
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