Method for realizing microstructure on pyrolytic graphite chip

Abstract

The invention discloses a micro-structural realization method on pyrolytic graphite substrate, belonging to a micro electromechanical technical field, the method adopts pyrolytic graphite as the substrate, and then performs the leveling, cleaning, insulating and re-cleaning of the substrate; the back of the pyrolytic graphite substrate is arranged with lithography alignment marks, multi-layer structure or high aspect ratio structure is formed by overlay; the front of the pyrolytic graphite substrate is sprayed with metallic film as seed layer, positive photoresist, lithography and develop are performed, and then electroplating mold is made so as to form an electroplating structural layer, after performing the positive photoresist, lithography and developing twice, positive photoresist is removed, ultrasonic cleaning is performed, and alumina is sprayed, and then the substrate is ground and is cleaned; the alumina is sprayed with the metallic film as the seed layer, and the seed layer is spread with SU8 negative photoresist, after performing the lithography, developing and electroplating, the SU8 negative photoresist is removed and the alumina is removed, so that the high aspect ratio structure is made on the pyrolytic graphite substrate. The invention has novel substrate materials and special processing performance.

Description

technical field [0001] The invention relates to a method in the field of micro-electromechanical technology, in particular to a method for realizing a microstructure on a pyrolytic graphite substrate. Background technique [0002] MEMS is developed with the development of semiconductor integrated circuit microfabrication technology and ultra-precision machining technology. Therefore, in the past few decades, research on the fabrication of micromechanical structures on silicon substrates has been carried out. However, due to the wide variety of MEMS devices and most of them have movable microstructures, it puts forward new requirements in design, materials, processing, system integration, packaging and testing technologies. In this respect, MEMS itself is different from IC. Features, in terms of materials and processing methods, the most typical is non-silicon MEMS, especially the processing of microstructures on glass substrates. The emergence of these non-silicon substrate...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for realizing the microstructure on the pyrolytic graphite substrate for the deficiencies and defects of the prior art, so as to solve the problem of the application possibility of the excellent diamagnetic properties of pyrolytic graphite in the microstructure. In the existing micro-electro-mechanical systems, it is usually only used to fabricate microstructures on common substrates such as silicon or glass. In order to realize the use of pyrolytic graphite’s special and strong antimagnetic properties for device fabrication, it provides support for micro-fabrication methods. The substrate material is novel, and the processing device has the advantages of special performance, etc.

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