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Edge exposure device

A technology of edge exposure and light source, applied in the field of optical lighting, can solve the problems of increasing difficulty and achieve the effect of reducing difficulty

Active Publication Date: 2008-07-09
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the design of this optical structure can ensure the light intensity of the illuminated spot, it cannot take into account the uniformity of illumination, the size of the illuminated spot, and the distortion of the field of view of the illumination, and must be controlled by other methods, thus increasing the follow-up design difficulty

Method used

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Embodiment Construction

[0028] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0029] Fig. 1 is a schematic structural view of the edge exposure device of the present invention, the edge exposure device 20 is composed of an exposure light source 21, an illumination optical fiber 22, an illumination optical system 23, an illumination optical system mounting bracket 24, a silicon wafer 25, a rotating platform 26 and a master control unit 29 .

[0030] Above-mentioned exposure light source 21 is the mercury lamp light source that can send ultraviolet band, is used to provide the illumination light source of silicon chip edge exposure; The numerical aperture is greater than 0.35), so that the illumination optical system 23 is far away from the exposure light source 21, so as to prevent the heat emitted by the exposure light source 21 from affecting the optical performance of the illumination optical system 23; Uniformly d...

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Abstract

The invention discloses an edge exposure device. An illumination system thereof can provide higher illumination brightness for a whole illumination viewing field and satisfy the requirement that lighting objects are uniformly illuminated since a numerical aperture of a designed illumination optical fiber is comparatively big. In addition, the illumination system can guarantee that when an illumination light spot on a silicon wafer edge is located in a maximum viewing field, aberration thereof is less than 0.01%, and focal depth of an image surface is within plus and minus 0.4 millimeter; and that uneven silicon wafer edges or the silicon wafer edges with different thicknesses receive uniform illumination; thus the illumination optical system presents comparatively high process adaptability and reduces the difficulty of the following design.

Description

technical field [0001] The present invention relates to optical lighting technology, in particular to optical lighting technology for photolithography equipment. Background technique [0002] Electroplating is one of the most important processes for post-packaging of IC circuits. It uses the edge of the silicon chip as the anode, and the electroplating window in the middle of the silicon chip as the cathode, and then adds a certain DC working voltage between the cathode and anode. The concentration of the plating solution in the tank is used to control the height of the metal bump. Since the photoresist is not conductive, the photoresist on the edge of the silicon wafer needs to be removed before the electroplating process, and the size of the edge removal depends on the edge removal width of the previous WEE (Wafer Edge Exclusion) process. There are many traditional silicon wafer edge removal methods, but in general there are two categories: chemical edge removal method an...

Claims

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Application Information

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IPC IPC(8): G03F7/20
Inventor 吕晓薇徐兵
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD