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Resin composition and semi-solidifying sheet for printed board prepared from the same

A resin composition and composition technology, applied in the direction of printed circuit components, circuit substrate materials, etc., can solve the problems of flame retardancy and poor wettability, and achieve good wettability, low fluidity, and high bonding strength Effect

Active Publication Date: 2010-07-14
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to develop a new type of non-flowing resin composition and the non-flowing prepreg made of it in view of the deficiencies in the prior art, which not only solves the problems of flame retardancy and poor wettability of current such products And other shortcomings, and improve the heat resistance and peel strength of the product, thereby improving the reliability of making steel-flexible and special steel structure printed circuit boards

Method used

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  • Resin composition and semi-solidifying sheet for printed board prepared from the same
  • Resin composition and semi-solidifying sheet for printed board prepared from the same
  • Resin composition and semi-solidifying sheet for printed board prepared from the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] 1. Preparation of epoxy resin composition: first select brominated epoxy resin, tetrabromobisphenol A diglycidyl ether, UV blocking type four-functional epoxy resin, liquid bisphenol A diglycidyl ether respectively, and use 8:4 : 4: 4 solid weight ratio was added sequentially, and then stirred for 30 minutes to obtain the epoxy resin composition.

[0047] 2. Mix the solvent dimethylformamide and the solvent methyl ethyl ketone at a ratio of 1:1, then dissolve 3 parts of the curing agent dicyandiamide and 1 part of the accelerator 2-methylimidazole, stir for more than 60 minutes, and then add 20 parts Epoxy thinner, stir for 10 minutes or more.

[0048] 3. Add the phenolic resin and the epoxy resin composition sequentially at a solid weight ratio of 70:20, stir for more than 4 hours, and mix well to form a solution with a solid content of 50%.

[0049] Immerse the above solution in 1080 glass fiber cloth for 1 to 3 minutes, put it into a 170°C oven and bake for 5 to 7 m...

Embodiment 2

[0051] Except changing the proportion of each component and the proportion of curing agent and accelerator in the epoxy resin composition used in Example 1, the same method as in Example 1 was used to manufacture a non-flowing prepreg.

[0052] 1. Preparation of epoxy resin composition: first select brominated epoxy resin, tetrabromobisphenol A diglycidyl ether, UV blocking type four-functional epoxy resin, liquid bisphenol A diglycidyl ether respectively, and use 18:6 : 2: 4 solid weight ratio was added sequentially, and then stirred for 30 minutes to obtain the epoxy resin composition.

[0053] 2. Mix dimethylformamide and butanone at 1:1, then dissolve 3 parts of curing agent dicyandiamide and 1 part of accelerator 2-methylimidazole, stir for more than 60 minutes, and then add 10 parts of epoxy Diluent, stir for 10 minutes or more.

[0054] 3. Add the phenolic resin and the epoxy resin composition in sequence at a solid weight ratio of 55:30, stir for more than 4 hours, an...

Embodiment 3

[0057] Except changing the ratio of each component and the ratio of curing agent and accelerator in the epoxy resin composition used in the above-mentioned embodiment, the same method as in Example 1 was used to manufacture a non-flowing prepreg.

[0058] 1. Preparation of epoxy resin composition: respectively select brominated epoxy resin, tetrabromobisphenol A diglycidyl ether, UV blocking type four-functional epoxy resin, liquid bisphenol A diglycidyl ether, with 30:24: 3:3 solid weight ratio was added sequentially, and then stirred for 30 minutes to obtain the epoxy resin composition.

[0059] 2. First mix dimethylformamide and butanone at 1:1, then dissolve 3 parts of curing agent dicyandiamide and 1 part of accelerator 2-methylimidazole, stir for more than 60 minutes, and then add 2 parts of cyclic Oxygen diluent, stir for more than 10 minutes.

[0060] 3. Add the phenolic resin and the epoxy resin composition sequentially at a solid weight ratio of 30:60, stir for more...

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Abstract

The invention belongs to a material used for preparing printed circuit board, more specifically a resin combination and a prepreg used for preparing the printed circuit board. The resin combination uses phenoxy resin, epoxy resin composition, epoxy thinner, amine curing agent, imidazole enhancer and solvent as materials and is prepared in accordance with a certain weight, then the resin combination solution is immersed in glass fiber cloth to make the prepreg. Non-flowing character and the wetting quality of the glass fiber cloth are improved because of the excellent formula of the resin combination, thereby the prepreg used for the printed circuit board has a better non-flowing character, and moisturizing capability, heat resistance, flame retardant, high connectivity with copper foil, and provides high performance material for the printed circuit board product which has a special structure and flexibility-combines with steel.

Description

Technical field: [0001] The invention belongs to materials for preparing printed circuit boards, and more specifically refers to a resin composition and a prepreg for printed circuit boards prepared by using the resin composition. Background technique: [0002] Prepregs for printed circuit boards, due to the special composition of the resin composition coated on the prepreg, compared with ordinary FR-4 adhesive sheets and their resin compositions, it is required that the resin composition does not flow or has very little under high temperature and high pressure. Flow, good adhesion, heat resistance, etc., suitable for connecting materials between rigid printed circuit boards and flexible printed circuit boards, so it is widely used in rigid-flexible printed circuit boards (PCBs) ) production, this prepreg coated with non-flowing and low-flowing resin composition solutions is called a non-flowing prepreg, and most of the coating layers of non-flowing prepregs so far use rubbe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/10C08K5/3445H05K1/03C08L63/00
Inventor 杨中强刘东亮陈振文
Owner GUANGDONG SHENGYI SCI TECH