PVD nano multiple-layer coating for cutting stainless steel and preparation method thereof
A nano-multilayer, stainless steel technology
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Embodiment 1
[0023] Stainless steel (1Cr18Ni9Ti) is cut after depositing the common TiAlN coating and the nanometer multi-layer coating of the present invention respectively with the cemented carbide blade whose grade is YG8 and model CNMG120408.
[0024] Referring to Figure 1, the specific manufacturing process is as follows:
[0025] (A), cleaning the surface of the cemented carbide substrate 7;
[0026] (A'): Depositing a metal Ti layer 6 with a thickness of 20-30 nm and a transition layer 5 of 20-40 nm TiN on the treated cemented carbide substrate 7;
[0027] (B), using 1 Ti target, 2 Ti x al 1-x Target and 1 piece of Ti y al 1-y target. During multi-target reactive magnetron sputtering, the placement positions of the four working targets are: Ti target and Ti target y al 1-y The targets are respectively placed in positions 8 and 10 of the vacuum chamber, and two Ti x al 1-x The targets are respectively placed in positions 9 and 11 of the vacuum chamber, and the vacuum degree ...
Embodiment 2
[0032] Stainless steel (1Cr18Ni9Ti) was milled after depositing common TiAlN coating and nanometer multi-layer coating of the present invention respectively with grade YG10 and model SEET12T3 cemented carbide inserts.
[0033] Referring to Figure 1, the specific manufacturing process is as follows:
[0034] (A), cleaning the surface of the cemented carbide substrate 7;
[0035] (A'): Depositing a metal Ti layer 6 with a thickness of 20-30 nm and a transition layer 5 of 20-40 nm TiN on the treated cemented carbide substrate 7;
[0036] (B), using 1 Ti target, 2 Ti x al 1-x Target and 1 piece of Ti y al 1-y target. During multi-target reactive magnetron sputtering, the placement positions of the four working targets are: Ti target and Ti target y al 1-y The targets are respectively placed in positions 8 and 10 of the vacuum chamber, and two Ti x al 1-x The targets are respectively placed in positions 9 and 11 of the vacuum chamber, and the vacuum degree of the vacuum ch...
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