Dimension reduction low profile rear cavity line polarization antenna

A low-profile, linearly polarized technology, applied in the microwave field, can solve the problems of high processing cost and large volume, and achieve the effects of reduced production cost, reduced size, and reduced size

Inactive Publication Date: 2008-04-30
舟山乐讯智能科技有限公司
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  • Abstract
  • Description
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Problems solved by technology

However, the traditional back cavity is composed of a smooth me

Method used

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  • Dimension reduction low profile rear cavity line polarization antenna
  • Dimension reduction low profile rear cavity line polarization antenna
  • Dimension reduction low profile rear cavity line polarization antenna

Examples

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[0021] As shown in Figures 1 and 2, the reduced-profile low-profile cavity-backed linear polarization antenna includes a Rogers 5880 dielectric substrate 1 with a thickness of 0.5 mm. The dielectric substrate 1 is plated with metal layers on both sides, which are the upper metal layer 6 and the lower metal layer. Layer 7, in which the lower metal layer 7 serves as a ground layer. As shown in Figure 3, the upper metal layer 6 is etched with a microstrip line 2 for power feeding and a coplanar waveguide transmission line 3 (the dashed frame includes the part). The coplanar waveguide transmission line 3 is a coplanar coplanar waveguide structure with the metal strip in the middle. Extend outside, as microstrip line 2. The length and width of the microstrip line 2 are 4 mm and 1.45 mm, respectively, and the two air gaps of the coplanar waveguide transmission line 3 are both 0.7 mm in width and 1.5 mm in length. A through hole with a diameter of 1 mm is opened through the upper metal l...

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Abstract

The present invention relates to a reduced size low profile cavity backed linearly polarized antenna. The performance of a single radiating element of a traditional linearly polarized antenna is low and the volume is large. In the present invention, a metal layer is plated on both sides of the dielectric substrate, and the upper metal layer is etched with a microstrip line for power feeding and a common ground coplanar waveguide transmission line, and the middle metal strip of the coplanar waveguide transmission line extends outwards as a microstrip line . Through the upper metal layer, the dielectric substrate and the lower metal layer, a plurality of metallized through holes arranged in a rectangle form a cavity, and the coplanar waveguide transmission line extends into the cavity. The lower metal layer is etched with a strip-shaped radiation slit with a wide side parallel to the wide side of the cavity and close to the wide side of the non-feeding end of the cavity in the region corresponding to the cavity. The invention adopts common PCB technology to produce, the production cost is significantly reduced, and the seamless integration with the microstrip circuit can be realized, and the integration degree of the system is improved. Compared with traditional cavity-backed antennas that require precise machining, the manufacturing speed is fast and the cost is low.

Description

technical field [0001] The invention belongs to the field of microwave technology, and relates to a low-profile cavity-backed linearly polarized antenna with reduced size based on substrate integrated waveguide technology, which can be used as a radio frequency transceiver front-end antenna, and is widely used in mobile communications, satellite communications, radar and other wireless antennas. Communication systems are especially suitable for applications where the received signal is weak and a high-gain antenna is required. Background technique [0002] As a key component of a communication system, antennas are widely used in wireless communication occasions. The performance of the antenna directly determines the performance of the entire system. A high-performance antenna can not only significantly improve the performance of the system and obtain a good reception effect, but also greatly relieve the index pressure of the subsequent RF circuit and reduce the cost of the ...

Claims

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Application Information

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IPC IPC(8): H01Q1/38H01Q13/10H01Q13/06
Inventor 罗国清孙玲玲
Owner 舟山乐讯智能科技有限公司
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