Composite pnenolic aldehyde foam heat-insulating board for building and forming method thereof

A phenolic foam, thermal insulation board technology, applied in thermal insulation, building components, chemical instruments and methods, etc., can solve problems such as poor toughness and easy powdering, and achieve the effect of improving fire resistance, no melting, and ensuring construction performance.

Inactive Publication Date: 2010-06-02
郎云峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a composite phenolic foam insulation board for construction and its molding method, to solve the technical problems of poor toughness and easy pulverization of traditional phenolic foam insulation boards; Tensile strength, the problem of ensuring the construction performance of the board

Method used

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  • Composite pnenolic aldehyde foam heat-insulating board for building and forming method thereof
  • Composite pnenolic aldehyde foam heat-insulating board for building and forming method thereof

Examples

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Embodiment Construction

[0052] Examples see figure 1 As shown, the composite phenolic foam insulation board for construction has an upper coating 2 on the upper surface of the phenolic foam insulation board 1 and a lower coating 3 on the lower surface of the phenolic foam insulation board.

[0053] There are raw materials according to the following mass ratio in the composite phenolic foam insulation board:

[0054] [1] 100 parts of foamable phenolic resin.

[0055] [2] Any value between 10 and 25 parts of polyurethane.

[0056] [3] Any value between 0.5 and 5 parts of epoxy resin; the above-mentioned epoxy resin is any one of GEBR-440A80, ​​GEBR-450A80 or GEBR-500A80 special resin for copper foil laminates.

[0057][4] Any value between 10 and 20 parts of the flame retardant; the above-mentioned flame retardant is one or more of tetrabromobisphenol A, chlorinated paraffin, antimony trioxide and flame retardant HT-102 in a mixture.

[0058] [5] Any value between 0.5 and 2 parts of surfactant; the...

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Abstract

The heat insulating composite foamed phenolic plate for building includes one heat insulating foamed phenolic plate produced with foamed phenolic resin 100 weight portions, polyurethane 10-25 weight portions, epoxy resin 0.5-5 weight portions, fire retardant 10-20 weight portions, surfactant 0.5-2 weight portions, polyglycol 5-15 weight portions, glass fiber 0.5-2 weight portions, foam homogenizing agent 5-10 weight portions, foaming agent 5-10 weight portions and acid curing agent 5-10 weight portions; and one sprayed layer in the surface of the heat insulating foamed phenolic plate and comprising cement 100-150 weight portions, water 80-100 weight portions, emulsion of acrylate copolymer 90-110 weight portions, hydroxyethyl cellulose 3-6 weight portions and defoaming agent 0.5-2 weight portions. The heat insulating composite foamed phenolic plate has high toughness, less pulverizing, high strength and good construction performance.

Description

(1) Technical field [0001] The invention relates to a thermal insulation board and a production method thereof, in particular to a phenolic foam thermal insulation board and a forming method thereof. (2) Background technology [0002] According to statistics, an important reason for modern fires at construction sites is that the welding slag splashed by electric welders during construction causes the burning of insulation materials, and most of the fire casualties are caused by the dense smoke and poisonous gas produced by the fire. Among the EPS, XPS polystyrene foam, glass wool, mineral wool and polyurethane insulation boards currently on the market, only phenolic resin has the properties of flame retardant, low toxicity and low smoke. The thermal effect is also 2 to 3 times higher than that of ordinary roofing materials. After installing phenolic foam insulation boards on the outer walls and roofs, the heat insulation performance of the house is greatly enhanced, and the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/42C08J5/18C08J9/12C08J7/04C08L61/06C08K7/14E04B1/80C08L75/04C08L63/00C08L71/08C08K3/22
CPCY02B80/12Y02A30/242Y02B80/10
Inventor 周长喜王世昌魏培哲
Owner 郎云峰
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