Composite pnenolic aldehyde foam heat-insulating board for building and forming method thereof
A phenolic foam, thermal insulation board technology, applied in thermal insulation, building components, chemical instruments and methods, etc., can solve problems such as poor toughness and easy powdering, and achieve the effect of improving fire resistance, no melting, and ensuring construction performance.
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[0052] Examples see figure 1 As shown, the composite phenolic foam insulation board for construction has an upper coating 2 on the upper surface of the phenolic foam insulation board 1 and a lower coating 3 on the lower surface of the phenolic foam insulation board.
[0053] There are raw materials according to the following mass ratio in the composite phenolic foam insulation board:
[0054] [1] 100 parts of foamable phenolic resin.
[0055] [2] Any value between 10 and 25 parts of polyurethane.
[0056] [3] Any value between 0.5 and 5 parts of epoxy resin; the above-mentioned epoxy resin is any one of GEBR-440A80, GEBR-450A80 or GEBR-500A80 special resin for copper foil laminates.
[0057][4] Any value between 10 and 20 parts of the flame retardant; the above-mentioned flame retardant is one or more of tetrabromobisphenol A, chlorinated paraffin, antimony trioxide and flame retardant HT-102 in a mixture.
[0058] [5] Any value between 0.5 and 2 parts of surfactant; the...
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