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Positive photosensitive resin composition

A technology of photosensitive resin and composition, applied in photosensitive material processing, optics, photomechanical equipment, etc., can solve the problems of low sensitivity, longer exposure time, and increased number of steppers, etc., and achieve the effect of high sensitivity

Active Publication Date: 2008-10-01
HEFEI HANZHIHE MATERIAL SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The stepper is a very expensive machine. Therefore, if the photosensitive resin composition has a low sensitivity, the exposure time required to form a relief pattern becomes longer, and the number of necessary steppers increases, resulting in an increase in the cost of the exposure process.

Method used

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  • Positive photosensitive resin composition
  • Positive photosensitive resin composition
  • Positive photosensitive resin composition

Examples

Experimental program
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specific example

[0067] Specific examples include 3,5-diamino-1-hydroxybenzene, 4,6-diamino-1,3-dihydroxybenzene, 3,3'-dihydroxy-4,4'-diaminobiphenyl, 4, 4'-dihydroxy-3,3'-diaminobiphenyl, 3,4-dihydroxy-3',4'-diaminobiphenyl, 2,2-bis(4-amino-3-hydroxyphenyl) Propane, bis(3-amino-4-hydroxyphenyl)sulfide, bis(3-amino-4-hydroxyphenyl)sulfone, bis(3-amino-4-hydroxyphenyl)methane, bis(4-amino-3 -Hydroxyphenyl)methane, 2,2-bis(4-amino-3-hydroxyphenyl)hexafluoropropane, 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, 2-( 3-Hydroxy-4-aminophenyl)-2-(3-amino-4-hydroxyphenyl)hexafluoropropane, bis(3-amino-4-hydroxyphenyl)sulfone and bis(4-amino-3- hydroxyphenyl) sulfone. These phenolic diamines can be used individually or in combination of 2 or more types. Among the above-mentioned phenolic diamines, 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, 3, 3'-dihydroxy-4,4'-diaminobiphenyl and bis(3-amino-4hydroxyphenyl)sulfone.

[0068] A particularly preferable example of the polycondensate A use...

Embodiment

[0148] Examples according to the embodiment of the present invention are explained in more detail by the following Reference Examples, Examples and Comparative Examples.

[0149] (Manufacture of polymer solution)

reference example 1

[0151] A detachable glass four-neck flask equipped with a stainless steel anchor stirrer is equipped with a Dean-Stark water trap and a nitrogen gas inlet pipe. Heat and stir in a silicone oil bath.

[0152] Add 26.66g (60mmol) 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (hereinafter referred to as "6FDA"), 10.8g (50mmol) 3,3'-dicarboxy-4,4 '-Diaminobiphenyl (hereinafter referred to as "HO-AB"), 0.6g (6mmol) γ-valerolactone, 1.8g (18mmol) pyridine, 150g N-methylpyrrolidone (hereinafter referred to as "NMP"), 30g toluene , the resulting mixture was heated and stirred at 180 rpm at a silicone oil bath temperature of 180° C. for 1 hour and 40 minutes while blowing nitrogen gas. During the reaction, distilled components of toluene and water (25 g of toluene, 3 g of water) were removed. A part of this solution was diluted with NMP, and the molecular weight of the polycondensate was measured by gel permeation chromatography (manufactured by Tosoh Corporation, TSK gel...

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Abstract

A photosensitive resin composition comprising 100 parts by mass of polycondensate (A) having a structure resulting from dehydration condensation between one or two or more tetracarboxylic acid dianhydride and one or two or more aromatic diamines having mutually ortho-positioned amino and phenolic hydroxyl groups and 1 to 100 parts by mass of photosensitive diazonaphthoquinone compound (B), wherein the polycondensate (A) has a weight average molecular weight of 3000 to 70,000.

Description

technical field [0001] The present invention relates to a positive photosensitive resin composition useful for forming insulating materials for electronic parts and display elements and passivation films, buffer coat films and interlayer insulating films in semiconductor devices Embossed patterns of heat-resistant resin materials such as Background technique [0002] It is widely known that a polyimide resin having excellent heat resistance, electrical properties, and mechanical properties is suitable for use as a surface protection film or an interlayer insulating film of a semiconductor device. The polyimide resin used for this purpose is normally supplied as a photosensitive polyimide precursor composition, and this is applied to a board|substrate, such as a silicon wafer. A heat-resistant resin coating film having a fine relief pattern can be easily formed on this substrate by sequentially performing pattern exposure, development, and thermal imidization treatment with ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/023G03F7/022G03F7/40H01L21/027
CPCG03F7/0233G03F7/022G03F7/40G03F7/004G03F7/0045G03F7/039G03F7/0392G03F7/0397
Inventor 金田隆行花畑博之金行洲胁周三
Owner HEFEI HANZHIHE MATERIAL SCI & TECH CO LTD
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